. Wikipedia, Packaging and Labeling Available online, 2012.

R. Yung, S. Rusu, and K. Shoemaker, Future trend of microprocessor design, Solid-State Circuits Conference Proceedings of the 28th European, pp.43-46, 2002.

E. C. Niehenke, R. A. Pucel, and I. J. Bahl, Microwave and millimeter-wave integrated circuits, IEEE Transactions on Microwave Theory and Techniques, vol.50, issue.3, pp.846-857, 2002.
DOI : 10.1109/22.989968

J. William and . Greig, Integrated Circuit Packaging, Assembly and Interconnections, 2007.

P. Thompson, Chip-scale packaging, IEEE Spectrum, vol.34, issue.8, pp.36-43, 1997.
DOI : 10.1109/6.609473

H. Daembkes, P. Quentin, M. Camiade, K. Beilenhoff, B. Adelseck et al., Influence of Advanced GaAs MMICs on Structure and Cost of High Frequency TR-Modules for Communication and Radar Systems for Volume Markets, 30th European Microwave Conference, 2000, pp.1-4, 2000.
DOI : 10.1109/EUMA.2000.338603

L. Jianhui, D. Zhaowen, and Y. Bangchao, The Technique Research on LTCC 3D-MCM, 2006 7th International Conference on Electronic Packaging Technology, pp.1-4, 2006.
DOI : 10.1109/ICEPT.2006.359653

R. Tummala, Multichip packaging-a tutorial, Proceedings of the IEEE, vol.80, issue.12, pp.1924-1941, 1992.
DOI : 10.1109/5.192073

J. Miettinen, M. Mantysalo, K. Kaija, and E. O. Ristolainen, System design issues for 3D system-in-package (SiP), 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), pp.610-615, 2004.
DOI : 10.1109/ECTC.2004.1319401

S. G. Rosser, I. Memis, and H. Von-hofen, Miniaturization of printed wiring board assemblies into system in a package (SiP), Microelectronics and Packaging Conference, pp.1-8, 2009.

J. Pan, Wire Bonding Challenges in Optoelectronics Packaging. Technical Paper, 2004.

M. Pecht, Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability, 1994.

T. Krems, W. Haydl, H. Massler, and J. Rudiger, Millimeter-wave performance of chip interconnections using wire bonding and flip chip, 1996 IEEE MTT-S International Microwave Symposium Digest, pp.247-250, 1996.
DOI : 10.1109/MWSYM.1996.508504

K. Wu and Y. Huang, LTCC technology and its applications in high frequency front end modules, Antennas, Propagation and EM Theory Proceedings. 2003 6th International SYmposium, pp.730-734, 2003.

C. Q. Scrantom and J. C. Lawson, LTCC technology: where we are and where we're going. II, 1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications (Cat. No. 99TH8390), pp.193-200, 1999.
DOI : 10.1109/MTTTWA.1999.755161

D. Corporation, . Ltcc, and . Applications, Available online, 2012.

. Via-electronic and . Applications, Available online, http://www.via-electronic, 2012.

I. Gmbh, Ltcc applications Available online, 2012.

. Dupont-microcircuit-materials, . Ltcc-design, and . Guidelines, Available online, 2012.

Y. Imanaka, Multilayered Low Temperature Cofired Ceramics (LTCC) technology, 2005.

O. Dernovsek, M. Eberstein, W. Schiller, A. Naeini, G. Preu et al., LTCC glass-ceramic composites for microwave application, Journal of the European Ceramic Society, vol.21, issue.10-11, pp.10-111693, 2001.
DOI : 10.1016/S0955-2219(01)00096-6

E. Richard, . Mistler, R. Eric, and . Twiname, Tape casting : theory and practice, 2000.

M. R. Gongora-rubio, P. Espinoza-vallejos, L. Sola-laguna, and J. J. Santiago-avilés, Overview of low temperature co-fired ceramics tape technology for meso-system technology . Sensors and Actuators A: Physical, pp.222-241, 2001.

M. Dupont-microcircuit, Online website, 2012.

. Ferro-electronic and . Materials, Online website, 2012.

H. Online-website, Available online, 2012.

J. Lebowitz, K. Jones, N. Macdonald, C. Free, P. Barnwell et al., An investigation of the properties of LTCC materials and compatible conductors for their use in wireless applications, Proceedings of the IMAPS International Symposium on Microelectronics, pp.659-664, 2000.

H. Jantunen, A novel Low temperature co-fired ceramic (LTCC) materials for telecommunication devices, 2001.

Y. Chul and L. , Won-il Chang, and Chul Soon Park. Monolithic LTCC SiP transmitter for 60GHz wireless communication terminals, Microwave Symposium Digest, 2005 IEEE MTT-S International, pp.1015-1018, 2005.

