, Assembly and Packaging White Paper on System Level Integration System in Package Technology Effects of mechanical stress and moisture on packaging interfaces, System in Package: Identified Technology Needs from the 2004 iNEMI Roadmap Moisture Effects on the Creep of Thermosetting IC Packaging Polymers 7th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Reliability Qualification of Semiconductor Devices Based on Physics of Failure Risk and Opportunity Assessment, 2004.
, Performance Essai Methods and Qualification Requirements for Surface Mount Solder AttachmentsQualification Essaiing Protocols for MEMS IEEE Standard Computer Dictionary: Compilation of IEEE Standard Computer Glossaries Reliability Practice Mechanics of Microelectronics Applied reliability Discriminating between the Weibull and Log-Normal Distributions Analysis of the characteristic features of the density functions for gamma, Weibull and log-normal distributions through RBF network pruning with QLP The Approximate Equations Between The Weibull And Lognormal Distributions By Using MRR Chimie générale, Quality Conformance and Qualification of Microelectronic Packages and Interconnectsjpl.nasa.gov/docs/JPL%20PUB%2099-1J.pdf. [11] Institute of Electrical and Electronics Engineers 6th WSEAS Int. Conf. on Artificial Intelligence, Knowledge Engineering and Data Bases, pp.35-61, 1990.
, Calculation of Semiconductor Failure Rate Chemical kinetics and catalysis pages, series Fundamental and Applied Catalysis Etude de la Durée de Vie d'Assemblages Microélectroniques par l'Utilisation de Simulations, de Modèles de Dégradation et de Circuits Intégrés Spécifiques de Test, Thèse de l'Université de Bordeaux 1, pp.296-112, 1995.
, Failure Assessment Software for Circuit Card Assemblies Multichip packaging ? a Tutorial, Proceedings of the IEEE Annual Reliability and Maintainability Symposium Proceedings of the IEEE 1992, pp.269-276, 1999.
, The Reliability Issues on ASIC/Memory Integration by SiP (System-in-Package) Technology Millimeter-Wave Performance of Chip INTERCONNECTIONS Using Wire Bonding and Flip Chip, Package Technology: Opportunities and Challenges Stacked-Chip Packaging: Electrical, Mechanical, and Thermal Challenges Electronic Components and Technology Conference, pp.589-593, 1996.
, Three-dimensional integration technology based on wafer bonding technique using micro-bumpsThree dimensional metallization for vertically integrated circuits SiP Roadmap Rapport interneSystem-In-Package (SIP): Challenges and Opportunities Design for Reliability for Wafer Level System in Package Solder Fatigue of Wafer Level Package Assemblies. Comparison with Flip Chip BGA's " , NXP Semiconductors, 9th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE Qualification Status, pp 39-47. [33] C. Beelen Proc. Of Asia and South Pacific Design Automation Conference 2nd Electronics System integration Technology Conference Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability Electronic Components and Technology Conference High-Temperature Degradation of Wire Bonds in Plastic Encapsulated Microcircuits Role of Particle Contamination in the Corrosion of Electronic Material and DevicesEffectors of high temperature reliability in epoxy encapsulated devices Proceedings of the 43rd Electronic Components and Technology Conference, pp.3032-30371073, 1993.
, Phase Transformations in Thermally Exposed Au-Al Ball Bonds Thermal reliability of gold-aluminum bonds encapsulated in bi-phenyl epoxy resin In-Situ Monitoring Of Dry Corrosion Degradation Of Au Ball Bonds To Al Bond Pads In Plastic Packages During HTSLBromine-and Chlorine-Induced Degradation of Gold-Aluminum Bonds Effect of Environments on Degradation of Molding Compound and Wire Bonds in PEMs Monte carlo simulation of polymer high-temperature degradation and fracture, Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield Microelectronics reliability Electronic Components and Technology Conference Hight temperature properties and applications of polymeric materials nd Annual International Reliability Physics Symposium, pp.340-352, 1931.
