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Miniaturisation et fiabilité des interconnexions copper pillar sur desassemblages de type « System In Package » (sip) pour le domaine aéronautique

Abstract : The thesis is opening towards new technical solutions. The aim of this study is twofold, the first is tominiaturize the electronics to achieve a factor of 10 in integration compared to a conventional CMStechnology, the second is to improve the system in package reliability for aeronautics, defense and space.The first step concerns the manufacture of an assembly composed by a silicon chip and an organicsubstrate. These two entities will allow the study of the report by flip chip. To do so, micro-pillar type copperand tin-silver solder connections, otherwise known as copper pillar, will be used. The impact of differentdesign and assembly parameters on thermal cycles reliability will be studied.In a second step, finite element simulations are carried out on the assemblies in order to obtainpredictions on the reliability during thermal cycles using as a criterion the viscoplastic energy. Thesimulations and the experimental results will eventually be compared, and the gaps will be discussed.Failures analysis during thermal cycles will be based on the analysis of copper pillar interconnectionsby micro-sections and SEM and EBSD imaging. Thickness changing in intermetallic, cracking in the solder aswell as grain size and recrystallization phenomena will be presented and commented.The final objectives of this work are, from an academic point of view, to highlight first of all, theC2 - Restrictedbehaviors involved in the reliability of such interconnections in a binding thermo-mechanical environment,and moreover, the failure mechanisms. Then, it is to establish a predict life model that is representative ofthe experimental results obtained. Finally, it will define design rules that can then be used at Safran for therealization of SIP.
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Submitted on : Tuesday, September 29, 2020 - 11:44:17 AM
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Adrien Morard. Miniaturisation et fiabilité des interconnexions copper pillar sur desassemblages de type « System In Package » (sip) pour le domaine aéronautique. Micro et nanotechnologies/Microélectronique. Université Grenoble Alpes, 2019. Français. ⟨NNT : 2019GREAT068⟩. ⟨tel-02952209⟩

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