J. Sanchez, M. , P. Rico-lim, J. D. Van-wyk, F. C. Lee et al., Contribution au développement de l'intégration fonctionnelle Habilitation à diriger des recherches A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies Integrations and challenges of novel high-k gate stacks in advanced CMOS technology Materials options for dielectrics in integrated capacitors Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects, International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Proceedings Enhanced electrical properties of atomic layer deposited La(2)O(3) thin films with embedded ZrO(2) nanocrystals, pp.20-29, 1999.

L. Andre, M. Ulmer, P. Aid, S. W. Ancey, J. H. Lee et al., Atomic Layer Deposition of SrTiO3 Thin Films with Highly Enhanced Growth Rate for Ultrahigh Density Capacitors Fabrication of perovskite-based high-value integrated capacitors by chemical solution deposition Fabrication and dielectric property of ferroelectric PLZT films grown on metal foils Embedded thin film capacitors-theoretical limits Advanced Packaging MIM in 3D: Dream or reality? (invited) The limits of macropore array fabrication A novel capacitor technology based on porous siliconHighdensity , low-loss MOS capacitors for integrated RF decoupling Si/Al2O3/ZnO:Al capacitor arrays formed in electrochemically etched porous Si by atomic layer deposition Ultrahigh capacitance density for multiple ALD-grown MIM capacitor stacks in 3-D silicon Fabrication of high-density arrays of individually isolated nanocapacitors using anodic aluminum oxide templates and carbon nanotubes Fabrication of silicon nanopillar-based nanocapacitor arrays, High pass filter with above IC integrated SrTiO3 high K MIM capacitors 2001 International Symposium on Microelectronics, Proceedings, Proceedings of the Society of Photo-Optical Instrumentation Engineers (Spie), pp.454-458, 1996.

C. C. Bufon, J. D. Gonzalez, D. J. Thurmer, D. Grimm, M. Bauer et al., Self- Assembled Ultra-Compact Energy Storage Elements Based on Hybrid Nanomembranes Nanotubular metal-insulator-metal capacitor arrays for energy storage [23] F. Laermer, and A. Schilp, Method of anisotropically etching silicon Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems Deep trench MOSFET structures study for a 1200 Volts application, La gravure profonde du silicium de réseaux de tranchées denses à fort facteur de forme Power Electronics and Applications, pp.1449-1457, 1996.

M. Brunet, M. Dilhan, D. Bourrier, M. Kotb, H. Benazzi et al., Porous silicon formation: A quantum wire effect Toward the formation of three-dimensional nanostructures by electrochemical etching of silicon Formation of three-dimensional microstructures by electrochemical etching of silicon High-density 3D capacitors for Power Systems on-Chip: evaluation of a technology based on silicon submicrometer pore arrays formed by electrochemical etching Phonons and lattice dielectric properties of zirconia Role of the MOCVD deposition conditions on physico-chemical properties of tetragonal ZrO2 thin films ZrO 2 Thin Films Grown on 2D and 3D Silicon Surfaces by DLI-MOCVD for Electronic Devices Characterization of ZrO2 thin films deposited by MOCVD for high-density 3D capacitors Crystalline Oxides on Silicon: The First Five Monolayers On the Reliability of Heteronuclear Precursors-Ligand Effects in the Li-MOCVD Synthesis of SrTiO3 Films Controlling precursor stability and evaporation through molecular design. Pseudo single source precursor approach to MOCVD SrTiO3 thin films Atomic layer deposition (ALD): from precursors to thin film structures Remote Plasma ALD of SrTiO3 Using Cyclopentadienlyl-Based Ti and Sr Precursors, 18th Workshop on MicroMechanics Europe32] X. Zhao, and D. Vanderbilt41] V. Longo, N. Leick, F. Roozeboom, and W. M. M. Kessels, "Plasma-Assisted Atomic Layer Deposition of SrTiO3: Stoichiometry and Crystallinity Study by Spectroscopic Ellipsometry Atomic Layer Deposition Applications 742] C. R. Sullivan, " Integrating magnetics for on-chip power: Challenges and opportunities Custom Integrated Circuits Conference CICC '09, pp.856-858, 1991.

