Lead-free Solders in Microelectronics Materials Science and Engineering: R: Reports, pp.5-695, 2000. ,
Power device packaging: reliability and wear out phenomena, 2008. ,
L'eíectronique de puissance : Bases, perspectives et guide de lecture, pp.1-10, 2006. ,
Double-sided low-temperature joining technique for power cycling capability at high temperature, 2005 European Conference on Power Electronics and Applications, pp.1-10, 2005. ,
DOI : 10.1109/EPE.2005.219523
Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends, World Academy of Science, Engineering and Technology, vol.25, pp.691-694, 2009. ,
Spark-plasma-sintering (SPS) of nanostructured and submicron titanium oxide powders, Materials Science and Engineering: A, vol.381, issue.1-2, pp.16-19, 2004. ,
DOI : 10.1016/j.msea.2004.02.009
The Spark-Plasma-Sintering (SPS) Process in Comparison with Various Conventional Compaction Methods, Pulse Electric Current Synthesis and Processing of Materials, pp.23-35, 2006. ,
DOI : 10.1002/9780470082751.ch2
Comparative thermal and thermomecanical analyses of solder-bump and direct-solder bonded power devices packages having double sided cooling capability, IEEE Applied Power Electronics Conference and Exposition. Available at, 2004. ,
Applications of Powder Metallurgy Molybdenum in the 1990s Advances in Powder Metallurgy, pp.321-331, 1991. ,
Analyse EBSD: Principe et cartographies d'orientation, 2010. ,
Chimie-Physique du frittage, 1993. ,
Frittage : aspects physico-chimiques-Partie 1: frittage en phase solide, AF6620), 2005. ,
Méthodes de caractérisation mécanique des matériaux, Available at, 2007. ,
Fine-grained transparent MgAl2O4 spinel obtained by spark plasma sintering of commercially available nanopowders, Ceramics International, vol.38, issue.1, pp.131-140, 2012. ,
DOI : 10.1016/j.ceramint.2011.06.045
Molybdenum : an outline of its chemistry and uses Available at: http, Studies in organic chemistry, vol.19, pp.662-62397, 1994. ,
Aluminium nitride package for high-temperature applications, Third Internationnal High-Temperature Electronics Conference, pp.95-100, 1996. ,
Conception, Reálisation et Caracte?risationCaracte?risation d'interrupteurs (thyristors et JFETs) haute tension (5kV) en carbure de silicium, 2004. ,
Polishing Cloth Guide Available at, 2011. ,
Compact Inverter Designed for High-Temperature Operation, 2007 IEEE Power Electronics Specialists Conference, 2007. ,
DOI : 10.1109/PESC.2007.4342357
Available at, pp.2241-2247 ,
Modules et boi? tiers de puissance (packaging) Techniques de l'ingénieur, tome D3116, pp.1-18, 2010. ,
State of the art of high temperature power electronics, Materials Science and Engineering: B, vol.176, issue.4, pp.283-288, 2011. ,
DOI : 10.1016/j.mseb.2010.10.003
URL : https://hal.archives-ouvertes.fr/hal-00597432
Three-dimensional packaging for power semiconductor devices and modules, IEEE Transactions on Advanced Packaging, vol.28, issue.3, pp.404-412, 2005. ,
DOI : 10.1109/TADVP.2005.852837
Mate?riauxMate?riaux semiconducteurs a? grand gap : le carbure de silicium (SiC), pp.1-17, 2012. ,
Mécanique du solide et des matériaux Elasticité-Plasticité-Rupture Available at, 2005. ,
Ceramic Substrates for High-temperature Electronic Integration, Journal of Electronic Materials, vol.8, issue.1, pp.164-174, 2009. ,
DOI : 10.1007/s11664-008-0571-8
Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration, Journal of Electronic Materials, vol.37, issue.12, pp.1464-1467, 2005. ,
DOI : 10.1007/s11664-005-0151-0
Microstructure examination of copper wafer bonding, Journal of Electronic Materials, vol.71, issue.23, pp.331-335, 2001. ,
DOI : 10.1007/s11664-001-0039-6
Fundamental investigations on the spark plasma sintering/synthesis process, Materials Science and Engineering: A, vol.394, issue.1-2, pp.132-138, 2005. ,
DOI : 10.1016/j.msea.2004.11.020
Reliability Assessment of High Temperature Electronics and Packaging Technologies for Venus Mission, IEEE 46 Annual International Reliability Physics Symposium (IRPS). Phoenix. Available at, 2008. ,
