Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints

Abstract : A further miniaturization of microelectronic components by three dimensionalpackaging, as well as the use of microelectronic devices under harsh environmentconditions, requires the development of more robust alternatives to the existing Snbased solder joints. One promising technique is the diffusion and migration driventransformation of conventional solder bumps into intermetallic compound (IMC)connections. The related process is called transient liquid phase soldering (TLPS).Against this background an investigation of the IMC formation under consideration ofelectromigration and thermomigration was performed. For the stress tests Packageon Package structures are used. The final result is a general model for the IMCformation in solder joints. Combined with a Finite Element Analysis (FEA) this modelis used to predict the IMC formation in solder joints for a broad range of boundaryconditions. In future the model of the IMC formation can be used to optimize a TLPSprocess.
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Lutz Meinshausen. Modelling the SAC microstructure evolution under thermal, thermo-mechanical and electronical constraints. Electronics. Université de Bordeaux, 2014. English. ⟨NNT : 2014BORD0149⟩. ⟨tel-01127349⟩

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