Skip to Main content Skip to Navigation
Theses

Etude de fiabilité des modules d'électronique de puissance à base de composant SiC pour applications hautes températures

Abstract : The environments tend to be more severe (hotter and sometimes colder). As such, the high temperature power electronics is a major challenge for the future. Concerning the technologies for high temperature assembly, high temperature brazing alloy as 88Au / 12Ge, 97Au / 3Si and 5Sn / 95Pb could support these levels of thermal stresses, which are being developed to answer these requirements. We performed the electric, mechanical and thermomechanical characterizations for the materials of assembly. A thermal study was realized by experimental methods and numerical simulations, the numerical study is carried out in ANSYS in order to estimate the influences of the various parameters on the thermal performance of the assembly. In addition, the passive thermal cycles of large amplitude are conducted to analyze the reliability of the power modules in these conditions.
Document type :
Theses
Complete list of metadatas

Cited literature [32 references]  Display  Hide  Download

https://tel.archives-ouvertes.fr/tel-00988235
Contributor : Jean-Yves Deletage <>
Submitted on : Wednesday, May 7, 2014 - 4:15:38 PM
Last modification on : Thursday, January 11, 2018 - 6:21:09 AM
Document(s) archivé(s) le : Thursday, August 7, 2014 - 11:41:17 AM

Identifiers

  • HAL Id : tel-00988235, version 1

Citation

Ludi Zhang. Etude de fiabilité des modules d'électronique de puissance à base de composant SiC pour applications hautes températures. Electronique. Université Sciences et Technologies - Bordeaux I, 2012. Français. ⟨tel-00988235⟩

Share

Metrics

Record views

695

Files downloads

3678