Sintering of Refractory Metals, 1984. ,
Sintering of molybdenum metal powder using microwave energy, Powder Metallurgy, vol.111, issue.9, pp.182-187, 2008. ,
DOI : 10.1557/JMR.2002.0437
The effect of la-silican oxynitride on the densification of Si3N4 Ceramics by spark plasma sintering, Journal of the Korean Ceramic Society, vol.38, issue.8, pp.687-692, 2001. ,
Selected failure mechanisms of modern power modules Microelectronics Reliability Available at, pp.653-667, 2002. ,
Vers la reálisation de composants haute tension, forte puissance sur diamant CVD, 2009. ,
Le frittage sous son aspect physico-chimique " paru dans : Extrait de l'industrie céramique, 1968. ,
Principes d'Expe?rimentationExpe?rimentation: Planification des Expe?riencesExpe?riences et Analyse de Leurs Re?sultatsRe?sultats, 2003. ,
Using Design of Experiments and Virtual Instrumentation to Evaluate the Tribocharging of Pulverulent Materials in Compressed-Air Devices, IEEE Transactions on Industry Applications, vol.44, issue.1, pp.3-8, 2008. ,
DOI : 10.1109/TIA.2007.912801
URL : https://hal.archives-ouvertes.fr/hal-00368755
Extension of High-Temperature Electronics, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.2, issue.4, pp.399-404, 1979. ,
DOI : 10.1109/TCHMT.1979.1135491
Available at, Data Sheet & Processing Information ,
Contribution a? l'e?tudee?tude de la dureé de vie des assemblages de puissance dans les environnements haute tempe?raturetempe?rature et avec des cycles thermiques de grande amplitude, 2006. ,
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability, pp.9-111766, 2006. ,
Evaluation of Substrate Technologies under High Temperature Cycling, 4th International Conference on Integrated Power Systems (CIPS). pp. 1?6. Available at, 2006. ,
Diffusion bonding and brazing of high purity copper for linear collider accelerator structures, Physical Review Special Topics - Accelerators and Beams, vol.4, issue.5, p.53502, 2001. ,
DOI : 10.1103/PhysRevSTAB.4.053502
Performance comparison of state-of-the-art heterojunction bipolar devices (HBT) based on AlGaAs/GaAs, Si/SiGe and InGaAs/InP, Microelectronics Journal, vol.35, issue.11, pp.901-908, 2004. ,
DOI : 10.1016/j.mejo.2004.07.003
Mise en forme des matériaux par frittage flash, 2006. ,
Elaboration of architectured materials by spark plasma sintering Available at, Materials Science Forum, pp.706-7091885, 2012. ,
Microscopie électronique à balayage Microanalyse X par sonde électronique, Available at, 2004. ,
Copper Wafer Bonding, Electrochemical and Solid-State Letters, vol.2, issue.10, pp.534-536, 1999. ,
DOI : 10.1149/1.1390894
Thin Film Multichip Packaging for High Temperature Digital Electronics, IMAPS High Temperature Electronics Network (HiTEN), 2011. ,
DOI : 10.4071/HITEN-Paper1-RWJohnson
Effect of die compaction pressure on densification behavior of molybdenum powders, International Journal of Refractory Metals and Hard Materials, vol.25, issue.1, pp.16-24, 2007. ,
DOI : 10.1016/j.ijrmhm.2005.10.014
Sintering Theory and Practice, 1996. ,
Sintering molybdenum treated with Ni, Pd and Pt, International Journal of Powder Metallurgy and Powder Technology, vol.18, pp.147-150, 1982. ,
Heterodiffusion model for the activated sintering of molybdenum, Journal of the Less Common Metals, vol.58, issue.1, pp.61-740022, 1978. ,
DOI : 10.1016/0022-5088(78)90071-1
Low temperature sinter technology Die attachment for automotive power electronic applications, Automotive Power Electronics, p.5, 2006. ,
Application de la diffraction des eíectrons re?trodiffuse?sre?trodiffuse?re?trodiffuse?s (EBSD) a? l'e?tudee?tude des changements de phase dans les mate?riauxmate?riaux cristallins, Mécanique et mécanismes des changements de phase. AUSSOIS. Available at, 2009. ,
Les modules de puissance gagnent en fiabilite?gra?fiabilite?gra? ce aux contacts ressorts, Electronique, issue.174, pp.46-47, 2006. ,