B. Morel and . Cogitore, Fabrication of integrated inductors on silicon for fully integrated DC-DC microconverters, Micromachining and Microfabrication Process Technology IX, SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, pp.86-93

T. Mastouli, J. P. Laur, J. L. Sanchez, M. Brunet, D. Bourrier et al., Electrodeposited anisotropic NiFe 45/55 thin films for high-frequency micro-inductor applications Sandwich films: Properties of a new soft magnetic material Review of On-Chip Inductor Structures With Magnetic Films Co-Zr-O nano-granular thin films with improved high frequency soft magnetic properties Granular thin films with high RF permeability Magnetics Very high electrical resistivity and heteroamorphous structure of soft magnetic (Co35.6Fe50B14.4)-(SiO2) thin films Planar inductor with ferrite layers for DC-DC converter MEMS technology for the fabrication of RF magnetic components A comparison of two micromachined inductors (bar-and meander-type) for fully integrated boost DC/DC power converters A microfabricated transformer for high-frequency power or signal conversion Design of microfabricated transformers and inductors for highfrequency power conversion Thick photoresist development for the fabrication of high aspect ratio magnetic coils Design study and fabrication techniques for high power density micro-transformers Electrical performance of micro-transformers for DC-DC converter applications Digest of Technical Papers Electrochemical process for the lamination of magnetic cores in thin-film magnetic components Low-resistance integrated toroidal inductor for power management Micro inductors using low temperature fabrication processes for integrated DC-DC microconverters High-power-density MHz-switching monolithic DC-DC converter with thin-film inductor A planar inductor using Mn-Zn ferrite/polyimide composite thick film for low-Voltage and large-current DC-DC converter, Micromachining and Microfabrication Process Technology Xiii, Proceedings of the Society of Photo-Optical Instrumentation Engineers (Spie) the MHz frequency range 16th Annual IEEE Applied Power Electronics Conference and Exposition Magnetics Conference Industry Applications Conference Fourtieth IAS Annual Meeting. Conference Record of the 2005 Katayama, S. Sugahara, H. Nakazawa, and M. Edo Power Electronics Specialists Conference On-Chip Bondwire Inductor with Ferrite-Epoxy Coating: A Cost-Effective Approach to Realize Power Systems on Chip Power Electronics Specialists Conference Components and Packaging Technologies High Q Ni- Zn-Cu Ferrite Inductor for On-Chip Power Module, pp.8820-8820, 1996.

H. Donohoe, A. Ito, S. Takeuchi, H. Okazaki, Y. Kobayashi et al., Magnetics Fabrication process of a micro-inductor utilising a magnetic thin film core Microsystem Technologies Cubic millimeter power inductor fabricated in batch-type wafer technology Microelectromechanical Systems Analysis of Microinductor Performance in a 20-100 MHz DC/DC Converter Review of Integrated Magnetics for Power Supply on Chip (PwrSoC), " Power Electronics [74] P. Artillan Conception, modélisation et réalisation de composants inductifs intégrés pour alimentations de faible puissance et microsystèmes A PEEC approach for circular spiral inductive components modeling Etude et mise au point de transformateurs large bande radiofréquence Low-profile, small-size ferrite cores for power SiP integrated inductor A multistage interleaved synchronous buck converter with integrated output filter in 0.18 mu m SiGe process An 800mW fully-integrated 130nm CMOS DC-DC step-down multi-phase converter, with on-chip spiral inductors and capacitors A comparative analysis of Switched-Capacitor and inductor-based DC-DC conversion technologies Power delivery network design for 3D SIP integrated over silicon interposer platform, High-Quality Factor Ni-Zn Ferrite Planar Inductor Fabrication of Planar Power Inductor for Embedded Passives in LSI Package for Hundreds Circuits and Systems Thèse de doctorat de l'Ecole normale supérieure de Cachan 15th European Conference on Power Electronics and Applications79] M. Wens, and M. Steyaert Energy Conversion Congress and Exposition Control and Modeling for Power Electronics (COMPEL) Fully-Integrated Switched-Capacitor 2:1 Voltage Converter with Regulation Capability and 90% Efficiency at 2.3A/mm 2010 Symposium on Vlsi Circuits 57th Electronic Components and Technology Conference 3D Chip Stack with Integrated Decoupling Capacitors IEEE 59th Electronic Components and Technology Conference 3D stacked buck converter with 15µm thick spiral inductor on silicon interposer for fine-grain power-supply voltage control in SiP's 3D Systems Integration Conference (3DIC). [85] A. Shibuya, A. Ouchi, and K. Takemura, " A Silicon Interposer With an Integrated SrTiO3 Thin Film Decoupling Capacitor and Through-Silicon Vias Components and Packaging Technologies An Inductive Down Converter System-in-Package for Integrated Power Management in Battery-powered Applications 39th IEEE Power Electronic Specialists Conference, pp.2417-2420, 2003.

