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Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces

Abstract : Integrated circuits are part of our nowadays life as they are presents everywhere; as well as in daily life or industry. They are continuously downscaled to increase their performances. As a result, this downscaling lead to complex interconnects grid architectures. Interconnects which are metal lines carrying electric signal in the circuit are thus more and more sensitive to electromigration failure. This I because of increasingly higher current densities they carry. Obviously, in advanced technology nodes, it is more and more difficult to ensure the reliability level required for interconnects. Interconnects lifetime reduction is linked to increasing difficulty to perform all process steps with these very small features and also to increasing failure times dispersion. In the first part of the work presented here, we deepened the understanding of mechanisms involved during electromigration degradation. We have thus shown the fundamental role played by the microstructure and the chemical composition of the line in increasing its lifetime. The second part of the work dealt with the improvement of statistical analysis of failure times. We thus focused on early failures and the bimodal failure times distributions they generate. As far as that goes, the multilink structure we have designed answers the fundamental question of increase test sampling. This lead then to improved precision at very low failure rates for robust lifetime's extrapolation to use conditions.
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Franck Lionel Bana. Dégradation par électromigration dans les interconnexions en cuivre : étude des facteurs d'amélioration des durées de vie et analyse des défaillances précoces. Autre. Université de Grenoble, 2013. Français. ⟨NNT : 2013GRENI081⟩. ⟨tel-01143075⟩

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