, VI.2.1-Les mémoires optiques réinscriptibles
, VI.2.2-Les mémoires résistives à changement de phase non-volatile PCRAM (Phase Change Random Access Memory)
, .3.1-Commutateur RF intégrant un système de chauffage indirect, p.45
, 2.3.2-Commutateur RF intégrant un système de chauffage direct, p.47
,
Optimisation du commutateur à système de chauffage indirect, p.60 ,
, thermiques à l'aide du logiciel COMSOL Multiphysics
, 4.3-Définition de la géométrie du dispositif et maillage
,
Dispositifs intégrant une couche mince de PCM ,
, Le procédé de fabrication des commutateurs RF à base de GeTe
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, DirectVacuum.com -Providing quality and affordable tools to facilitate cutting edge nanotechnology
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, Processus de fabrication du commutateur RF
pour ce processus les étapes de lithographie sont identiques à celles de la gravure humide (Figure 2.a), cependant lors de ce processus nous avons utilisé la gravure par RIE (Reactive Ion Etching). Le principe de fonctionnement de RIE consiste à réaliser les gravures des couches des matériaux sous vide par plasma en utilisant des différents types des gaz (SF6, CHF3, etc.). Elle est équipée d'une source laser qui ,
, Il faut nettoyer l'enceinte avec un plasma O2 et Ar (débit : 20 sccm) avant l'introduction des échantillons. La gravure des couches de GeTe et Si3N4 se fait par l'introduction du gaz SF6 (débit 20 sccm) avec le plasma dans l'enceinte. La vitesse de la gravure varie avec le type et l
,
, Dépôt d'une résine photosensible négative de type AZ5214E qui est ensuite, étalée à l'aide d'une "tournette" à 4000 tr/min pendant 40 secondes
, Insolation/ exposition (sans masque) totale du circuit pendant 20 secondes
, Développement de la résine sensibilisée dans une solution de micro-dé-veloppement, vol.26
, La dernière étape consiste à plonger l'échantillon dans un bain d'acétone permettant d'éliminer la matière déposée sur la couche de résine (sensibilisée) et de garder celle déposée directement sur le substrat
PTM and MEMS switches for future microwave and millimeter wave applications», 17th International Symposium on RF-MEMS and RF-MICROSYSTEMS (MEMSWAVE 2016), 2016. ,
Arrays of GeTe electrically activated RF switches, Advanced Materials and Processes for RF and THz Applications, p.2017, 2017. ,
URL : https://hal.archives-ouvertes.fr/hal-01611519
, S International Microwave Workshop Series on, pp.1-3
Double-Port Double-Throw (DPDT) Switch Matrix Based on Phase Change Material (PCM), 48th European Microwave Conference (EuMC), pp.479-482, 2018. ,
URL : https://hal.archives-ouvertes.fr/hal-01873496
Very Wide-Band and Compact VO 2 Based Switches, 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), pp.1-3, 2018. ,
URL : https://hal.archives-ouvertes.fr/hal-01873415
« Réalisation et caractérisations hyperfréquences de commutateurs RF intégrant des matériaux à changement de phase, 20èmes Journées Nationales Micro-Ondes JNM 2017, pp.16-19, 2017. ,