]. J. Knickerbocker, P. S. Andry, B. Dang, R. R. Horton, C. S. Patel et al., 3D silicon integration Integrated LC Filter on Silicon for DC-DC Converter Applications, 58th Electronic Components and Technology Conference, pp.2319-2325, 2008.

J. L. Austin and . Sanchez, New self-controlled and self-protected IGBT based integrated switch Formation of Submicrometer Pore Arrays by Electrochemical Etching of Silicon and Nanoimprint Lithography, 21st International Symposium on Power Semiconductor Devices & Ics, Proceedings of the International Symposium on Power Semiconductor Devices & ICs, pp.243-246, 1998.

]. R. Références1, R. V. Vullers, H. J. Schaijk, J. Visser, C. V. Penders et al., Energy Harvesting for Autonomous Wireless Sensor Networks Solid-State Circuits Magazine Lallart Mickaël Amélioration de la conversion électroactive de matériaux piézoélectriques et pyroélectriques pour le contrôle vibratoire et la récupération d'énergie : application au contrôle de santé structurale auto-alimenté Energy scavenging for long-term deployable wireless sensor networks Solid-state thin-film supercapacitor with ruthenium oxide and solid electrolyte thin films Origami fabrication of nanostructured, threedimensional devices: Electrochemical capacitors with carbon electrodes, Thèse de doctorat de l'INSA de LyonTailoring Electrochemical Capacitor Energy Storage Using Direct Write Dispenser Printing, pp.29-38, 2001.

N. Katsuhiko, S. Patrice, P. Simon, Y. Gogotsi, G. Wang et al., Materials for electrochemical capacitors Anomalous increase in carbon capacitance at pore sizes less than 1 nanometer Titanium carbide derived nanoporous carbon for energy-related applications Onion-like carbon from ultra-disperse diamond Influence of the structure of carbon onions on their electrochemical performance in supercapacitor electrodes Electrochemical performance of carbon onions, nanodiamonds, carbon black and multiwalled nanotubes in electrical double layer capacitors Bifunctional carbon nanotube networks for supercapacitors Printable Thin Film Supercapacitors Using Single-Walled Carbon Nanotubes Flexible energy storage devices based on nanocomposite paper Highly conductive paper for energy-storage devices Printed energy storage devices by integration of electrodes and separators into single sheets of paper Carbon coated textiles for flexible energy storage All-textile flexible supercapacitors using electrospun poly(3,4-ethylenedioxythiophene) nanofibers Single-Fiber-Based Hybridization of Energy Converters and Storage Units Using Graphene as Electrodes Thin film supercapacitors using a sputtered RuO2 electrode All solid-state rechargeable thin-film microsupercapacitor fabricated with tungsten cosputtered ruthenium oxide electrodes Characteristics of thin film supercapacitor with ruthenium oxide electrode and Ta2O5+x solid oxide thin film electrolyte Direct-write planar microultracapacitors by laser engineering Fabrication of microcapacitors using conducting polymer microelectrodes Symmetric redox supercapacitor based on micro-fabrication with three-dimensional polypyrrole electrodes Micro-supercapacitors based on three dimensional interdigital polypyrrole/C-MEMS electrodes Electrochemically activated carbon micro-electrode arrays for electrochemical micro-capacitors A high-performance three-dimensional micro supercapacitor based on self-supporting composite materials Principles and applications of electrochemical capacitors Fabrication of all-solid-state electrochemical microcapacitors Flexible micro-supercapacitors Development of near hermetic silicon/glass cavities for packaging of integrated lithium micro batteries Microbattery technology overview and associated multilayer encapsulation process Energy scavenging based on transcient thermal gradients: applications to structural health monitoring of aircraftsInkjet printed carbon-based micro-supercapacitor for mobile self-powered modules Proceeding of MRS fall meeting Elaboration of a microstructured inkjet-printed carbon electrochemical capacitor Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy Ultrahigh-power micrometre-sized supercapacitors based on onion-like carbon, New Materials and New Configurations for Advanced Electrochemical Capacitors The Electrochem. Soc. InterfaceFrom Porous Networks to Nanotubes and Graphene Proceedings of the National Academy of Science Proceedings of the National Academy of Science Design, Test, Integration & Packaging of MEMS/MOEMS MEMS/MOEMS '09. Symposium on 8th International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, pp.34-37, 1994.

