Evaluation de la fiabilité de boîtiers électroniques QFN à base de nanocomposites LCP/SiO2 fonctionnalisées

Abstract : As part of the development of cavities packages for electronic components, Liquid Crystal Polymers (LCP) offer interesting properties and compete with ceramic materials: low gas permeability, high temperature resistance, thermal stability and low dielectric constant (3.1 to 2.8 for 1 MHz and 10 GHz). This new generation of thermoplastic will compete with classic packages more expensive and open to new applications such as medical imaging for example.In this context, we propose an original approach of mineral nanoparticles functionalization (via sol-gel process) and their incorporation into the polymer matrix to modify the mechanical properties (Young's modulus and CTE) and the anisotropy. Packaging reliability is assessed using thermomechanical simulations. The goal is to establish a link between the mechanical properties of composites based on LCP and the characteristic lifetime of the package. The development of optical covers for these packages is also study to obtain a filter in the near infrared for applications in the mobile phone sector.
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Submitted on : Wednesday, November 18, 2015 - 10:33:54 AM
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  • HAL Id : tel-01230257, version 1


Walide Chenniki. Evaluation de la fiabilité de boîtiers électroniques QFN à base de nanocomposites LCP/SiO2 fonctionnalisées. Automatique. Université de Bordeaux, 2015. Français. ⟨NNT : 2015BORD0107⟩. ⟨tel-01230257⟩



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