, Introduction to Advanced Mechanics Mechanics of Microelectronics Synophysique Chapitre Description macroscopique de la matière http://www.sciences.univ-nantes.fr/physique/perso/blanquet/synophys Méthodologie d'Essais Accélérés de Torsion et de détection de Défaillance Appliquée aux Assemblages Électroniques à Billes Thermo-Mechanics of Integrated Circuits and Packages Analyse Pillar Bump Summary, Thèse de doctorat Mechanics of Microelectronics Spinger, pp 169-170. [55] K. Danilo, pp.95-120, 2006.
, Prediction of Interfacial Delamination in Stacked IC Structure Using Combined Experimental and Simulation Methods Investigation Of The Adhesion Strength Between MC And Lead Frame At Higher TemperaturesHygroscopic swelling and sorption .characteristics of epoxy molding compounds used in electronic packaging, Proc. IEEE IEEE Transactions on components and packaging technologies, pp.349-353, 1998.
, Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy Field Returns, a Source of Natural Failure Mechanisms Application of Critical Stress Intensity Factors to Evaluate Adhesive Failure at Underfill/Passivation Interface Singularities An Improved Method for Automatic Detection and Location of Defects in Electronic Components Using Scanning Ultrasonic Microscopy, th International Conference on Electronics Packaging Technology. [61], pp.27-32, 2003.
, Use of Signal Processing Imaging for the Study of a 3D Package in Harsh Environment Assembly and Reliability of Flip Chips with a Nano-Filled Wafer Level Underfilll, Electronics Packaging Technology Conference, pp.635-639, 2004.
, High-Temperature Reliability of Flip Chip Assemblies Investigation of Phase Change of Flip Chip Solders During the Second Level Interconnect Reflow Lifetime of Solder Joint and Delamination in Flip Chip Assemblies Effect of Metal Layout Design on Passivation Crack Occurrence using both Experimental and Simulation Techniques " , 5 th Conf. on Thermal an Mechanical Simulation and Experiment in Micro-electronics and Micro-systems, EuroSimE2004 Influence of Temperature and Humidity on Adhesion of Underfills for Flip Chip Packaging Mechanical Related Failure Modes Exposed Die-Top Encapsulation Molding for an Improved High-Performance Flip-Chip BGA Package, Electronic Components and Technology Conference, pp.1172-1186, 2005.
, A Parametric Study of Flip Chip Reliability Based on Solder Fatigue modeling Effects of Geometry and Temperature cycle on the Reliability of WLCSP Solder Joints Improvement in WL-CSP Reliability by Wafer Thinning Failure Mechanisms of Flip Chip DCA Assembly Using Eutectic Solder Influence of Temperature and Humidity on Adhesion of Underfills for Flip Chip packaging Reliability And New Faillure Modes Of Encapsulated Flip Chip On Board Under Thermal Shock Testing Effect of Unfilled Underfill on Drop Test and Thermal Cycle Reliability Solder Joint Reliability Optimization, Proc. BCTM IEEE Inter Society Conference on Thermal Phenomena, p287 IEEE Electronic Components Technology Conference 6th International Conference on Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading School of Computing and Mathematics, pp.175-179, 1997.
, Polymer collar for solder bumps Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints, 2003.
, Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moire interferometry system Singapore Institute of Manufacturing Technology & School of Mechanical and Production Engineering Board Level Solder Reliability vs. Ramp Rate & Dwell Time During Temperature Cycling Advanced Micro Devices Acceleration Factors and Thermal Cycling Test Efficiency for Lead-Free Sn-Ag-Cu Assemblies Modeling the Behavior od Solder Joints for Wafer Level SiP Reliability Analysis of SiP Structures Reliability Based Design Optimisation for System-in-Package, Proceedings of HDP'07 [93] Evaluation and Characterization of Reliable Non-Hermetic Conformal Coatings for Microelectromechanical System (MEMS) Device Encapsulation, pp.2006-92, 2000.
, From chemical building blocks of polymers to microelectronics reliability, 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the, 2004.
DOI : 10.1109/ESIME.2004.1304101
, Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers A simple moisture diffusion model for the prediction of optimal baking schedules for plastic SMD packages Investigation of effect of temperature and strain rate on mechanical properties of underfill material by use of microtensile specimens, 7th International Conference on Electronics Packaging Technology, pp.1668-1671, 2002.
