Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling, In: Microelectronics Reliability, vol.51, pp.406-415, 2011. ,
A model for the effect of line width and mechanical strength on electromigration failure of interconnects with "near-bamboo" grain structures, In: Journal of Materials Research, vol.6, pp.731-736, 2011. ,
The Insulated Gate Transistor: A New Three-Terminal MOS-Controlled Bipolar Power Device, IEEE Transactions on Electron Devices, vol.31, pp.821-828, 1984. ,
Parallel glide: Unexpected dislocation motion parallel to the substrate in ultrathin copper films, Acta Materialia, vol.51, pp.4471-4485, 2003. ,
Higher Junction Temperature in Power Modules-a demand from hybrid cars, a potential for the next step increase in power density for various Variable Speed Drives, Proc. of PCIM, 2008. ,
Advanced IGBT Modules for Railway Traction Applications: Reliability Testing, In: Microelectronics Reliability, vol.38, pp.1319-1323, 1998. ,
Caractérisation de MOSFETs de puissance cyclés en avalanche pour des applications automobiles micro-hybrides, 2010. ,
Source electrode evolution of a low voltage power MOSFET under avalanche cycling, In: Microelectronics Reliability, vol.49, pp.1341-1345, 2009. ,
Electromigration failure modes in aluminum metallization for semiconductor devices, Proceedings of the IEEE, vol.57, pp.1587-1594, 1969. ,
Wafer shape control-Study of the reactivity in Ti/Al dual layers and its effect on the stress, 2001. ,
Etude de la fatigue thermo-mécanique de modules électroniques de puissance en ambiance de températures élevées pour des applications de traction de véhicules électriques et hybrides, thèse de doctorat, 2008. ,
Effects of thermal cycling on aluminum metallization of power diodes, In: Microelectronics Reliability, vol.55, issue.10, pp.1988-1991, 2015. ,
Passive thermal cycling of power diodes under controlled atmospheric conditions-effects on metallization degradation, Proc. of CIPS, 2016. ,
Microstructural evolution of ultrasonic-bonded aluminum wires, In: Microelectronics Reliability, vol.55, pp.961-968, 2015. ,
Optimization of wire connections design for power electronics, In: Microelectronics Reliability, vol.51, pp.1892-1897, 2011. ,
URL : https://hal.archives-ouvertes.fr/hal-01704479
Selected failure mechanisms of modern power modules, In: Microelectronics Reliability, vol.42, pp.653-667, 2002. ,
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs, In: Microelectronics Reliability, vol.78, pp.25-37, 2017. ,
Failure modes on low voltage power MOSFETs under high temperature application, In: Microelectronics Reliability, vol.47, pp.1767-1772, 2007. ,
URL : https://hal.archives-ouvertes.fr/hal-01704346
Four-Terminal P-N-P-N Transistors, In: Proceedings of the I.R.E, vol.83, pp.1361-1364, 1952. ,
Electron energy-loss spectroscopy in the TEM, In: Reports on Progress in Physics, vol.72, p.16502, 2008. ,
IEEE 1413: A standard for reliability predictions, IEEE Transactions on Reliability, vol.61, issue.1, pp.125-129, 2012. ,
Measurement and Interpretation of Stress in Aluminum-Based Metallization as a Function of Thermal History, IEEE Transactions on Electron Devices, vol.34, pp.689-699, 1987. ,
Extensions of the Stoney formula for substrate curvature to configurations with thin substrates or large deformations, In: Applied Physics Letters, vol.74, pp.1987-1989, 1999. ,
Deformation mechanisms maps. Pergamon P, 1982. ,
Cracklike grain-boundary diffusion wedges in thin metal films, Acta Materialia, vol.47, pp.2865-2878, 1999. ,
Non-monotonic material contrast in scanning ion and scanning electron images, In: Ultramicroscopy, vol.111, pp.1564-1573, 2011. ,
Impact of thermal overload operation on wirebond and metallization reliability in smart power devices, Proceedings of the 30th European Solid-State Circuits Conference, pp.273-276, 2004. ,
Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors Selection of Bonding Parameters for the, Proc. of CIPS, pp.6-8, 2012. ,
Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling measured by the Shear Test, Proc. CIPS, pp.1-6, 2010. ,
, Scanning Electron Microscopy and X-ray Microanalysis, 2003.