P. Gogotsi, M. Simon, S. Heon, J. Lofland, R. Applegate et al., Capacitive Energy Storage from -50 to 100 degrees C Using an Ionic Liquid Electrolyte, Journal of Physical Chemistry Letters, vol.2, issue.19, 2011.

M. Huang, Y. G. Brunet, W. C. Hu, K. H. Chen, J. P. Chang et al., How to achieve maximum utilization of hydrous ruthenium oxide for supercapacitors High energy and high power density electrochemical capacitors Influence of the Configuration in Planar Interdigitated Electrochemical Micro-Capacitors Virtual prototyping and pre-sizing methodology for buck DC-DC converters using genetic algorithmsA low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers A Surface-Mountable Microfabricated Power Inductor in Silicon for Ultracompact Power Supplies Self-Discharge Characterization and Modeling of Electrochemical Capacitor Used for Power Electronics Applications Analysis of generalized parallel-series ultracapacitor shift circuits for energy storage systems, Electronic Components and Technology Conference (ECTC), 2012 IEEE Dilhac, M. Bafleur, and X. Lafontan, Circuit électronique de récupération, pp.135-138, 1996.

. Annexe, Production scientifique A.1. Revues à comité de lecture, 2013.

P. Huang, M. Heon, D. Pech, M. Brunet, P. Taberna et al., Micro-supercapacitors from carbide derived carbon (CDC) films on silicon chips, Journal of Power Sources, vol.225, issue.31, pp.240-244, 2013.
DOI : 10.1016/j.jpowsour.2012.10.020
URL : https://hal.archives-ouvertes.fr/hal-01159879

D. Pech, M. Brunet, T. Mai-dinh, K. Armstrong, J. Gaudet et al., Influence of the configuration in planar interdigitated electrochemical micro-capacitors, Journal of Power Sources, vol.230, pp.230-235, 2013.
DOI : 10.1016/j.jpowsour.2012.12.039

M. Brunet and P. Kleimann, High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching, IEEE Transactions on Power Electronics, vol.28, issue.9, pp.4440-4448, 2013.
DOI : 10.1109/TPEL.2012.2233219
URL : https://hal.archives-ouvertes.fr/hal-01443216

M. Brunet and D. Pech, Micro-Supercondensateurs : Enjeux Technologiques et Applications, 2012.

D. Durou, D. Pech, P. Colin, P. Simon, M. Taberna et al., Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy, Microsystem Technologies, pp.467-473, 2012.

G. A. Seisenbaeva, S. Gohil, V. G. Kessler, M. Andrieux, C. Legros et al., On the Reliability of Heteronuclear Precursors-Ligand Effects in the Li-MOCVD Synthesis of SrTiO<SUB>3</SUB> Films, Journal of Nanoscience and Nanotechnology, vol.11, issue.9, pp.8302-8308, 2011.
DOI : 10.1166/jnn.2011.5042

M. Artillan, D. Brunet, J. P. Bourrier, N. Laur, L. Mauran et al., Integrated LC Filter on Silicon for DC–DC Converter Applications, IEEE Transactions on Power Electronics, vol.26, issue.8, 2011.
DOI : 10.1109/TPEL.2010.2102776

J. Deleage, M. Crebier, Y. Brunet, H. Lembeye, and . Manh, Design and realization of highly integrated isolated DC/DC micro-converter, 2009 IEEE Energy Conversion Congress and Exposition, 2011.
DOI : 10.1109/ECCE.2009.5316330
URL : https://hal.archives-ouvertes.fr/hal-00421722

S. Heon, J. Lofland, R. Applegate, E. Nolte, J. D. Cortes et al., Continuous Carbide-Derived Carbon Films with High Volumetric Capacitance, Energy Environ, Science, vol.4, p.135, 2011.

