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Etude de l'influence des propriétés mécaniques des surfaces sur l'énergie de collage direct

Abstract : Nowadays, the microelectronics industry is seeking to develop ever more efficient components while reducing energy consumption. Planar solutions having reached their limits, 3D structures were developed to vertically stack the circuits. This requires a perfect control of the different assembly processes in which the direct bonding of thin layers of silicon oxide deposited by PECVD constitutes an interesting alternative in the sense that it allows the elaboration at low temperature of structures integrating insulating layers composed of silicon oxide.The direct bonding of silicon oxide obtained by thermal oxidation has been widely studied in the past. However, the use of deposited PECVD silicon oxides has not been so far widespread in bonded structures. The purpose of our study was to evaluate the particularities of the silicon oxide deposited in the direct bonding framework as well as the specific mechanisms involved during sealing of the bonding interface. Since direct bonding takes place by bringing these surfaces into contact at room temperature and then generally followed byconsolidation annealing, special mechanisms will take place in the oxide volume and at the bonding interface to differentiate the behaviour of the PECVD deposited silicon oxides in bonding.In this study, we assembled different oxide configurations and showed the primordial influence of water on direct bonding. It appeared that, from the ambient temperature, the water was already impacting the bonding by modifying the physicochemical and mechanical properties of the oxide subsurface. At higher temperatures, the water migrates from the oxide volume to the bonding interface allowing the closing of the bonding interfaceby exacerbating the above oxide properties. The water resulting from the closing of the bonding interface is then either stored inside cavities forming at the bonding interface or discharged into the oxide subsurface dependingon the type of oxide. It was also shown that the deposited oxide had a relatively balanced water concentration profile and could contain a significant amount of water. These findings have led to the development of two-layerstructures optimized for direct bonding. Understanding these different mechanisms provides new insights into the use of direct bonding processes for future applications.
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https://tel.archives-ouvertes.fr/tel-02047929
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Submitted on : Monday, February 25, 2019 - 12:14:06 PM
Last modification on : Thursday, June 11, 2020 - 5:04:08 PM
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DESOMBERG_2018_diffusion.pdf
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  • HAL Id : tel-02047929, version 1

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Citation

Jérôme Desomberg. Etude de l'influence des propriétés mécaniques des surfaces sur l'énergie de collage direct. Science des matériaux [cond-mat.mtrl-sci]. Université Grenoble Alpes, 2018. Français. ⟨NNT : 2018GREAY049⟩. ⟨tel-02047929⟩

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