Etude de la fiabilité de modules à base de LEDs blanches pour applications automobile

Abstract : With rapid development of Lighting Emitting Diode (LED) market, LED performancesare now suitable for automotive high beam / low beam lighting applications. Due to the need of UltraHigh Brightness (UHB-LEDs), LEDs are packaged on high thermal conductivity materials to obtainmultichip module (4 chips in series), which deliver up to 1000 lumens at 1A. Currently, several LEDtechnologies are commercially offered for the same performances, and different packaging strategieshave been implemented in terms of chip configuration, bonding, down conversion phosphor layerand mechanical protection to optimize performances. This study addresses a dedicated methodologyfor reliability analysis, applied on two LED chip packaging technologies: On the one hand, a VerticalThin Film (VTF) technology; on the other hand a Thin Film Flip Chip (TFFC). Our methodology is basedon 3 main items: Packaging technology structure, materials analysis and electro-optical and thermal multichipmodels for both technologies to understand and extract the key parameters to monitor duringageing tests. Robustness assessment tests to define operating margins, adjust accelerated life-testingconditions, and identify failures signatures. Reliability study through a 6 000 hours High Temperature Operating Life (HTOL) acceleratedtests, to predict the Mean Time To Failure (MTTF) of these new light source technologiesregarding the automotive mission profile. Linked to failure analysis, convincing failuremechanisms are proposed.Based on these results, parametric variations are compared to failure analysis results topropose failure mechanisms. The HTOL tests reveal that both LED technologies have their specificreliability behavior and failure modes: catastrophic failure and gradual failure. Predictive lifetimeestimations (L70B50) of these multichip modules give a factor 6 between both technologies.Beyond these reliability results, the multichip architecture brings new issues for Solid StateLighting (SSL) sources in automotive, as well as partial failure or unbalanced behavior after stress.These new issues are discussed through the behavior modeling of a 10 LED modules batch for bothfailure modes. Modeling results demonstrate that the predictive lifetime of a LED multichiparchitecture is directly related with the LED technology failure mode.
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Bertrand Chambion. Etude de la fiabilité de modules à base de LEDs blanches pour applications automobile. Physique [physics]. Université de Bordeaux, 2014. Français. ⟨NNT : 2014BORD0163⟩. ⟨tel-01148774⟩

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