Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures classiques pour des applications haute température, Thèse de doctorat, 2011. ,
Comprendre les problemes de procede de l'electronique de puissance. s.l. : Alstom PEARL, 2006. ,
Advanced in SiC power MOSFET technology. Microelectronics reliability, pp.225-233, 2003. ,
Conception d'un transistor JFET 5kW en SiC-4H. EPF, Toulouse : s.n, 2004. ,
L'electronique de puissance : bases, perspectives et guide de lecture, pp.1-10, 2006. ,
Composants de puissance SiC : technologie. Techniques de l'ingénieur, pp.1-9, 2007. ,
Vers la realisation de conposants haute tension, forte puissance sur diamant CVD, developpement des technologies associees, 2009. ,
GaN: Processing, defects, and devices, Journal of Applied Physics, vol.86, issue.1, pp.1-78, 1999. ,
DOI : 10.1063/1.371145
Etude des proprietes electriques d'un materiau polyimide a haute temperature : applications a la passivation de composants de puissance en carbure de silicium, Thèse de doctorat, 2006. ,
Contribution à l'intégration des convertisseurs de puissance en 3D, Thèse de doctorat, 2008. ,
Contribution a l'etude d'une integration hybride adaptee a l'electronique automobile, Thèse de doctorat, 1992. ,
Power elcetronics modules : design and manufacture, 2005. ,
Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant, IEEE transactions on components, hybrids and manufacturing technology1993, pp.499-504 ,
DOI : 10.1109/33.239878
Thermal analysis of high power modules, IEEE transactions on power electronics, pp.3-11, 2001. ,
Packaging considerations for very high temperature microsystems, Proceedings of IEEE Sensors, pp.1139-1143, 2002. ,
DOI : 10.1109/ICSENS.2002.1037274
Contribution a l'etude de la duree de vie des assemblages de puissance dans des environnements haute temperature et avec des cycles thermiques de grande amplitude ,
URL : https://hal.archives-ouvertes.fr/tel-00091782
Evaluation of substrate technologies under high temperature cycling, 2006. ,
Selected failure mechanisms of modern power modules. Microelectronics reliability, pp.1-15, 2002. ,
Ceramic substrates and micro channel cooler. Nuremberg : s.n, 2006. ,
Sintered aluminim nitride ceramics for high-power electronic applications Journal of the minerals metals and materials society, pp.56-60, 1998. ,
A fritless copper conductor system for power electronic applications. Microelectronics reliability, 2001. ,
Properties of direct aluminium bonded substrates for power semiconductor components, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), 2004. ,
DOI : 10.1109/PESC.2004.1354737
A new substrate for electronics packaging : aluminium-silicon carbide (AlSiC) composites. Santa Clara : s.n., Annual portable by design conference, 1997. ,
Assemblage par diffusion (soudage ou brasage) Techniques de l'ingénieur, 2010. ,
Die attach materials for high temperature applications, IEEE transactions2011, vol.1, pp.457-478 ,
Remplacement du plomb dans les alliages de soudure en microelectronique. CEA-LETI www.sans-plomb ,
Definition d'un dissipateur thermique en milieu industriel, 2002. ,
Reliability and lifetime evaluation of different wire bonding technologies for high power IGBT modules. Microelectronics reliability, pp.1153-1158, 1999. ,
Design and analysis of a dimple array interconnect technique for power electronics packaing, 2002. ,
Large aluminum ribbon bonding : an alternative interconnect solution for power module applications. Long Beach : s.n, International symposium on microelectronics, 2004. ,
Electronique de puissance -Elements de technologie. Techniques de l'ingenieur ,
A new method to detect partial discharges in high voltage power modules, 2003. ,
Lead-free Solders in Microelectronics, Materials Science and Engineering: R: Reports, vol.27, issue.5-6, 2000. ,
DOI : 10.1016/S0927-796X(00)00010-3
Database for solder properties with emphasis on new lead-free solders. 11 Février, 2002. ,
Lead free solders in electronics ,
Reliability of Sn???Ag???Sb lead-free solder joints, Materials science and engineering, 2005. ,
DOI : 10.1016/j.msea.2005.07.049
Investigation on diffusion soldering in Cu, Cu systems, 2002. ,
Modeling Material Properties of Lead-Free Solder Alloys, Journal of Electronic Materials, vol.413, issue.414, 2007. ,
DOI : 10.1007/s11664-007-0218-1
Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment, Journal of Electronic Materials, vol.6, issue.7, 2002. ,
DOI : 10.1007/s11664-002-0016-8
Nano copper wires interconnection for three — dimensional integration in power electronics, 2008 IEEE Power Electronics Specialists Conference, 2008. ,
DOI : 10.1109/PESC.2008.4591940
Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation, Materials Letters, vol.60, issue.19, 2006. ,
DOI : 10.1016/j.matlet.2005.12.132
Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials, Journal of Electronic Materials, vol.90, issue.4, 2001. ,
DOI : 10.1007/s11664-001-0053-8
Lead-free solder -New methodology and perception ,
