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Theses

Capteurs intégrés pour la fiabilisation des technologies d'encapsulation en microélectronique

Abstract : IBM is combining forces with the Université de Sherbrooke to introduce intelligency, which are sensors, in microelectronics module. The project is to make the assembly process of a chip more robust thanks to the sensor data. These microelectronics module are used in high-performance computing servers or telecommunications. The objectives are to design, characterize and embed 109 micro-sensors, having dimensions below 1 x 100 x 100 µm3. These micro-sensors will be on chip and measure temperature, moisture and strain. Thus these micro-sensors will give the spatial distribution of temperature, moisture and strain into the microelectronics module in severe environments. The carbon nanotube-based sensor realized are very sensitive to moisture and temperature, as example the output quantity value of the sensors is reduced by 50 per cent with a temperature excursions from -40 to 140 ℃. I developed a novel method to separate the temperature response from the moisture one, using the impedance properties of the sensor.
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https://tel.archives-ouvertes.fr/tel-01895864
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Submitted on : Monday, October 15, 2018 - 3:30:12 PM
Last modification on : Wednesday, April 1, 2020 - 1:15:27 AM
Long-term archiving on: : Wednesday, January 16, 2019 - 3:17:24 PM

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QUELENNEC_AURORE_2018.pdf
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  • HAL Id : tel-01895864, version 1

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Aurore Quelennec. Capteurs intégrés pour la fiabilisation des technologies d'encapsulation en microélectronique. Electronique. Université de Bordeaux; Université de Sherbrooke (Québec, Canada), 2018. Français. ⟨NNT : 2018BORD0105⟩. ⟨tel-01895864⟩

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