Intégration dans un substrat PCB de composants à semi-conducteur grand gap pour le développement d’un convertisseur d’électronique de puissance à forte densité

Abstract : The emerging wide bandgap (WBG) semiconductor devices have been developed for power conversion applications instead of silicon devices due to higher switching frequencies (from few 100 kHz to several MHz) and lower on-state losses resulting in a better efficiency. In order to take full advantage of the WBG components, PCB technology is attractive for high power density integration thanks to its flexibility and low cost. However, due to poor thermal conductivity of the commonly used material Flame Retardant-4 (FR4), efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrates. So it is of the first importance to seek technological means in order to improve the thermal performances. In this thesis, three main thermal management solutions for PCB structures have been investigated including thermal vias, thick copper thickness on the PCB substrate as well as thermoelectric cooling (TEC) devices. Our studies are based on the electro-thermal modeling and 3D finite element (FE) methods. Firstly, optimization of the thermal via parameters (via diameter, via plating thickness, via-cluster surface, via pattern, pitch distance between vias etc.) has been realized to improve their cooingperformances. We presented and evaluated thermal performances of the PCB structures by analyzing the thermal resistance of the PCB substrate with different thermal vias. Secondly, it is found that thermal performances of the PCB structures can be enhanced by using thick copper thickness on top of the PCB substrate, which increases the lateral heat flux along the copper layer. Influences of the copper thickness (35 µm to 500 µm) has been discussed. This solution is easy to realize and can be combined with other cooling solutions. Thirdly, thermoelectric cooler like Peltier device is a solid-state cooling technology that can meet the local cooling requirements. Influences of Peltier parameters (Thermoelectric material properties, number of Peltier elements, distance between the heating source and the Peltier devices etc.) have been identified. All these analyses demonstrate the potential application of Peltier devices placed beside the heating source for PCB structures, which is a benefit for developing the embedding technology in such structures.
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Shuangfeng Zhang. Intégration dans un substrat PCB de composants à semi-conducteur grand gap pour le développement d’un convertisseur d’électronique de puissance à forte densité. Electronics. Université Paris-Saclay, 2018. English. ⟨NNT : 2018SACLS398⟩. ⟨tel-02275807⟩

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