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Qualification accélérée des composants SiP

Abstract : NXP Semiconductor at Caen, which has System in Package (SiP) technologiesdevelopment competences and NXP Semiconductor at Eindhoven, which has virtualqualification specialization jointed to study fast reliability qualification of SiP products. Athesis focused on simulations started at TU Delft University (Netherlands) with Xiaosong Madirected by Kaspar Jansen and another thesis focused on experimentation started atBordeaux 1 University with Charles Regard directed by Hélène Frémont. These thesis werelead on close collaboration. In a first time, the tests vehicles were defined by both the PhDstudents. Then materials characterizations and simulations were performed at TU Delft, andexperimental qualification tests and physical analyses were performed in Caen. A long ofthese thesis, constant exchanges allowed to correlate simulations by experimentation. Thisindustrial need of SiP product qualification study is due to the strong increase of functionsintegration into mobile equipments. Thus the SiP technology allows to provide in relativeshort time miniaturized products imposed by the new developments.This thesis work's goal is to get methods and techniques to optimize System inPackage (SiP) reliability qualification.
Mots-clés : Sip Circuits intégrés
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Contributor : Jean-Yves Deletage <>
Submitted on : Wednesday, May 14, 2014 - 12:28:54 PM
Last modification on : Thursday, January 11, 2018 - 6:21:09 AM
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  • HAL Id : tel-00990883, version 1


C. Regard. Qualification accélérée des composants SiP. Electronique. Université Sciences et Technologies - Bordeaux I, 2010. Français. ⟨tel-00990883⟩



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