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Contribution à la conception et mise en oeuvre de structures de packaging pour la montée en tension des modules de puissance : contraintes sur les isolants

Abstract : The power electronics is at the beginning of a major evolution by the introduction of new power components semiconductor 'wide bandgap' in the systems. Indeed, the evolution of silicon carbide (SIC) technology allows to develop small chips, which can operate at a higher switching frequency, and support higher voltages than current one, limited during several decades by the physical properties of silicon. Therefore, the introduction of these components must be adapted to their environment in order to take into account these new performances. From an electrical point of view, the stresses imposed on insulating materials are close to their limits, particularly in the packaging configurations currently used in the power modules. The aim of this thesis is to propose an original solution allowing to integrate the 15 KV components currently in development phase, in a structure such as power module. After studying some packaging solutions, the study focused on a particular area, called the triple point between the metallization, the substrate and the encapsulation materials. We propose, from simulations by the finite element method analysis, a new geometry for the metallized ceramic substrate able to reduce the electric field intensity at the triple point. The structure modification consists in the creation of a gap in the substrate at the edge of the metallization. This new geometric structure has shown by simulation a significant reduction of the electric field intensity at the triple point thanks to a better spreading of the equipotential lines. After reviewing several technical manufacturing, ultrasonic machining was selected, this process is particularly efficient for hard and brittle materials such as ceramics and provides an etching profile with an excellent alignment to the edge of the metallization with the ceramic. Experimental results based on samples tests made it possible to carry out tests showing interesting and encouraging results in terms of partial discharges and resistance to dielectric strength. Thanks to the simulation under FEM analysis and after first experimental results, the new geometric structure for the metallized ceramic substrate proposed for the high voltage power modules, seems to be a technologically integrable solution for the optimization of the packaging for the purpose of the voltage rise in module. Moreover, the interest of the proposed solution compared with other published strategies, such as the use of innovative encapsulation materials was discussed, as well as the advantage offered of being able to combine the strengths of two types of approaches.
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Hélène Hourdequin. Contribution à la conception et mise en oeuvre de structures de packaging pour la montée en tension des modules de puissance : contraintes sur les isolants. Electronique. Université Paul Sabatier - Toulouse III, 2018. Français. ⟨NNT : 2018TOU30357⟩. ⟨tel-02508007⟩

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