Electric current activated/assisted sintering (ECAS): a review of patents, Science and Technology of Advanced Materials, vol.10, issue.5, pp.1-24, 1906. ,
The Deformation and Ageing of Mild Steel: III Discussion of Results, Proceedings of the Physical Society. Section B, vol.64, issue.9, pp.7470370-1301, 1951. ,
DOI : 10.1088/0370-1301/64/9/303
Increased lifetime of wire bonding connections for IGBT power modules, APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181), 2001. ,
DOI : 10.1109/APEC.2001.912494
Available at ,
Introduction to Semiconductor Packaging in High Power Electronics, Seminaire ECPE, 2004. ,
A Hybrid Integrated Power Electronic Module Based On Pressure Contact Technology, 37th IEEE Power Electronics Specialists Conference. Jeju. Available at, 2006. ,
Hi-Bond Polyimide Adhesive Tape 12mmx33m Available at ,
Decrease of yield strength in molybdenum by adding small amounts of Group VIII elements, Journal of Alloys and Compounds, vol.381, issue.1-2, pp.192-196, 2004. ,
DOI : 10.1016/j.jallcom.2004.03.112
Deoxidation of molybdenum during vacuum sintering, Metallurgical and Materials Transactions A, vol.45, issue.6, pp.657-664, 2002. ,
DOI : 10.1007/s11661-002-0127-0
Frittage et moulage de pièces en PTFE, Available at, 2012. ,
Carbide layer growth behaviour in a molybdenum coating on graphite at elevated temperatures Available at, Journal of the Less Common Metals, vol.14789, issue.2, pp.261-2680022, 1989. ,
Micriwave Plasma Sintering of Alumina, American Ceramic Society Bulletin, vol.64, issue.8, pp.1132-1136, 1985. ,
Le frittage des céramiques Available at ,
SPS TECHNOLOGY -A NEW RANGE OF POSSIBILITIES FOR THE " FAST " CONSOLIDATION OF INNOVATIVE MATERIALS, 2012. ,
Densification behavior of Mo nanopowders prepared by mechanochemical processing, Journal of Alloys and Compounds, vol.469, issue.1-2, pp.401-405, 2009. ,
DOI : 10.1016/j.jallcom.2008.01.149
Room temperature Cu???Cu direct bonding using surface activated bonding method, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.21, issue.2, pp.449-453, 2003. ,
DOI : 10.1116/1.1537716
Formation of diamond p???n junction and its optical emission characteristics, Diamond and Related Materials, vol.11, issue.3-6, pp.307-311, 2002. ,
DOI : 10.1016/S0925-9635(01)00537-4
Electroplating moulds using dry film thick negative photoresist, Journal of Micromechanics and Microengineering, vol.13, issue.4, pp.67-74, 2003. ,
DOI : 10.1088/0960-1317/13/4/311
Surface Observation of Pulsed Electric Current Sintered Alumina Balls., Journal of the Ceramic Society of Japan, vol.107, issue.1242, pp.187-189, 1999. ,
DOI : 10.2109/jcersj.107.187
Direct bonded aluminum on aluminum nitride substrates via a transient liquid phase and its application, 6th International Conference onIntegrated Power Electronics Systems (CIPS). Nuremberg, pp.1-5, 2010. ,
Transparent polycrystalline alumina obtained by SPS: Green bodies processing effect, Les nanosciences, 2. Nanomate?riauxNanomate?riaux et nanochimie Belin, pp.2909-2915, 2006. ,
Diffusion in Solid Metals and Alloys H. Mehrer, Groupe III Condensed Matter, 26. Available at, 1990. ,
Reliability of spring pressure contacts under environmental stress. Microelectronics Reliability Available at, pp.1771-1776, 2007. ,
Low Temperature Copper to Copper Direct Bonding, pp.L1068?L1069. Available at, 1998. ,
DOI : 10.1143/JJAP.37.L1068
Integrated Packaging of a 1 kW Switching Module Using a Novel Planar Integration Technology, IEEE Transactions on Power Electronics, vol.19, issue.1, pp.242-250, 2004. ,
DOI : 10.1109/TPEL.2003.820597
Properties of direct aluminium bonded substrates for power semiconductor components Available at, IEEE 35th Annual Power Electronics Specialists Conference, pp.4171-4177, 2004. ,
Effects of carbon on the stability and chemical performance of transition metal carbides:???A density functional study, The Journal of Chemical Physics, vol.120, issue.11, p.5414, 2004. ,
DOI : 10.1063/1.1647050
Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips, 2001. ,
