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Contribution à l'étude, la mise en œuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température

Abstract : This work is part of the research for lead-free die-attach solutions for power modules to offer a solution to the European directive RoHS, which banishes lead in electrical and electronic equipments. The intrinsic silver properties and the previous work published helped us choose silver sintering as the die-attach technology to be tested and evaluated in our work. After a state of the art on power module structure, on different die-attach technologies and on power module reliability, various works have been carried out in collaboration with the FIDEA and ASPEEC projects. Through experimental tests and finite element modeling analysis (FEM), die-attach processes have been defined, thermal and mechanical characterizations and reliability assessment of silver sintered power modules have been done. Finally, a silver sintered rectifier bridge double side assembly with higher thermomechanical properties than a lead-solder die-attach assembly was developed as final prototype.
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https://tel.archives-ouvertes.fr/tel-00988784
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Submitted on : Wednesday, May 14, 2014 - 11:55:16 AM
Last modification on : Thursday, January 11, 2018 - 6:21:09 AM
Document(s) archivé(s) le : Monday, April 10, 2017 - 8:14:18 PM

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  • HAL Id : tel-00988784, version 1

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François Le Henaff. Contribution à l'étude, la mise en œuvre et à l'évaluation d'une solution de report de puce de puissance par procédé de frittage de pâte d'argent à haute pression et basse température. Electronique. Université Sciences et Technologies - Bordeaux I, 2014. Français. ⟨tel-00988784⟩

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