, Characterization and Modeling of Moisture Absorption of Underfill for IC Packaging Effects of moisture and thermal cycling on in-plane shear properties of graphite fibre-reinforced cyanate ester resin composites Qualifying for Moisture-Containing Environments, Composites Part A, vol.27, pp.1-4244, 1996.
, Moisture absorption and desorption predictions for plastic ball grid array packages, 1996 Intersociety Conference on Thermal Phenomena
DOI : 10.1109/95.623021
URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.454.5344
, Effect of Physical Aging on the Creep Deformation on an Epoxy Resin, Mechanics of Time-Dependent Materials, vol.4, pp.9-20, 2000.
, Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites, Polymer, vol.46, issue.7, pp.2297-2305, 2005.
DOI : 10.1016/j.polymer.2005.01.041
, Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999.
DOI : 10.1109/ECTC.1999.776189
, Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive, International Journal of Adhesion and Adhesives, vol.25, issue.1, pp.1-12, 2005.
DOI : 10.1016/j.ijadhadh.2004.02.002
, Structure Property Correlation of epoxy resins under the influence of moisture; and comparison of Diffusion coefficient with MD-simulations, 9th. Int. Conf. on Thermal, Mechanical and Multiphysics Simulation and Equipments in Micro-Electronics and Micro-Systems, 2008.
, Moisture absorption and diffusion characterisation of packaging materials??????advanced treatment, Microelectronics Reliability, vol.43, issue.12, pp.43-2087, 2003.
DOI : 10.1016/S0026-2714(03)00378-0
, Irreversible Interactions Between Water and DGEBA/DDA Epoxy Resin During Hygrothermal Aging, 1997.
DOI : 10.1002/(sici)1097-4628(19970718)65:3<449::aid-app4>3.3.co;2-5
, Dynamic mechanical behaviours of epoxy insulating composites, Proceedings of Electrical/Electronics Insulation Conference, 1993.
DOI : 10.1109/EEIC.1993.630921
, Investigation of relaxation processes in thermally-aged XLPE cablemodels, Conference on Electrical Insulation and Dielectric Phenomena, pp.17-20, 1993.
, Impact of hygrothermal aging on the dynamic mechanical properties of Sheet Molding Compound, Journal of Materials Science, vol.39, issue.4, pp.9822-9826, 2007.
DOI : 10.1007/s10853-007-1990-2
, Modeling of long-term creep behavior of structural epoxy adhesives, International Journal of Adhesion and Adhesives, vol.25, issue.5, pp.427-436, 2005.
DOI : 10.1016/j.ijadhadh.2004.11.009
, Hygrothermal effects on properties of highly conductive epoxy/graphite composites for applications as bipolar plates, Journal of Power Sources, vol.182, issue.1, pp.223-229, 2008.
DOI : 10.1016/j.jpowsour.2008.03.071
, Hygrothermal ageing of an epoxy adhesive used in FRP strengthening of concrete, Journal of Applied Polymer Science, vol.46, issue.4, pp.2607-2617, 2008.
DOI : 10.1002/app.27287
, Study on mobility of water and polymer chain in epoxy and its influence on adhesion, Journal of Applied Polymer Science, vol.172, issue.174, pp.1-8, 2002.
DOI : 10.1002/app.10473
, The durability of epoxy resin coating, Journal of Wuhan University of Technology-Mater. Sci. Ed., vol.44, issue.1, 2008.
DOI : 10.1007/s11595-006-2242-z
, Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis, Microelectronics Reliability, vol.44, issue.1, pp.44-105, 2004.
DOI : 10.1016/j.microrel.2003.07.004
, Low temperature delamination of plastic encapsulated microcircuits, Microelectronics Reliability, vol.38, issue.12, pp.38-1829, 1998.
DOI : 10.1016/S0026-2714(98)00183-8
, The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump, Microelectronics Reliability, vol.46, issue.7, pp.46-1087, 2006.
DOI : 10.1016/j.microrel.2005.07.119
, Comprehensive treatment of moisture induced failure-recent advances, IEEE Transactions on Electronics Packaging Manufacturing, vol.25, issue.3, 2002.
DOI : 10.1109/TEPM.2002.804613
, Moisture Absorption and Desorption of Composite Materials, Journal of Composite Materials, vol.10, issue.1, pp.10-12, 1976.