Evaluation of lead-free soldering for automotive applications, In: Microelectronics Reliability, vol.42, pp.1555-1558, 2002. ,
, Packaging. ASM Intern, 1989.
Failure causes generating aluminium protrusion/extrusion, Microelectronics Reliability, vol.53, pp.1553-1557, 2013. ,
Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers, In: Thin Solid Films, vol.517, pp.1858-1867, 2009. ,
Analytic model for the grain structures of near-bamboo interconnects, In: Journal of Applied Physics, vol.76, pp.7339-7346, 1994. ,
Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films, In: Microelectronic Engineering, vol.70, issue.2-4, pp.447-454, 2003. ,
The Future of Electronics in Automobiles, Proceedings of the 13th International Symposium on Power Semiconductor Devices and ICs, pp.15-19, 2001. ,
Automotive Electronics Council, Short circuit reliability characterization of smart power devices for 12V systems, Attachement, vol.12, 2006. ,
Ion channeling effects on the focused ion beam milling of Cu, In: Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.19, p.749, 2001. ,
Fiabilité prédictive de composants de puissance soumis à des tests de fatigue accélérés, 2007. ,
Characterization and modelling of ageing failures on power MOSFET devices, In: Microelectronics Reliability, vol.47, pp.1735-1740, 2007. ,
Innovative methodology for predictive reliability of intelligent power devices using extreme electro-thermal fatigue, In: Microelectronics Reliability, vol.45, issue.11, pp.1717-1722, 2005. ,
History of FET Technology and the Move to NexFET TM, pp.44-50, 2009. ,
Dislocation plasticity in thin metal films, MRS Bulletin, vol.27, pp.30-37, 2002. ,
A transmission electron microscopy study of ultrasonic wire bonding, Proc. of Electronic Components Conference, pp.450-455, 1989. ,
Crystal orientation mapping via ion channeling: An alternative to EBSD, In: Ultramicroscopy, vol.157, pp.65-72, 2015. ,
URL : https://hal.archives-ouvertes.fr/hal-02066168
Interfacial reactions and mechanical strength of Sn-3.0Ag0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications, In: Microelectronics Reliability, vol.71, pp.119-125, 2017. ,
Solder joint fatigue models: review and applicability to chip scale packages, In: Microelectronics Reliability, vol.40, pp.231-244, 2000. ,
Relaxation plastique des couches métalliques par dislocations et défauts étendus, Série Electronique Et MicroÉlectronique). M. Mouis, 2006. ,
In situ deformation of thin films on substrates, In: Microscopy Research and Technique, vol.72, pp.270-283, 2009. ,
Plasticity-related phenomena in metallic films on substrates, Materials Research Society Symposium-Proceedings, vol.779, pp.63-74, 2003. ,
Microstructural evolution in passivated Al films on Si substrates during thermal cycling, Acta Materialia, vol.50, pp.3435-3452, 2002. ,
In-Situ TEM Study of Plastic Stress Relaxation Mechanisms and Interface Effects in Metallic Films Marc, MRS online Proc. Library Archive, vol.875, pp.237-247, 2005. ,
Interconnect and Current Density Stress-An introduction to Electromigration-Aware Design, Proceedings of the 2005 international workshop on System level interconnect prediction, vol.1, pp.81-88, 2005. ,
Method and apparatus for controlling electric currents. Patent 1,745,175, 1926. ,
Laser decapsulation method. Patent US 7,316, pp.936-938, 2008. ,
Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate, Journal of Electronic Materials, vol.35, issue.3, pp.433-442, 2006. ,
, Semiconductor Power Devices: Physics, Characteristics, Reliability, 2011.
