Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs

Abstract : Technological roadmap of the microelectronic industry is mainly described by Moore'slaw which aims a constant reduction of transistors size. Three-dimensional integration ofactive chips appears more and more as an alternative way to Moore's law. According to thisstrategy, chips are interconnected along the vertical axis thanks to copper pillars and a tinbased alloy (SnAgCu).The joining is then performed through eutectic bonding using aSnAgCu solder alloy which is at the origin of intermetallic compounds growing at the copperalloy interface. These intermetallic compounds are sometimes described in literature asweakening factor of the interconnection mechanical reliability. Moreover this interfacialreactivity leads also to the formation of Kirkendall microvoids potentially causinginterconnections breakings, mostly noticed during ageing tests.This report is dedicated to the study and metallurgical characterization of theinterconnection system with a size close to that of the actual prototypes which is 25μm. Thestudy is successively focused on SnAgCu alloy microstructure, Cu/SnAgCu and Ni/SnAgCuinterfacial reactivity and on the mechanical reliability of interconnection system. These topicsare investigated in function of thermal constraints and during different integration steps untilchips packaging. The main critical aspect is related to the fact that system dimensions, alreadysmall, are planned to be reduced, leading to a more important proportion of the solder alloyconsumed by interfacial reaction.
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Julien Bertheau. Etude et caractérisation d'interconnexions intermétalliques à partir de plot de cuivre et d'alliage SnAgCu pour l'empilement tridimentionnel de composants actifs. Matériaux. Université de Grenoble, 2014. Français. ⟨NNT : 2014GRENI043⟩. ⟨tel-01237276⟩

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