, Table des propriétés : propriétés à vérifier de la plaquette, système de métrologie associé, étapes de production contrôlées, nombre de machines de production contrôlées, difficulté à qualifier les machines de métrologie pour effectuer la mesure

, Temps et politiques d'échantillonnage : temps moyens de mesure et de file d'attente pour chaque atelier de métrologie, nombre d'opérations de métrologie précédentes exécutées et politiques d'échantillonnage actuelles

, Identification des propriétés du système de métrologie

, Analyse du lien entre le groupe de machines de production et les machines de métrologie

, Vérification de l'écart possible à améliorer et sélection des indicateurs de performance clés

, Identification de la stratégie d'échantillonnage actuelle, analyse de la mise en oeuvre d'une nouvelle stratégie d'échantillonnage et calcul de nouveaux taux d'échantillonnage

?. Apc, Advanced Process Control): Set of techniques used for controlling machines and processes: SPC, FDC, R2R and VM

. ?-cycle-time, Time spent by a lot in a workshop or in the entire fab

?. Die, Individual chip cut from a silicon wafer

. Dispatching, The way that lots are sent to the next route step, it involves the decision of selecting a given process machine or metrology tool among a group of candidates

?. Excursion, Out of control specification on a process or machine

?. Fab, Semiconductor fabrication plant, where integrated circuits are manufactured

?. Fifo:-first-in,

?. Fdc, Fault Detection and Classification technique): Technique which consists in statistically monitoring process variations by analyzing process machine parameters

?. Ic, Integrated circuit): Collection of electronic circuits built on a single piece of silicon substrate

?. Lifo, Last-In, First-Out, i.e. the last lot arriving in a area is the first one to leave. ? Lot: Group of wafers

. ?-measurable-lot, A lot that belongs to a product which recipe exists in the metrology tool and thus can be measured

?. Metrology, Science of measurement, and the term is related to control operations performed by metrology tools to gather specific properties of wafers

?. Qualification, Possibility for a metrology tool to measure a given lot by registering on it the recipe for measuring the product of the lot

. ?-queue-time, Time spent by a lot between the process operation finishes and the measure operation starts

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