A. Ariffin, S. B. Amiruddin, S. Jaafar, and Y. Lee, Monolithic LTCC SoP Transceiver for 60 GHz Wireless Gigabit Ethernet Communication System, Proceeding of the 3rd International Conference on Information and Communication Technology for the Moslem World (ICT4M) 2010, pp.19-22, 2010.
DOI : 10.1109/ICT4M.2010.5971905

T. C. Edwards, M. B. Steer, and T. C. Edwards, Foundations of interconnect and microstrip design, 2000.
DOI : 10.1002/9781118894514

M. Steer, Microwave and RF Design: A Systems Approach, 2009.

A. Technologies and . Online-website, Available online, 2013.

A. Sprint-layout, Available online, 2013.

D. Corporation, . Ltcc, and . Guidelines, Chapter 2 -Technologies Available online, 2012.

L. Imst-online-website, Prototyping LTCC circuits, 2012.

G. Wang, E. C. Folk, F. Barlow, and A. Elshabini, Fabrication of Microvias for Multilayer LTCC Substrates, IEEE Transactions on Electronics Packaging Manufacturing, vol.29, issue.1, pp.32-41, 2006.
DOI : 10.1109/TEPM.2005.862633

Y. L. Wang, P. J. Ollivier, and M. A. Skurski, Photoformed thick film materials and their application to fine feature circuitry, SPIE proceedings series, pp.579-584

P. Markowski, Photoimageable details on LTCC ceramic, Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE), pp.135-140, 2011.
DOI : 10.1109/ISSE.2011.6053566

. Tanaka-online-website, Tanaka Thick Film Paste Available online, 2013.

. Ferro-electronic-materials, . Ltcc, . Instructions-for, A. Ferro, and L. Tape, Available online, 2012.

K. J. Wolter, M. Oppermann, A. Striegler, and T. Zerna, New methods of non-destructive evaluation for advanced packages, XXXII International Conference of IMAPS Poland Chapter, 2008.

K. Reinmut, H. H. Hoffmann, and . Howe, Handbook of microwave integrated circuits, 1987.

K. C. Gupta, Microstrip lines and slotlines. The Artech House microwave library, 1996.

P. Franco-di, Networks and Devices Using Planar Transmissions Lines, 2000.

I. Wolff, Coplanar microwave integrated circuits, 2006.
DOI : 10.1002/0470040882

E. Rius, G. Prigent, H. Happy, G. Dambrine, S. Boret et al., Wide- and narrow-band bandpass coplanar filters in the W -frequency band, IEEE Transactions on Microwave Theory and Techniques, vol.51, issue.3, pp.784-791, 2003.
DOI : 10.1109/TMTT.2003.808586
URL : https://hal.archives-ouvertes.fr/hal-00145985

M. Riaziat, R. Majidi-ahy, and I. Feng, Propagation modes and dispersion characteristics of coplanar waveguides, IEEE Transactions on Microwave Theory and Techniques, vol.38, issue.3, pp.245-251, 1990.
DOI : 10.1109/22.45333

G. Ghione, A CAD-oriented analytical model for the losses of general asymmetric coplanar lines in hybrid and monolithic MICs, IEEE Transactions on Microwave Theory and Techniques, vol.41, issue.9, pp.1499-1510, 1993.
DOI : 10.1109/22.245668

W. Simon and R. Kulke, Investigation of ring-resonators on multilayer LTCC, IMS, 2001.

J. R. Bray and L. Roy, Microwave characterization of a microstrip line using a two-port ring resonator with an improved lumped-element model, IEEE Transactions on Microwave Theory and Techniques, vol.51, issue.5, pp.1540-1547, 2003.
DOI : 10.1109/TMTT.2003.810136

R. F. Drayton-rebecca and L. Peterson, A CPW t-resonator technique for electrical characterization of microwave substrates, pp.1-5, 2001.

A. Technologies and . Online-website, Available online, 2013.

R. Kulke, M. Rittweger, W. Simon, A. Wien, and I. Wolff, High resolution coplanar structures on multilayer LTCC for applications up to 40 GHz, SPIE proceedings series, pp.79-83

W. Simon, R. Kulke, A. Wren, I. Wolff, S. Baker et al., Design of passive components for k-band communication modules in LTCC environment. The International journal of microcircuits and electronic packaging, pp.92-98

M. F. Amiruddin, S. Jaafar, S. Bujang, A. Ariffin, A. Sulaiman et al., Low loss LTCC passive transmission line at Millimeter-wave frequency, 2010 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE), pp.1-4, 2010.
DOI : 10.1109/APACE.2010.5720083

D. Bourreau, A. Peden, and S. L. Maguer, A quasi-optical free-space measurement setup without time-domain gating for material characterization in the -band. Instrumentation and Measurement, IEEE Transactions on, vol.55, issue.6, pp.2022-2028, 2006.
URL : https://hal.archives-ouvertes.fr/hal-00177448

C. Publications-khodor-rida, A. Kärnfelt, G. Peden, P. Chuiton, J. Coant et al., Conception d'un boitier multicouche LTCC intégrant un Oscillateur MMIC, Journnées Nationales Microondes, pp.14-17, 2013.

K. Rida, C. Kärnfelt, A. Peden, J. Coupez, G. Chuiton et al., Radio Frequency Characterization of LTCC Materials in K and W Bands. Giga-Hertz symposium, pp.5-8, 2012.
URL : https://hal.archives-ouvertes.fr/hal-00724986