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Development and validation of a predictive model to ensure the long-term electromagnetic compatibility of embedded electronic systems

Chaimae Ghfiri 1
1 LAAS-ESE - Équipe Énergie et Systèmes Embarqués
LAAS - Laboratoire d'analyse et d'architecture des systèmes
Abstract : With the technological evolution of integrated circuits (ICs) through the transistors scaling, which leads to the multiplication of the number of transistors within a chip, the requirements in terms of emission and immunity levels become more restrictive in the aeronautic, space and automotive industries. Moreover, since the evolution of Electromagnetic Compatibility (EMC) levels of electronic equipment after aging must meet the EMC long-term requirements, the EMC margins defined by the manufacturers are often overestimated and the filtering systems designed by the equipment manufacturer could be oversized.Therefore, for the integrated circuits dedicated to embedded applications, it is necessary to study the different aspects of EMC modeling as well as the reliability the modeling. These last years, several standards have been proposed for the construction of predictive EMC models such as ICEM-CE/RE (Integrated Circuit Emission Model for Conducted and Radiated Emission) and ICIM-CI (Integrated Circuit Immunity Model for Conducted Immunity). On the other hand, to integrate the effect of aging in EMC models, it is important to study the main intrinsic degradation mechanisms that accelerate the aging of ICs, such as HCI (Hot Carrier Injection), TDDB (Time Dependent Dielectric Breakdown), EM (Electromigration) and NBTI (Negative Bias Temperature Instability). For this purpose, there are existing models for the reliability prediction, such as the MIL-HDBK-217 standard and the FIDES standard. However, these models could take into account only the activation of one degradation mechanism. The combination of several degradation mechanisms could be critical for the IC performances and could contribute in the evolution of EMC level.This thesis introduces the different aspects of EMC and reliability modeling. This work deals with the construction of a conducted emission model of an FPGA and the proposition of new modeling methodologies. Furthermore, the reliability of the tested FPGA is described using a new predictive model, which takes into account the activation of the different degradation mechanisms. The reliability model has been combined with the EMC model for the long-term conducted emission level prediction.
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Submitted on : Friday, March 8, 2019 - 3:37:09 PM
Last modification on : Thursday, June 10, 2021 - 3:03:01 AM
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Version validated by the jury (STAR)


  • HAL Id : tel-02062116, version 1


Chaimae Ghfiri. Development and validation of a predictive model to ensure the long-term electromagnetic compatibility of embedded electronic systems. Electromagnetism. INSA de Toulouse, 2017. English. ⟨NNT : 2017ISAT0033⟩. ⟨tel-02062116⟩



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