Caractérisation de l'endommagement de composants électroniques de puissance soumis à des tests de vieillissement accéléré, 2011. ,
Universal mechanisms of Al metallization ageing in power MOSFET devices, In: Microelectronics Reliability, vol.54, pp.2432-2439, 2014. ,
URL : https://hal.archives-ouvertes.fr/hal-01729249
Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue, In: Microelectronics Reliability, vol.50, pp.1768-1772, 2010. ,
Defects in epitaxial multilayers. II. Dislocation pile-ups, threading dislocations, slip lines and cracks, In: Journal of Crystal Growth, vol.29, pp.273-280, 1975. ,
Defects in Epitaxial Multilayers .1. Misfit Dislocations, In: Journal of Crystal Growth, vol.27, pp.118-125, 1974. ,
TEM Sample Preparation and FIB-Induced Damage, MRS Bulletin, vol.32, pp.400-407, 2007. ,
Wirebond Reliability in IGBT-Power Modules: Application of High Resolution Strain and Temperature Mapping, Proc. ISPSD, pp.113-116, 1999. ,
Improved EBSD Sample Preparation Via Low Energy Ga+ FIB Ion Milling, In: Microscopy and Microanalysis, vol.13, pp.926-927, 2007. ,
P-N-P-N Transistor Switches, Proceedings of the IRE, vol.44, pp.1174-1182, 1956. ,
Le transistor MOS de puissance à tranchées : modélisation et limites de performances. Micro et nanotechnologies/Microélectronique, 1996. ,
The "Thyristor'"-A New Highspeed Switchhg Transistor, IRE Transactions, vol.18, pp.2-5, 1958. ,
Observation of dislocation disappearance in aluminum thin films and consequences for thin film properties, Proceedings of the 1997 MRS, vol.505, pp.149-154, 1998. ,
Idealized two Dimensional Sintering by Interface Diffusion, In: Scripta metall. et mater, vol.29, pp.491-496, 1993. ,
A reliable technology concept for active power cycling to extreme temperatures, In: Microelectronics Reliability, vol.51, issue.11, pp.1927-1932, 2011. ,
Effective and reliable heat management for power devices exposed to cyclic short overload pulses, In: Microelectronics Reliability, vol.53, issue.11, pp.1745-1749, 2013. ,
Mechanical properties of thin films, In: Metallurgical Transactions A, vol.20, issue.11, pp.2217-2245, 1989. ,
Atomistic interpretation of interface stress, Scripta Materialia, vol.39, pp.1653-1661, 1998. ,
SCR Is 50 Years Old, IEEE Industry Applications Magazine, vol.13, pp.6-10, 2007. ,
,
Interface structure and strength of ultrasonically wedge bonded heavy aluminium wires in Si-based power modules, In: Journal of Materials Science: Materials in Electronics, vol.25, pp.2863-2871, 2014. ,
Design Limits When using Gold-Aluminum Bonds, Proc. of 9th Reliability Physics Symposium, pp.114-119, 1971. ,
A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices, In: Microelectronics Reliability, vol.51, pp.1824-1829, 2011. ,
URL : https://hal.archives-ouvertes.fr/hal-01636559
Thermal fatigue and failure of electronic power device substrates, In: International Journal of Fatigue, vol.31, pp.1911-1920, 2009. ,
URL : https://hal.archives-ouvertes.fr/hal-00417898
Mold Compound, High Performance Requirements, 2003. ,
Reliability model for Al wire bonds subjected to heel crack failures, In: Microelectronics Reliability, vol.40, pp.1521-1525, 2000. ,
Crack Mechanism in Wire Bonding Joints, In: Microelectronics Reliability, vol.38, pp.1301-1305, 1998. ,
Automated crystal orientation and phase mapping in TEM, In: Materials Characterization, vol.98, pp.1-9, 2014. ,
URL : https://hal.archives-ouvertes.fr/hal-01121290
Automatic Crystal Orientation and Phase Mapping in TEM by Precession Diffraction, In: Microscopy and Analysis, vol.22, pp.5-8, 2008. ,
Kikuchi band contrast in diffraction patterns recorded by transmitted and backscattered electrons, In: Scanning, vol.8, pp.101-118, 1986. ,
An ultrafast IR thermography system for transient temperature detection on electronic devices, Proc. of Annual IEEE Semiconductor Thermal Measurement and Management Symposium, pp.80-84, 2014. ,
Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24V battery system applications, In: Microelectronics Reliability, vol.53, issue.11, pp.1703-1706, 2013. ,
URL : https://hal.archives-ouvertes.fr/hal-01700479
The COMFET-A New High Conductance MOS-Gated Device, In: IEEE Electron Device Letters, vol.4, issue.3, pp.63-65, 1983. ,
