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Développement de films minces à base de nanoparticules diélectriques et optimisatisation des conditions de dépôt pour fabriquer des condensateurs de découplage utilisés dans des assemblages à haute densité de modules électroniques

Abstract : Within the three-dimensional (3D) integration associated with the use of an increasing amount of integrated circuits (ICs), there is strong need of high capacitance density (≥ 1 μF.cm-2) decoupling capacitors, able to operate on large frequency bandwidth, in order to reduce the noise that can comprise the signal integrity in ICs. The main challenge of these capacitors relies on the deposition of thin films (≤ 100 nm) using innovative materials with high relative permittivity (ε_r > 200 à 1 GHz) and «low cost» technologies compatible with large scale integration.The proposed approach in this thesis benefits in one hand on the possibility of synthetizing and using Ba0.6Sr0.4TiO3 (BST) nanoparticles (Ø = 16 ± 2 nm, ε_r = 260 at1 kHz) – using the supercritical fluids technology – as dielectric material and on the other hand, on the use of spray coating as technique for the integration of these materials as thin films. First of all, the BST nanoparticles were synthesized and functionalized with specific ligands (3-aminopropylphosphonic acid, APA), in order to obtain colloidal suspensions composed by aggregates with size (Ø < 100 nm) showing few fluctuations during 2 months. The grafted ligands also improved the adhesion of the deposited films (self-assembling) on the copper (Cu) substrate. The variation of different parameters related to the solution (concentration, mechanical dispersion duration) and the deposition technique (substrate temperature, flow rate), helped to define the optimal conditions leading to uniform films based on functionalized nanoparticles (BST-APA). Thin films of 200 ± 50 nm thickness were obtained. After deposition of aluminum pads (Al) on BST-APA films and used as top electrode, the capacitance-tension (C-V) and current-tension (I-V) characteristics of capacitors with Al/BST-APA/Cu structure enabled us to extract a high capacitance density (~ 0.7 μF.cm-2) and a leakage current (~ 25 μA.cm-2) at 1 V. The obtained results of this thesis show that the spray coating is an alternative to the processes (related to a high cost) reported in the state of the art, for the fabrication of capacitors associated with high electrical performances.
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Emmanuel Tetsi. Développement de films minces à base de nanoparticules diélectriques et optimisatisation des conditions de dépôt pour fabriquer des condensateurs de découplage utilisés dans des assemblages à haute densité de modules électroniques. Electronique. Université de Bordeaux, 2019. Français. ⟨NNT : 2019BORD0113⟩. ⟨tel-02500602⟩

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