Screen-printed copper superthick-films for power hybrids, IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203), pp.44-45, 1998. ,
DOI : 10.1109/IWIPP.1998.722257
Aircraft engine oils and their behaviour at high temperatures, Journal of Synthetic Lubrication, vol.3, issue.3, pp.163-180, 1986. ,
DOI : 10.1002/jsl.3000030302
High-temperature aluminium nitride packaging Available at, Third Internationnal High- Temperature Electronics Conference, pp.103-108, 1996. ,
Mise en oeuvre de techniques d'attaches de puces alternatives aux brasures classiques pour des applications haute tempe?raturetempe?rature, 2011. ,
Packaging of Power Electronics for High Temperature Applications Advanced Microelectronics Available at: http://www.calce.umd, pp.19-24, 1998. ,
Compendium of Chemical Terminology, the " Gold Book, 1997. ,
Contribution a? l'inte?grationinte?gration des convertisseurs de puissance en 3D, 2008. ,
Traité des matériaux: Introduction à la science des matériaux, Presses polytechniques et universitaires Romandes. Available at, 1999. ,
New structure of power integrated module, IEEE International Conference on Integrated Power Systems, 2006. ,
Les nuances de graphite Available at: http://www.mersen.com/uploads/tx_mersen/19-nuances-graphite- mersen_01 ,
PAPYEX Graphite souple Available at: http://www.mersen.com/uploads/tx_mersen/12- PAPYEX-graphite-souple-Mersen_03, 2012. ,
Abrasive Grinding Paper Available at: http://www.metallographic, 2011. ,
The effect of electric field and pressure on the synthesis and consolidation of materials: A review of the spark plasma sintering method, Journal of Materials Science, vol.19, issue.452, pp.763-777, 2006. ,
DOI : 10.1007/s10853-006-6555-2
A NEW SUBSTATE FOR ELECTRONICS PACKAGING: ALUMINUM-SILICON CARBIDE (AlSiC) COMPOSITES, Proceedings of the forth Annual Portable by Design Conference, Electronics Design, pp.398-403, 1997. ,
Densification behaviour of pure molybdenum powder by spark plasma sintering, International Journal of Refractory Metals and Hard Materials, vol.28, issue.4, pp.550-557, 2010. ,
DOI : 10.1016/j.ijrmhm.2010.03.003
Sintering, consolidation, reaction and crystal growth by the spark plasma system (SPS), Materials Science and Engineering: A, vol.287, issue.2, 2000. ,
DOI : 10.1016/S0921-5093(00)00773-5
Characterization of Molybdenum Carbides for Methane Reforming by TPR, XRD, and XPS, The Journal of Physical Chemistry B, vol.105, issue.38, pp.9124-9131, 2001. ,
DOI : 10.1021/jp0111867
Sintering Phenomena on Initial Stage in Pulsed Current Sintering., Journal of the Japan Society of Powder and Powder Metallurgy, vol.47, issue.3, pp.293-297, 2000. ,
DOI : 10.2497/jjspm.47.293
A new power module packaging technology for enhanced thermal performance In The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). Las Vegas, NV, pp.287-296, 2000. ,
The structure of dimolybdenum carbide by neutron diffraction technique, Acta Crystallographica, vol.16, issue.3, pp.202-205, 1963. ,
DOI : 10.1107/S0365110X63000487
GaN: Processing, defects, and devices, Journal of Applied Physics, vol.86, issue.1, pp.1-78, 1999. ,
DOI : 10.1063/1.371145
Handbook of Refractory Carbides and Nitrides: Properties, Characteristics, Processing and Applications N. Publications, 1996. ,
How Materials Behaviour affects Power Electronics Reliability, 6th International Conference onIntegrated Power Electronics Systems (CIPS), pp.1-6, 2010. ,
Available at: http://www.lmt.ens-cachan.fr/cours, Me?caniqueMe?canique des Mate?riauxMate?riaux, 2010. ,
Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications, 7th International Conference on Integrated Power Electronics Systems (CIPS),. Nuremberg, pp.1-6, 2012. ,
MATERIALS PROPERTIES OF NITRIDES: SUMMARY, International Journal of High Speed Electronics and Systems, vol.14, issue.01, pp.1-19, 2004. ,
DOI : 10.1142/S012915640400220X
Handbook of the physicochemical properties of the elements, 1968. ,
