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Etude des propriétés mécaniques de technologies de report de puce pour électronique de puissance : influence du vieillissement.

Abstract : The requirement for reducing the use of harmful materials in convenience goods hasprompted investigation into alternative solutions. Along with the need to drastically limit theemission of greenhouse gases, the increase of electric or hybrid vehicles in the market reliesmostly on their dependability with a specific focus on reliability of the embedded powerelectronics. The study of alternative materials to lead (Pb) or Pb-based alloys for die bondingis a critical step towards realising an environmentally friendly solution. Micrometric silverpaste was chosen as a candidate because of its excellent electrical properties. However, fewdata are available in the literature concerning its mechanical properties, mandatory to modelthe entire electronic system for service life assessment. The processing route, based on thesintering of micrometric powder, provides a material with significant porosity that is knownto alter the mechanical properties when compared to the dense material. In this thesis, anoriginal processing route was developed in order to obtain bulk samples with the samemicrostructure of real solder joints either before or after ageing. The mechanical properties vsdensity was established prior to or after aging. After aging, the elastic properties do not varywhile the dispersion observed for the plastic properties is connected with the microstructureevolution. The evolution of the elastic properties on the representative samples of solder jointsafter aging is attributed to the mechanisms of stress relaxation. Once these relaxed, theproperties are identical for both states (bulk and thin layer) and are thus intrinsic in thematerial.
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Submitted on : Thursday, September 10, 2015 - 10:55:06 AM
Last modification on : Wednesday, October 20, 2021 - 3:22:14 AM
Long-term archiving on: : Monday, December 28, 2015 - 11:44:25 PM


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  • HAL Id : tel-01196618, version 1



Vincenzo Caccuri. Etude des propriétés mécaniques de technologies de report de puce pour électronique de puissance : influence du vieillissement.. Autre. ISAE-ENSMA Ecole Nationale Supérieure de Mécanique et d'Aérotechique - Poitiers, 2014. Français. ⟨NNT : 2014ESMA0002⟩. ⟨tel-01196618⟩



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