H. Brunet, L. Mahfoz-kotb, E. Bouscayrol, M. Scheid, C. Andrieux et al., Nanocrystallized tetragonal metastable ZrO2 thin films deposited by MOCVD for 3D capacitors, Thin Solid Films, pp.519-5638, 2011.

A. Seisenbaeva, S. Gohil, V. G. Kessler, M. Andrieux, C. Legros et al., Controlling precursor stability and evaporation through molecular design. Pseudo single source precursor approach to MOCVD SrTiO3 thin films, Applied Surface Science, vol.257, issue.6, pp.2281-2290, 2011.
DOI : 10.1016/j.apsusc.2010.09.090

D. Pech, M. Brunet, H. Durou, P. Huang, V. Mochalin et al., Simon Ultrahigh-power micrometre-sized supercapacitors based on onion-like carbon, Nature Nanotechnology, vol.9, p.651, 2010.
DOI : 10.1038/nnano.2010.162

D. Pech, M. Brunet, P. Taberna, P. Simon, N. Fabre et al., Elaboration of a microstructured inkjet-printed carbon electrochemical capacitor, Journal of Power Sources, vol.195, issue.4, pp.1266-1269, 2009.
DOI : 10.1016/j.jpowsour.2009.08.085
URL : https://hal.archives-ouvertes.fr/hal-01443055

C. Galicka-fau, M. Legros, M. Andrieux, J. Brunet, G. Szade et al., Role of the MOCVD deposition conditions on physico-chemical properties of tetragonal ZrO2 thin films, Applied Surface Science, vol.255, issue.22, pp.8986-8994, 2009.
DOI : 10.1016/j.apsusc.2009.06.067

P. Brunet, H. Dubreuil, A. Mahfoz-kotb, A. Gouantes, and . Dorthe, Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches, Microsystems Technology, pp.1449-1457, 2009.

E. Brunet, K. Scheid, M. Galicka-fau, C. Andrieux, I. Legros et al., Characterization of ZrO2 thin films deposited by MOCVD for high-density 3D capacitors Wide-tunable low-field interdigitated barium strontium titanate capacitors, J. Microelec. Eng. IEEE Microwave and Wireless Components Letters, vol.8617, issue.10, pp.2034-2037, 2007.

U. Houssameddine, B. Ebels, B. Delaët, I. Rodmacq, F. Firastrau et al., Spin-torque oscillator using a perpendicular polarizer and a planar free layer Electrochemical Process for the Lamination of Magnetic Cores in Thin Film Magnetic Components, High-frequency micro-machined power inductors, pp.447-453, 2005.

S. 21-prabhakaran, C. R. Sullivan, T. Donnell, M. Brunet, and S. Roy, Microfabricated coupled inductors for DC-DC converters for microprocessor power delivery, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), pp.290-291, 2005.
DOI : 10.1109/PESC.2004.1354790

A. Roy, M. Connell, N. Ludwig, T. O. Wang, M. Donnell et al., Pulse reverse plating for integrated magnetics on Si Modelling of high-frequency micro-transformers, Journal of Magnetism and Magnetic Materials IEEE Transactions on Magnetics, vol.23, issue.4, 2004.

C. O. Mahony, M. Hill, M. Brunet, R. Duane, and A. Mathewson, Characterization of micromechanical structures using white-light interferometry, Measurement Science and Technology, vol.14, issue.10, pp.1807-1814, 2003.
DOI : 10.1088/0957-0233/14/10/310

M. Brunet, T. O. Donnell, J. O-'brien, P. Mccloskey, and S. C. Mathúna, Thick photoresist development for the fabrication of high aspect ratio magnetic coils, Journal of Micromechanics and Microengineering, vol.12, issue.4, pp.444-449, 2002.
DOI : 10.1088/0960-1317/12/4/317

T. O. Brunet, N. Donnell, J. Wang, P. O-'brien, S. C. Mccloskey et al., Electrical performance of micro-transformers for DC-DC converter applications, IEEE International Digest of Technical Papers on Magnetics Conference, pp.3174-3176, 2002.
DOI : 10.1109/INTMAG.2002.1001054

. Renaud, L. Armenean, P. Berry, P. Kleimann, M. Morin et al., Implantable Planar RF Microcoils for NMR Micro-Spectrometry, Sensors & Actuators A- Physical, pp.244-248, 2002.