Study of Sn-Bi-Cu Lead-free Solder, 2008 10th Electronics Packaging Technology Conference, 2008. ,
DOI : 10.1109/EPTC.2008.4763623
High-temperature lead-free solder alternatives, Microelectronic Engineering, vol.88, issue.6, 2011. ,
DOI : 10.1016/j.mee.2010.12.072
Etude et mise en oeuvre de techniques d'assemblages hybrides pour l'intégration tridimensionnelle en électronique de puissance, Thèse de doctorat UNS, 2010. ,
Packaging and interconnection technologies of power devices, challenges and future trends. World academy of science, Engineering and technology, 2009. ,
Microfabricated adhesive mimicking gecko foot-hair, Nature Materials, vol.2, issue.7, 2003. ,
DOI : 10.1038/nmat917
Evidence for van der Waals adhesion in gecko setae, Proceedings of the National Academy of Sciences, vol.99, issue.19, pp.12252-12256, 2002. ,
DOI : 10.1073/pnas.192252799
Bonding and energy dissipation in a nanohook assembly. Physical review letters, p.16, 2003. ,
Formation and assembly of carbon nanotube bumps for interconnection applications. Diamond and related materials, 2009. ,
Coiled carbon nanotubes: Synthesis and their potential applications in advanced composite structures, Composites Part B: Engineering, vol.37, issue.6, 2006. ,
DOI : 10.1016/j.compositesb.2006.02.008
Nouvelle connectique adaptée à l'intégration 3D dans l'électronique de puissance. Toulouse : s.n, Thèse de doctorat, 2010. ,
Recent advances in isotropic conductive adhesives for electronics packaging applications, International Journal of Adhesion and Adhesives, vol.28, issue.7, 2008. ,
DOI : 10.1016/j.ijadhadh.2007.10.004
Adhesive die attach for power application : performance and reliability in plastic package. Microelectronics reliability, 2002. ,
Processing and characterization of microscale and nanoscale silver paste for power semiconductor device attachment, Thèse de doctorat, Virginia Polytechnic Intitute (USA), 2005. ,
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications, Materials science and engineering, 2006. ,
DOI : 10.1016/j.mser.2006.01.001
Die-attachment solutions for SiC power devices. Microelectronics reliability, 2009. ,
Semi-conductor joining by solid liquid interdiffusion (SLID) process, Journal of applied physics, vol.113, pp.1282-1288, 1966. ,
Self-heating synthesis of materials. Annual review of materials science, pp.305-334, 1991. ,
TLP bonding : a new method for joining heating resisting alloys. Welding journal, pp.203-214, 1974. ,
Transient liquid-phase bonding. Annual review of materials science, pp.23-46, 1992. ,
Transient liquid phase die attach for hightemperature solicon carbide power devices, IEEE transactions on components and packaging technologies, 2010. ,
Transient liquid phase bonding. Science and technology of welding and joining, pp.283-300, 2004. ,
et. New assembly and interconnects beyond sintering methods, 2010. ,
URL : https://hal.archives-ouvertes.fr/halshs-00197914
Deposition of solder for micro-joining on MEMS components by means of magnetron sputtering, Surface and coatings technology, vol.142, pp.813-816, 2001. ,
Eutectic brazing of zircaloy 2 to type 204 stainless steel. Welding journal, pp.78-83, 1962. ,
Novel large area joining technique for improved power device performance, Conference Record of the IEEE Industry Applications Society Annual Meeting, 1991. ,
DOI : 10.1109/IAS.1989.96818
Sinter technology enhances power module robustness. 1 Octobre Power electronics technology, 2009. ,
Power module design without solder interfaces -an idal solution for hybrid vehicle traction application, 2009. ,
Sintering: densification, grain growth and microstructure, 2005. ,
Frittage : aspects physicochimiques, 2005. ,
URL : https://hal.archives-ouvertes.fr/emse-00497549
Elaboration et caractérisation de composites duplex "composites tricouches à base d'alumine, Thèse de doctorat, 1997. ,
Rôle des propriétés des granules pour la fabrication de pièces de poudres céramiques sans défaut de compaction, Thèse de doctorat, 1992. ,
Hindrance of Grain Growth in Al2O3 by ZrO2 Inclusions., Journal of the American Ceramic Society, vol.48, issue.10, pp.164-168, 1984. ,
DOI : 10.1111/j.1151-2916.1984.tb19734.x
Céramiques et verres : principes et techniques d'élaboration. Presses polytechniques et universitaires romandes ,
Low temperature sinter technology die attachment for automotive power electronic applications, 2006. ,
Double-sided low-temperature joining technique for power cycling capability at high temperature, 2005 European Conference on Power Electronics and Applications, 2005. ,
DOI : 10.1109/EPE.2005.219523
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow, IEEE Transactions on Electronics Packaging Manufacturing, vol.25, issue.4, 2002. ,
DOI : 10.1109/TEPM.2002.807719
Pressure sintering for power modules, 2007. ,
Reliability of high temperature solder alternatives. Microelectronics reliability, 2006. ,
Novel silver contact paste lead free solutions for die attach, 2013. ,
et. Low-temperature sintering of nanoscale silver paste for power chip attachment, 2007. ,
