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Theses

Fiabilité des composants enfouis dans les circuits imprimés

Abstract : The desire for miniaturization of electronic circuits led the electronics to develop new methods of assembly. Progress is made through the complexification of functions, the development of new interconnections linking the circuit to the component or by the choice of architecture, an optimization of the volume. After pushing the limits of optimization with the three-dimensional assemblies, the technology turned to a volume present in all the electronic cards but which plays no active part in this one: the support of the functions, the PCB. The solution provided is to embed component in this volume. The first benefits of this solution appear quickly: volume gain and protection of components, which is why it is developing rapidly in the industry.Based on this premise, Valeo wants to adapt this technology to reduce the size of a rearview camera dedicated to the automobile. As automotive requirements are stricter than in other industries, further investigation of embedded technology is required. The objective is to validate the reliability and robustness of the circuit according to a manufacturing method. Thus, the IMS Bordeaux integrates the EDDEMA project to provide expertise, via finite element thermomechanical simulations, on the design of the circuit.As part of this thesis and to meet the expectations of the project, two studies are investigated. A general methodology is proposed to define the interconnections considered the most fragile in the context of the use of embedded technology and justify the use of finite element simulations according to the expected requirements. The objective is to determine the lifetime of an interconnection linking the component to the circuit according to its nature (solder, via, ...) and the characteristics of the component and the circuit (dimensions, height, ...) and validate the choices. such as materials or techniques made from the time of manufacture. This study is part of a local search around the component. The second study focuses on the circuit developed in the project. The impact of the position of the active components embedded in the PCB on the circuit (deformation, constraints) and the representation of the passive components in this structure will be studied to define, according to the thermomechanical considerations, the positioning limits in the circuit design. . To refine the model will pass by measurements realized on the first prototypes to corroborate the realized simulations.All this leads to determining the advantages on the embedded technology and the gain in terms of reliability and robustness of the circuit and components and validating its use in the automotive sector.
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Submitted on : Thursday, November 28, 2019 - 11:06:06 AM
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  • HAL Id : tel-02384102, version 1

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Mickael Balmont. Fiabilité des composants enfouis dans les circuits imprimés. Electronique. Université de Bordeaux, 2019. Français. ⟨NNT : 2019BORD0229⟩. ⟨tel-02384102⟩

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