J. Sanchez, A. Bourennane, M. Breil, P. Austin, M. Brunet et al., A brief over view of silicon active and passive power devices technologies: potentialities of evolving towards 3D heterogeneous functional integration, Prague (République Tchèque), pp.1-3, 2009.

O. Deleage, J. Crebier, M. Brunet, and Y. Lembeye, Design and realization of highly integrated isolated DC/DC micro-converter, 2009 IEEE Energy Conversion Congress and Exposition, pp.3690-3697, 2009.
DOI : 10.1109/ECCE.2009.5316330
URL : https://hal.archives-ouvertes.fr/hal-00421722

M. Brunet, P. Taberna, P. Simon, N. Fabre, V. Conédéra et al., Ink-jet printed carbon-based micro-supercapacitor for mobile self-powered modules, MRS Proceedings, vol.5, pp.4-06, 2009.
DOI : 10.1557/PROC-1127-T04-06

M. Brunet, P. Kleimann, E. Daran, F. Carcenac, L. Jalabert et al., 650 nF/mm² 3D capacitors integrated in silicon based on nanolithography and electrochemical etching, 2009.

F. Capy, J. Laur, M. Breil, F. Richardeau, M. Brunet et al., New self-controlled and self-protected IGBT based integrated switch, 2009 21st International Symposium on Power Semiconductor Devices & IC's, 2009.
DOI : 10.1109/ISPSD.2009.5158047

V. Conédéra, F. Mesnilgrente, M. Brunet, and N. Fabre, Fabrication of activated carbon electrodes by inkjet deposition, Proceedings of ICQNM conference, 2009.

J. Sanchez, A. Bourennane, M. Breil, P. Austin, M. Brunet et al., 3D heterogeneous functional integration: an alternative way to develop new power integrated functions, XVth International Workshop on the Physics of Semiconductor Devices (IWPSD), 2008.

P. Simon and . Taberna, Power harversting and management from vibrations : a multi-source strategy simulation for aircraft structure health monitoring, SPIE Smart Materials, Nano+Micro-Smart Systems Conference, pp.9-12, 2007.

A. Benazzi, M. Brunet, P. Dubreuil, N. Mauran, L. Bary et al., Performance of 3D capacitors integrated on silicon for DC-DC converter applications, 2007 European Conference on Power Electronics and Applications, pp.2-5, 2007.
DOI : 10.1109/EPE.2007.4417614

L. Théolier, K. Isoird, F. Morancho, J. Roig, H. Mahfoz-kotb et al., Dubreuil Deep Trench MOSFET structures study for a 1200 Volts application, 12th European Conference on Power Electronics and Applications, pp.2-5, 2007.

M. Brunet, M. Dilhan, D. Bourrier, H. M. Kotb, A. Benazzi et al., Profile enhancement of high aspect ratio silicon pores made by DRIE with TMAH+IPA bath, 18th Workshop on MicroMechanics Europe Guimaraes (Portugal), pp.16-18, 2007.

J. Sanchez, A. Bourennane, M. Breil, P. Austin, M. Brunet et al., Evolution of the Classical Functional Integration Towards a 3D Heterogeneous Functional Integration, 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems, pp.21-23
DOI : 10.1109/MIXDES.2007.4286116

M. Ahmad, G. Leclerc, M. Brunet, N. Mauran, S. Payan et al., Development of fabrication techniques for high-density integrated MIM capacitors in power conversion equipment Thin film micro-transformers for future power conversion, International Symposium on Integrated Ferroelectrics Bordeaux (France) Micromachining and Microfabrication Process Technology XI " , part of the SPIE MOEMS-MEMS Symposium, in Photonics West th Annual IEEE Applied Power Electronics Conference and Exposition, APEC'04, pp.8-12, 2004.

