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Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes

Abstract : In this thesis, the thermomechanical behavior of Printed Circuit Boards with high frequency space applications is assessed. A printed circuit board is a multi-material assembly, linking dielectric substrates and copper paths. The studied PCBs are multilayers, thus drills are made through these layers with copper electrodeposited on the wall of the hole, allowing the electrical signal to go from one layer to the other. Any satellite carries embedded electronics and the PCB is the link and the support of these electronics. During the life of the PCB in space applications, important temperature changes will drive strains which are inhomogeneous in the different materials and thus will lead to important stresses, root of the observed failures. Indeed, the coefficients of thermal expansion of the dielectric substrates are different than the one of copper. For each thermal cycle, the copper undergoes thus an alternate loading. Depending on the configuration, the copper may endure plastic strain and break after hundreds or a few thousands of cycles (oligo-cyclic fatigue). These failures happen often in the copper barrels linking the different layers.Two phases are distinguishable in the thesis: a first phase in which the thermomechanical behaviors of the materials constituting high frequency printed circuit boards is assessed (composites substrates and copper), and a second phase concerning the simulations of crucial configurations thanks to the identified behaviors of the materials
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Submitted on : Friday, December 14, 2018 - 4:18:06 PM
Last modification on : Wednesday, October 14, 2020 - 4:00:07 AM
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  • HAL Id : tel-01955852, version 1

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Gautier Girard. Caractérisation et modélisation thermomécaniques de matériaux et de structures circuits imprimés complexes destinés aux applications spatiales radiofréquences et micro-ondes. Mécanique des matériaux [physics.class-ph]. Université de Lorraine, 2018. Français. ⟨NNT : 2018LORR0170⟩. ⟨tel-01955852⟩

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