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Etude expérimentale et investigation numérique de la multi-fissuration des films minces déposés sur un substrat souple

Abstract : Semiconductor coatings deposited on flexible substrates are used in various high-tech applications, for example flexible micro-electronic components or flexible sollar cells.When submitted to large tensile strains, these coatings undergo damage characterized by the appearance of multiple cracks on their surface with or without delamination at the film/substrate interface.At the end of the multi-cracking process, a characteristic distance between cracks can be measured.This distance depends mainly on the thickness of the film and the mechanical behavior of the substrate.In this project, an experimental study on oxide layers and oxide and silver multilayers of different thicknesses deposited on two polymer substrates was carried out.Were able to determine the mechanical behavior of each substrate and to identify the stages of the three stades of multi-cracking of thin layers.A first stade of random appearance of cracks, a second stade of regular cracking and a last stade of saturation of the network of cracks were identified.The influence of the thickness of the silver layer has also been studied.We have developed a 2D based mechanical model using cohesive zones to simulate the initiation and propagation of cracks in the film.Using this model, we successfully simulate the three stages of the multi-cracking of oxide monolayers deposited on polymer as observed experimentally.We then reduced the model to a representative cell allowing only the last two stages of multi-cracking to be modeled. This cell allowed us to identify the influence of the geometric and mechanical properties of the thin layers and their substrate on the distance between cracks to saturation.The influence of interfacial delamination has also been studied.
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Submitted on : Wednesday, August 1, 2018 - 1:02:29 AM
Last modification on : Friday, August 27, 2021 - 9:38:03 AM
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  • HAL Id : tel-01852168, version 1



Ilhem Ben Cheikh. Etude expérimentale et investigation numérique de la multi-fissuration des films minces déposés sur un substrat souple. Matériaux. Université Grenoble Alpes, 2018. Français. ⟨NNT : 2018GREAI006⟩. ⟨tel-01852168⟩



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