N. Wang, T. O. Donnell, M. Brunet, P. Mccloskey, and S. C. Mathúna, Modelling and measurements of micro-transformers for power conversion, Proceedings of 202 nd Electrochemical Society Conference, 2001.

M. Brunet, T. O. Donnell, J. O-'brien, P. Mccloskey, and S. C. Mathúna, Design study and fabrication techniques for high power density micro-transformers, th Annual IEEE Applied Power Electronics Conference and Exposition, APEC'01, pp.1189-1197, 2001.

M. Brunet, T. O. Donnell, J. O-'brien, P. Mccloskey, S. C. Mathúna et al., Photoresist Development for the fabrication of high aspect ratio coils, Proceedings of 12 th Micromechanics Europe Workshop High aspect ratio RF coils fabricated using laser processing and micromoulding techniques, European Microelectronics Packaging and Interconnection Symposium, pp.245-248, 2000.

K. Armstrong, T. T. Dinh, D. Pech, M. Brunet, J. Gaudet et al., Ruthenium oxide electrodepositionon titanium interdigitated microarrays for energy storage, MRS Fall Meeting, 2012.

P. Huang, M. Heon, D. Pech, M. Brunet, P. Taberna et al., On-chip microsupercapacitors based on CDC film, rd Annual Meeting of the International Society of Electrochemistry, pp.19-24, 2011.

K. Armstrong, J. Gaudet, M. Brunet, D. Guay, and D. Pech, Influence of the configuration of RuO 2 thin film electrochemical micro-capacitors, International Symposium on Enhanced Electrochemical Capacitors (ISEE'Cap 2011), pp.12-16, 2011.

M. Brunet, High performance carbon-based micro-supercapacitors, NEST Conference (New Electrical Systems in Tours), pp.28-29

. Simon, Influence of the architecture of micro-supercapacitors on their electrochemical performances, Annual Meeting of the International Society of Electrochemistry, pp.26-27

M. Brunet, D. Pech, H. Durou, P. Huang, V. Mochalin et al., Ultra high power carbon-based micro-supercapacitors, International Workshop on Power Supplies on Chip

M. Heon, Y. Gogotsi, J. D. Hettinger, M. Brunet, D. Pech et al., Carbidederived Carbon for Thin Film Supercapacitors, U13.26, MRS Fall meeting, 2009.

K. Galicka-fau, M. Andrieux, C. Legros, I. Gallet, M. Brunet et al., ZrO2 Thin Films Grown On 2D and 3D Silicon Surfaces By DLI-MOCVD For Electronic Devices, 2009.

M. Brunet, P. Kleimann, E. Daran, F. Carcenac, L. Jalabert et al., nF/mm² 3D capacitors integrated in silicon based on nanolithography and electrochemical etching, p.650, 2009.

D. Pech, M. Brunet, H. Durou, F. Mesnilgrente, N. Fabre et al., Fabrication and characterization of carbon micro-supercapacitors elaborated by inkjet deposition, New Energy Solution in Tours, pp.26-27, 2009.

D. Pech, M. Brunet, H. Durou, P. Taberna, P. Simon et al., Miniaturization and integration of carbon-based electrochemical capacitors: technological issues, First International Symposium on Enhanced Electrochemical Capacitors (ISEECap'), pp.29-31, 2009.

V. Conédéra, F. Mesnilgrente, M. Brunet, and N. Fabre, Fabrication of activated carbon electrodes by inkjet deposition, Proceedings of ICQNM conference, 2009.

V. Conédéra, F. Mesnilgrente, M. Brunet, M. Borella, and N. Fabre, Study of a highly localized activated carbon deposition process using inkjet printing technology, Journées Nationales sur les Technologies Emergentes en Micro-nanofabrication, Novembre, pp.19-21, 2008.

H. Durou, C. Rossi, M. Brunet, C. Vanhecke, N. Bailly et al., Power harversting and management from vibrations : a multi-source strategy simulation for aircraft structure health monitoring, SPIE Smart Materials, Nano+Micro-Smart Systems Conference, pp.9-12, 2008.

