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Innovative materials for packaging

Abstract : This work deals with the study of thermoset-thermoplastic blend (epoxy-amine/poly-etherimide phase separated) to assess the electrical and thermal performances. These materials would be new candidates to replace the encapsulation layer in semiconductors, for example ones used as switches in power electronic applications. Polymers blends would be a novel candidate as an insulator for the system. Pure epoxy system as well as Epoxy/Polyetherimide blends where characterized by transmission electron microscopy, scanning electron microscopy, differential scanning calorimetry, thermogravimetric analysis, dynamic mechanical analysis, dielectric analysis with analytical simulation, electrical conductivity and breakdown voltage measurements. These complementary techniques were used first to investigate the presence of the phase separation phenomenon and secondly to quantify the separated nodules size. The effect of this phase separation was examined and showed a decrease in the dielectric values of 15 % and an increase in the breakdown voltage compared to the pure epoxy system. It was finally simulated to show a close assumption of what is found experimentally.
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Submitted on : Thursday, May 3, 2018 - 7:23:20 PM
Last modification on : Monday, September 13, 2021 - 2:44:04 PM
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  • HAL Id : tel-01784873, version 1


Nour Halawani. Innovative materials for packaging. Electronics. Université de Lyon, 2017. English. ⟨NNT : 2017LYSEI010⟩. ⟨tel-01784873⟩



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