Lois de comportement des matériaux utilisés dans les contacts électriques pour application " flip chip "

Abstract : In the field of « 3D » microelectronic integration, a wafer level technology using flip chip stacking and based on a microinsertion process has been developed recently. This technology is mainly based on the contact realized by thermocompression between a network of microinserts made of Nickel ECD, with connections pads in Al(Cu). In this work, a scenario describing the contact establishment between a unique rough microinsert of Nickel and a smooth thin Aluminum film taking into account the presence of native Alumina at the contact interface, is developed for a range of pressures from MPa to GPa. The analysis of the metal-oxide-metal contact is essentially based on the fracture of the native oxide followd by the metal extrusion through cracks, and requires the knowledge of the behaviour laws of materials, obtained from instrumented nanoindentation tests coupled with numerical modeling. Finally, the measure of the electrical contact resistance evolution in function of applied load, with specific pioneering experimental setup, showcases the mechanisms driving the formation of metallic contact during the microinsertion process.
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David Mercier. Lois de comportement des matériaux utilisés dans les contacts électriques pour application " flip chip ". Matériaux. Université de Grenoble, 2013. Français. ⟨NNT : 2013GRENI083⟩. ⟨tel-01127940⟩

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