M. Brunet, G. Leclerc, E. Scheid, K. Galicka-fau, M. Andrieux et al., 2D and 3D characterization of ZrO2 thin films deposited by MOCVD for high-density 3D capacitors, IUMRS-ICEM International conference on Electronic Materials, pp.28-29, 2008.
URL : https://hal.archives-ouvertes.fr/hal-01443057

K. Galicka-fau, M. Andrieux, C. Legros, I. Gallet, M. Herbst et al., Dépôts planaires et tridimensionnels de films minces de ZrO2 par MOCVD sur silicium pour applications en électronique de puissance, Oxyde Fonctionnels pour la micro et nanoélectronique », Autrans, pp.16-19, 2008.

T. Mastouli, J. Laur, J. Sanchez, M. Brunet, D. Bourrier et al., CoNiFe applied in microinductors for integrated dc-dc converters, IEEE International Magnetics Conference, pp.4-8, 2008.

T. Mastouli, J. Laur, J. Sanchez, M. Brunet, D. Bourrier et al., Micro-inductors integrated on silicon for DC-DC converters, Micromachining and Microfabrication Process Technology XIII, pp.19-24, 2007.
DOI : 10.1117/12.763085

L. Théolier, K. Isoird, F. Morancho, J. Roig, H. Mahfoz-kotb et al., Deep trench MOSFET structures study for a 1200 Volts application, 2007 European Conference on Power Electronics and Applications, pp.2-5, 2007.
DOI : 10.1109/EPE.2007.4417583

M. Brunet, P. Dubreuil, E. Scheid, and J. Sanchez, Development of fabrication techniques for high-density integrated MIM capacitors in power conversion equipment Micromachining and Microfabrication Process Technology XI, part of the SPIE MOEMS-MEMS Symposium, in Photonics West, 2004.

T. O. Donnell, N. Wang, M. Brunet, S. Roy, A. Connell et al., Thin film micro-transformers for future power conversion, 19 th Annual IEEE Applied Power Electronics Conference and Exposition, pp.939-944, 2003.

J. F. Power, K. Reynolds, D. P. Casey, J. F. Rohan, M. Brunet et al., Electrochemical deposition of magnetic materials, Proceedings of Royal society of chemistry, 2002.

M. Brunet, T. O. Donnell, J. O-'brien, P. Mccloskey, and S. C. Mathúna, Photoresist Development for the fabrication of high aspect ratio coils, Proceedings of 12 th Micromechanics Europe Workshop, MME'01, pp.245-248, 2000.

T. O. Donnell, P. Mccloskey, M. Brunet, R. Winfield, and S. C. Mathúna, High aspect ratio RF coils fabricated using laser processing and micromoulding techniques, European Microelectronics Packaging and Interconnection Symposium, pp.169-174, 2000.

T. O. Donnell, M. Brunet, P. Mccloskey, J. O-'brien, and S. C. Mathúna, Microtransformers and inductors using permalloy thin films, Preparation, Properties and Applications of Thin Ferromagnetic Films Workshop, 2000.

M. Brunet, Energy storage on-chip: technologies and performance of micro-supercapacitors, Journées Stockage de l'Energie, organisées par Midi-Pyrénées Innovation (présentation invitée)

M. Brunet, Energy storage on-chip: technologies and performance of micro-supercapacitors, 2èmes journées nationales sur la récupération et le stockage d'Energie pour l'alimentation des microsystèmes autonomes, pp.26-27

D. Pech and M. Brunet, Energy storage on chip: realization and characterizations of micro-supercapacitors, Journées thématiques sur les enjeux et problématiques de l'énergie dans les microsystèmes autonomes, pp.28-29

M. Brunet, Stockage de l'énergie sur puce : technologies et performances de micro-supercondensateurs, GDR Micro et NanoSystèmes (MNS), pp.14-15

M. Brunet, 3D capacitors on silicon: technologies and integrated applications, European Centre for Power Electronics (ECPE) workshop, (présentation invitée), 2008.

G. A. Rodriguez, M. Brunet, H. Durou, C. Escriba, D. Esteve et al., Emergence du concept d'intelligence ambiante: enjeux et défis pour l'Energie Embarquée, 12ème Journées Nano Micro et Optoélectronique, pp.3-6, 2008.

J. Sanchez, A. Bourennane, M. Breil, M. Brunet, P. Austin et al., Evolution vers une intégration de puissance 3D, Micronanélectronique : enjeux et mutations, CNRS Edition, pp.978-980, 2009.