State of the art and trends in power integration, vol.33, pp.20-29, 1999. ,
Caractérisation et modélisation de modules de puissance "fail-to-short" pour convertisseurs sécurisés à tolérance de pannes-Application véhicule électrique hybride, 2017. ,
Thermal Cycling and Surface Reconstruction in Aluminum Thin Films, In: Journal of The Electrochemical Society, vol.116, p.361, 1969. ,
3D electrothermal investigations for reliability of ultra low ON state resistance power MOSFET, In: Microelectronics Reliability, vol.48, pp.1464-1467, 2008. ,
Power cycling results for different control strategies, In: Microelectronics Reliability, vol.50, issue.11, pp.1203-1209, 2010. ,
Electron Backscatter Diffraction in Materials Science, 2000. ,
The effect of grain orientation on the relaxation of thermomechanical stress and hillock growth in AI1%Si conductor layers on silicon substrates, In: Journal of Electronic Materials, vol.22, pp.607-610, 1993. ,
Teal, p-n Junction Transistors, Physical Review, In: Physical Review, vol.83, pp.151-162, 1951. ,
A Unipolar " Field-Effect " Transistor, Proc. of the I.R.E. 1952, pp.1365-1376 ,
Ageing and failure modes of IGBT modules in high-temperature power cycling, IEEE Transactions on Industrial Electronics, vol.58, pp.4931-4941, 2011. ,
URL : https://hal.archives-ouvertes.fr/hal-00713206
The tension of metallic films deposited by Electrolysis, In: Proceedings of the Royal Society of London A, vol.82, pp.172-175, 1909. ,
Modeling of the On-Resistance of LDMOS, VDMOS and 46 VMOS Power Transistors, IEEE Transactions On Electron Devices, vol.27, pp.356-367, 1980. ,
Fatigue of Materials, Second Edition. Cambridge, 1998. ,
Structure evolution during processing of polycrystalline films, Annu. Rev. Materials Science, vol.30, pp.159-90, 2000. ,
Comparison of high spatial resolution in EDX and EELS analysis, In: Ultramicroscopy, vol.28, issue.1-4, pp.347-351, 1989. ,
Linear Intercepts, Areas and Volumes, Nature, vol.155, pp.24-24, 1945. ,
Aluminum electromigration of 1-mil bond wire in octal inverter integrated circuits, 1995 Proceedings of 45th Electronic Components and Technology Conference, 1995. ,
Strength and ductility of ultrafine grained aluminum and iron produced by ARB and annealing, Scripta Materialia, vol.47, pp.893-899, 2002. ,
Deformation behavior of thin aluminum films on silicon substrates, 1992. ,
Fuse end Relay Replacement by Intelligent 2 m? RdsON Smart Power Switches, Proc. of 10th European Conference on Power Electronics and Applications, 2003. ,
Linewidth dependence of electromigration in evaporated Al-0.5%Cu, In: Applied Physics Letters, vol.36, issue.6, pp.464-466, 1980. ,
Development of nearbamboo and bamboo microstructures in thin-film strips, In: Applied Physics Letters, vol.61, pp.40-42, 1992. ,
Development of nearbamboo and bamboo microstructures in thin-film strips, In: Applied Physics Letters, vol.61, pp.40-42, 1992. ,
Toward reliable power electronics: Challenges, design tools, and opportunities, In: IEEE Industrial Electronics Magazine, vol.7, issue.2, pp.17-26, 2013. ,
Constrained diffusional creep in UHV-produced copper thin films, Acta Materialia, vol.49, pp.2395-2403, 2001. ,
Jet etch method for decapsulation of molded devices, 1983. ,
The strength limits of ultra-thin copper films, p.212, 2007. ,
Transmission Electron Microscope, A Textbook for Materials Science, 2009. ,
The trench power MOSFET: Part i-History, technology, and prospects, IEEE Transactions on Electron Devices, vol.64, pp.674-691, 2017. ,
Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds, Acta Materialia, vol.59, pp.5661-5673, 2011. ,
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device, In: Microelectronics Reliability 47, vol.12, pp.2147-2151, 2007. ,
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity, In: Microelectronics Reliability, vol.55, issue.10, pp.1997-2002, 2015. ,
URL : https://hal.archives-ouvertes.fr/hal-01857025
Six cases of reliability study of Pb-free solder joints in electronic packaging technology, In: Materials Science and Engineering: R: Reports, vol.38, pp.55-105, 2002. ,
Electron-beam-assisted superplastic shaping of nanoscale amorphous silica, In: Nature Communications, vol.1, pp.28-36, 2010. ,