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Fiabilité et analyse physique des défaillances des composants électroniques sous contraintes électro-thermiques pour des applications en mécatronique.

Abstract : The improvement of power conversion systems makes SiC devices very attractive for efficiency, compacity and robustness. However, their behavior in response to short circuit mode must be carefulli studied to ensure the reliability of systems. This research work deals with the SiC MOSFET robustness and reliability issues under short-circuit constraints. It is based upon electrical and microstructural characterizations. The sum of all the characterizations before, during and after the robustness tests as well as microstructural analysis allow to define hypotheses regarding the physical origin of failure of such components. Also, caoacitance measurement is introduced during aging tests as a health indicator and a key tool to go back to the physical origin of the defect.
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https://tel.archives-ouvertes.fr/tel-01812499
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Submitted on : Monday, June 11, 2018 - 2:49:05 PM
Last modification on : Thursday, November 28, 2019 - 3:08:58 AM
Long-term archiving on: : Wednesday, September 12, 2018 - 10:54:41 PM

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  • HAL Id : tel-01812499, version 1

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Safa Mbarek. Fiabilité et analyse physique des défaillances des composants électroniques sous contraintes électro-thermiques pour des applications en mécatronique.. Matériaux. Normandie Université, 2017. Français. ⟨NNT : 2017NORMR142⟩. ⟨tel-01812499⟩

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