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Integration of innovative ohmic contacts for heterogeneous III-V/Silicon Photonic devices

Abstract : Since the 2000s, the requirements in terms of data exchange never stopped rising owing to a multitude of emerging communication means. These extensive modifications lead the signal processing and electrical technologies to switch towards optical devices and interconnections. Among others, these new technologies require the use of III-V-based emitters and receptors. In order to miniaturize these devices, to optimize the performances and to minimize the fabrication cost of such a technology, an innovative manufacturing model consists in integrating directly the III-V laser source onto the 200 mm Si photonics circuit. To enable the development of contacts meeting the constraints of a front-end / middle-end Si-environment along with those of an operating laser, one of the keys lies in the development of contacts on n-InP and p-InGaAs which are necessary to electrically pump the III-V laser.This Ph.D thesis therefore deals with the development of an innovative contact architecture fulfilling the requirements of a front-end / middle-end Si-dedicated clean room environment while optimizing the performances of the III-V laser. An integration scheme is firstly presented in its wholeness before optimizing every available process that is required. This kind of development leverages the advantage of utilizing existing infrastructures and processes while preserving the III-V surfaces and optimizing the performances of the III-V laser. Special attention is devoted to the development of the contact metallization which relies on the formation of intermetallic compounds at the interface between the deposited metal and the semiconductor. Extensive studies are therefore conducted on the Ni/n-InP, Ni/p-InGaAs et Ti/n-InP systems in order to identify the phase sequences, the involved mechanism and finally the thermal stability of the various phases. Ultimately, these metallizations are integrated in structures dedicated to their electrical characterization. The corresponding specific contact resistivities are thus extracted. Thanks to these studies, the metallizations and processes allowing an optimization of the electrical performances of the integrated contacts while ensuring their stability are finally identified.
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Submitted on : Tuesday, January 16, 2018 - 4:38:07 PM
Last modification on : Tuesday, October 20, 2020 - 11:03:58 AM
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  • HAL Id : tel-01685738, version 1



Elodie Ghegin. Integration of innovative ohmic contacts for heterogeneous III-V/Silicon Photonic devices. Condensed Matter [cond-mat]. Université Sorbonne Paris Cité, 2017. English. ⟨NNT : 2017USPCC008⟩. ⟨tel-01685738⟩



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