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L'impression 3D polymère appliquée au packaging en microélectronique

Abstract : In order to answer to industrial requirements and to withstand environment and functioning stresses, electronic components have to be packaged. State of the art of packaging technologies, such as lid sealing, brazing and molding, usually presents shape limitations, material issues and significant cost impact. Moreover, those technics have to be specified at the beginning of the product design in order to fit with the whole package and assembly processes, without decreasing the device performances.A new approach used to build a specific packaging allowing flexibility, simplicity and cost competitiveness is presented. Using the polymer additive manufacturing, more usually known as 3D printing, we propose to build customized structures and packages perfectly fitting with component dimensions and specifications. This approach simplifies the packaging process by merging the steps of package manufacturing, die encapsulation onto its substrate, and sealing. Moreover, it permits to easily package and encapsulate components off-the-shelf.In order to validate the feasibility of direct packaging by additive manufacturing, this study focused on a main objective: to understand the physical and chemical adhesion mechanisms (mechanics, chemistry, ...) involved between an ABS polymer printed by additive manufacturing and a substrate. For this, several research axes have been developed, such as :-The choice of additive manufacturing process, based on the adhesion of the printed polymer on the substrate and the resolution of the process. This axis allowed us to select the stereolithography process (manufacturing technique based on polymerization of specifics UV-reactive resins).-The adhesion mechanisms between an ABS polymer and a substrate. This axis, based on materials knowledge, their chemical characterizations and physical characterization of the adhesion, leads us to understand the adhesion mechanisms that occurred during a direct printing on substrate.-Studies to improve adhesion, based on different chemistries (organic, metallic, inorganic) and surfaces topographies (roughness, surface patterns obtained by partial dicing or chemical etching).-The realization of an operational prototype, based on the direct encapsulation of a chip with a conductive routing and electrical interconnections. This axis allowed us to validate the compatibility of 3D printing encapsulation with an electronic component.In conclusion, our study demonstrates that the encapsulation of silicon-based microelectronic devices can be achieved by new techniques, including additive manufacturing.
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Submitted on : Wednesday, June 5, 2019 - 12:18:35 PM
Last modification on : Friday, November 6, 2020 - 4:24:31 AM


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  • HAL Id : tel-02148205, version 1




Gabrielle Aspar. L'impression 3D polymère appliquée au packaging en microélectronique. Science des matériaux [cond-mat.mtrl-sci]. Université Grenoble Alpes, 2019. Français. ⟨NNT : 2019GREAI006⟩. ⟨tel-02148205⟩



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