DOI : 10.1177/002199837601000101
, Effect of chemical structure on the water sorption of amine-cured epoxy resins, Corrosion Science, vol.51, issue.12, pp.51-3000, 2009.
DOI : 10.1016/j.corsci.2009.08.029
, Moisture Absorption and Diffusion Characterization of Molding Compound, Journal of Electronic Packaging, vol.127, issue.4, pp.461-465, 2005.
DOI : 10.1115/1.2065707
, Ageing of polyarnide 11 in acid solutions, pp.1911-1917, 1997.
, The effect of time and aging temperature on structural and mechanical properties of pipeline coating, Materials & Design, vol.30, issue.6, 2006.
DOI : 10.1016/j.matdes.2008.09.003
, Mechanics of Microelectronics, pp.311-320, 2006.
DOI : 10.1007/1-4020-4935-8
, Investigation of inner-layer dielectric (ILD) failure by hygroscopic swelling, 2005.
, Characteristic Times of Moisture Diffusion and Bake-out Conditions for Plastic Encapsulated Parts
, Thermal-spike-enhanced moisture absorption by polymer-matrix carbon-fibre composites, Composites Science and Technology, vol.57, issue.4, pp.451-461, 1997.
DOI : 10.1016/S0266-3538(96)00168-6
, The effect of thermal spiking on moisture absorption, mechanical and viscoelastic properties of carbon fibre reinforced epoxy laminates, Composites Science and Technology, vol.65, issue.7-8, pp.1299-1305, 2005.
DOI : 10.1016/j.compscitech.2005.01.009
, Effect of aging of packaging materials on die surface cracking of a SiP carrier, International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, pp.1-4, 2008.
URL : https://hal.archives-ouvertes.fr/hal-00323423
, The mechanics and impact of hygroscopic swelling of polymer materials in electronic packaging, Transactions of ASME, vol.124, pp.122-126, 2002.
, Moisture diffusion model verification of packaging materials, ICEPT Proceedings, pp.380-384, 2008.
URL : https://hal.archives-ouvertes.fr/hal-00323425
, Fast reliability qualification of SiP products, Microelectronics Reliability, pp.958-926, 2009.
, Moistute effects of a SiP carrier, IEEE EuroSime, pp.379-383, 2009.
, A practical die stress model and its applications in flip-chip packages, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000.
DOI : 10.1109/ITHERM.2000.866852
, Silicon based system in package: Improvement of passive integration process to avoid TBMS failure, Microelectronics Reliability, vol.48, issue.8-9, pp.1258-1262, 2008.
DOI : 10.1016/j.microrel.2008.07.033
, Influence of underfill methods on the solder joint fatigue of wafer level packaging, 2008 International Conference on Electronic Packaging Technology & High Density Packaging, 2008.
DOI : 10.1109/ICEPT.2008.4607137
URL : https://hal.archives-ouvertes.fr/hal-00323432
, Use of signal processing imaging for the study of a 3D package in harsh environment, Microelectronics Reliability, vol.46, issue.9-11, pp.4-163
DOI : 10.1016/j.microrel.2006.07.081
URL : https://hal.archives-ouvertes.fr/hal-00334732
, New Way For Thermal Transient Testing, Fifteenth IEEE SEMI-THERM TM Symposium, 1999.
, Method for the Analysis of Multicomponent Exponential Decay Curves, The Journal of Chemical Physics, vol.31, issue.4, pp.978-986, 1959.
DOI : 10.1063/1.1730560
, Thermal testing methods to increase system reliability, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium, pp.210-217, 1997.
DOI : 10.1109/STHERM.1997.566798
, Identification of RC networks by deconvolution: chances and limits, CAS-45, pp.244-258, 1998.
DOI : 10.1109/81.662698
, Transient Thermal Analysis of Power Leds at Package and Board Level, 2005.
, Electrical, Thermal and Optical Characterization of Power Led Assemblies», 2006.
URL : https://hal.archives-ouvertes.fr/hal-00171395
, Thermal Measurement and Modeling of Multi-Die Packages, IEEE Transactions on Components and Packaging Technologies, vol.32, issue.2, 2006.
DOI : 10.1109/TCAPT.2008.2004578
URL : https://hal.archives-ouvertes.fr/hal-00171396