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CONTRIBUTION A L'ETUDE D'ASSEMBLAGES ELECTRONIQUES SUR CIRCUITS IMPRIMES A HAUTE DENSITE D'INTEGRATION COMPORTANT UN NOMBRE DE COUCHES IMPORTANT ET DES CONDENSATEURS ENTERRES

Abstract : This thesis, which is part of the European EMCOMIT project, aims at contributing to the study of high density printed circuit board including a great number of internal layers and embedded components. The qualification of this technology is done by the way of simulations and electrical measurements on specific test vehicles. The electrical results allow estimating the performance of materials for telecommunication applications and speed data transfer. The reliability of the assembly of the large BGA on a printed circuit board has been evaluated. Thermomechanical simulations have been done in order to compute residual stresses stored during the assembly process and the deformation energy density in the solder joints during one thermal cycle. Simultaneously BGA soldered on printed circuits have been positioned in climatic chamber and have been subjected to temperature variations.
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https://tel.archives-ouvertes.fr/tel-00988349
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Submitted on : Wednesday, May 7, 2014 - 6:01:33 PM
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  • HAL Id : tel-00988349, version 1

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Jérôme Puil. CONTRIBUTION A L'ETUDE D'ASSEMBLAGES ELECTRONIQUES SUR CIRCUITS IMPRIMES A HAUTE DENSITE D'INTEGRATION COMPORTANT UN NOMBRE DE COUCHES IMPORTANT ET DES CONDENSATEURS ENTERRES. Electronique. Université Sciences et Technologies - Bordeaux I, 2008. Français. ⟨tel-00988349⟩

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