URL : https://hal.archives-ouvertes.fr/hal-01329083
et. Development of a nano structure based interconnection technology, Nanotech in Northern Europe, 2006. ,
Ag Nanoparticle Paste Synthesis for Room Temperature Bonding, IEEE Transactions on Components and Packaging Technologies, vol.33, issue.2, 2010. ,
DOI : 10.1109/TCAPT.2009.2031680
Sintering of Silver Nanoparticles for the Formation of High Temperature Interconnect Joints, Materials research society, 2006. ,
DOI : 10.1109/TEPM.2002.807719
Low temperature, pressure-assisted sintering of nanoparticulate silver films, Acta Materialia, vol.56, issue.8, 2007. ,
DOI : 10.1016/j.actamat.2007.12.034
Low-pressure (<5 MPa) low-temperature joining of large-area chips on copper using nanosilver paste, CIPS ,
Low-temperature sintering of nanoscale silver paste for semiconductor device interconnection, Thèse de doctorat, Virginia Polytechnic Institute (USA), 2005. ,
et. Low-temperature sintered nanoscale silver as a novel semiconductor device-mettalized substrate interconnect material, 2005. ,
URL : https://hal.archives-ouvertes.fr/halshs-00176733
et. Low-temperature and pressureless sintering technology for highperformance and high temperature interconnection of semiconductor devices, Eurosime, 2007. ,
URL : https://hal.archives-ouvertes.fr/hal-01329083
Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly, IEEE Transactions on Device and Materials Reliability, vol.6, issue.3, 2006. ,
DOI : 10.1109/TDMR.2006.882196
New Silver Paste for Die-Attaching Ceramic Light-Emitting Diode Packages, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.1, issue.5, 2011. ,
DOI : 10.1109/TCPMT.2010.2103378
Low-temperature sintering of nanoscale silver paste for attaching largearea (>100 mm2) chips, IEEE Transactions on components and packaging technology, vol.33, 2010. ,
Present problems of power module packaging technology. Microelectronics reliability, pp.1-9, 2003. ,
Failure modes and FEM analysis of power electronic packaging. Finite elecments in analysis and design, 2001. ,
Failure analysis of power modules : a look at the packaging and reliability of large IGBT's. IEEE Transactions on components and hybrids mafacturing technology, pp.412-417, 1993. ,
Thermal fatigue and failure of electronic power device substrates, International Journal of Fatigue, vol.31, issue.11-12, pp.1-6, 2009. ,
DOI : 10.1016/j.ijfatigue.2009.03.011
URL : https://hal.archives-ouvertes.fr/hal-00417898
Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder. Mechanicics of materials, pp.1-4, 2008. ,
Integrated numerical-experimental analysis of interfacial fatigue fracture in SnAgCu solder joints. Welding journal, pp.5680-5694, 2007. ,
Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy. Scripta materiala, 2005. ,
Effect of anisotropy of tin on thermomechanical behavior of solder joints, Journal of Materials Science: Materials in Electronics, vol.15, issue.4, pp.235-240, 2004. ,
DOI : 10.1023/B:JMSE.0000012461.69417.75
The effect of board stiffness on the solderjoint reliability of HVGFN-packages. Eurosime, 2007. ,
Design for reliability of power electronics modules. Microelectronics reliability, 2009. ,
New avenues for failure analysis. Engineering failure analysis, pp.1-8, 2009. ,
Explosion tests on IGBT high voltage modules, 11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings (Cat. No.99CH36312), 1999. ,
DOI : 10.1109/ISPSD.1999.764079
Cosmic ray induced failures in high power semiconductor devices. Microelectronics reliability, pp.1711-1718, 1997. ,
Reliability of high temperature solder alternatives. Microelectronics reliability, 2004. ,
Octobre http://www.metaux-precieux.fr, 2013. ,
A review on die attach materials for SiCbased high-temperature power devices. Metallurgical and material transactions, 2010. ,
Contribution a la conception thermomecanique optimisee d'assemblage sans plomb, Thèse de doctorat, 2005. ,
Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment, Materials & Design, vol.30, issue.10, pp.4574-4579, 2009. ,
DOI : 10.1016/j.matdes.2009.04.006
Impact of ball via configuration on solder joint reliability in tape based chip-scale packages Proceeding of the 52nd electronic components and technology conference. 128. Electrolube, 2002. ,
Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode, IEEE Transactions on Components and Packaging Technologies, vol.26, issue.2, 2003. ,
DOI : 10.1109/TCAPT.2003.815112
An internal variable constitutive model for hot working of metals, International Journal of Plasticity, vol.5, issue.2, 1989. ,
DOI : 10.1016/0749-6419(89)90025-9
Nanoporosite, texture et proprietes mecaniques de pates de ciments, These universitaire, 2003. ,
URL : https://hal.archives-ouvertes.fr/tel-00007576
Double-sided cooling for high power IGBT modules using flip chip technology, IEE Transactions on components and packaging technologies, 2001. ,
Low-pressure (<5 MPa) low-temperature joining of large-area chips on copper using nanosilver paste, CIPS ,