An aluminum nitride package for 600 °C and beyond Available at, Fourth International High Temperature Electronics Conference (HITEC), pp.265-268, 1998. ,
Advantages and new development of direct bonded copper substrates. Microelectronics Reliability, pp.359-365, 2003. ,
Ceramic substrates and micro-channel cooler, ECPE seminar: High Temperature Electronic and Thermal management, 2006. ,
Novel large area joining technique for improved power device performance, IEEE Transactions on Industry Applications, vol.27, issue.1, pp.93-95, 1991. ,
DOI : 10.1109/28.67536
Power electronic modules, design and manufacture, 2005. ,
Molybdenum applications in the electronics market, JOM, vol.35, issue.8, pp.37-39, 2000. ,
DOI : 10.1007/s11837-000-0099-8
Bumpless Interconnect of Cu Electrodes in Millions-Pins Level, 56th Electronic Components and Technology Conference 2006, pp.1223-1226, 2006. ,
DOI : 10.1109/ECTC.2006.1645808
Transparent YAG obtained by spark plasma sintering of co-precipitated powder. Influence of dispersion route and sintering parameters on optical and microstructural characteristics, Journal of the European Ceramic Society, vol.32, issue.11, pp.2957-2964, 2012. ,
DOI : 10.1016/j.jeurceramsoc.2012.02.052
The microhardness and microstructural characteristics of bulk molybdenum samples obtained by consolidating nanopowders by plasma pressure compaction, International Journal of Refractory Metals and Hard Materials, vol.20, issue.3, pp.181-186, 2002. ,
DOI : 10.1016/S0263-4368(01)00076-2
The microstructure and hardness of molybdenum powders consolidated by plasma pressure compaction, Powder Technology, vol.114, issue.1-3, pp.136-144, 2001. ,
DOI : 10.1016/S0032-5910(00)00285-0
Electric-Field Effects on Sintering and Reaction to Form Aluminum Titanate from Binary Alumina-Titania Sol-Gel Powders, Journal of the American Ceramic Society, vol.13, issue.14, pp.983-985, 2001. ,
DOI : 10.1111/j.1151-2916.2001.tb00778.x
Available at ,
3kV 600A 4H-SiC High Temperature Diode Module Available at: http, IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2002. ,
Physics of semiconductor Devices, 2007. ,
Formation of Cu???Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum, Applied Physics Letters, vol.90, issue.15, 2007. ,
DOI : 10.1063/1.2720297
Transmission Electron Microscope Observations of Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation, Japanese Journal of Applied Physics, vol.38, issue.Part 1, No. 3A, pp.1589-1594, 1999. ,
DOI : 10.1143/JJAP.38.1589
Surface activated bonding of silicon wafers at room temperature, Applied Physics Letters, vol.68, issue.16, pp.2222-2224, 1996. ,
DOI : 10.1063/1.115865
Proprie?te?sProprie?te?Proprie?te?s de transport de a-SiC : Application aux composants eíectroniques, 2003. ,
Mechanism of Spark Plasma Sintering Sumitomo Coal Mining Company Available at: http://xa.yimg.com/kq/groups, SUMITOMO%2BREVIEW-Spark-Plasma- Sintering.pdf, 3862917. ,
Composants de puissance en SiC : Technologie. Techniques de l'ingénieur, tome D3120, pp.1-9, 2007. ,
Reliability of Contacts for Press-Pack High-Power Devices. Microelectronics Reliability, pp.9-111676, 2005. ,
Electron microscopy observation of interface in diffusion-bonded copper joint, Journal of Electron Microscopy, vol.53, issue.2, pp.157-161, 2004. ,
DOI : 10.1093/jmicro/53.2.157
Effect of sintering time on the microstructure and properties of inorganic polyphosphate bioceramics, Science of Sintering, vol.42, issue.3, pp.337-343, 2010. ,
DOI : 10.2298/SOS1003337W
Planar Interconnect Technology for Power Module System Integration, IEEE International Conference on Integrated Power Systems (CIPS), 2012. ,
Transfer of metal MEMS packages using a wafer-level solder transfer technique, IEEE Transactions on Advanced Packaging, vol.28, issue.4, pp.643-649, 2005. ,
DOI : 10.1109/TADVP.2005.859356
Observation of particle behavior in copper powder compact during pulsed electric discharge, Materials Science and Engineering: A, vol.350, issue.1-2, pp.184-189, 2003. ,
DOI : 10.1016/S0921-5093(02)00726-8