.. Développement-d-'un-outil-de-caractérisation-expérimentale-hyperfréquence-de-dispositifs-intégrés, 60 I Interdépendance fonctionnelle du calibrage et du de-embedding

D. Exemple-d-'un and .. , 68 III Détail de la méthode pour un DST en surface, pp.72-73

.. Résumé-de-la-méthode-pour-un-dispositif-en-surface,-mode-d-'emploi, 80 IV Exemples de résultats de de-embedding, 80 IV.1 Simulations mettant en évidence la nécessité d'utiliser une méthode de de-embedding précise 80 IV

O. Méthodes, 85 I Motivations du chapitre 3, ., pp.90-91

.. Modèles-de-debye, 132 VII Mise en application des développements réalisés sur les aspects extrapolation, apodisation et passage dans le domaine temporel, 134 VII.1 Exemple 1 : Intégration de SiOCH (« silicium poreux

.. Couplage-localisé-ou-réparti, 184 II

M. Elfadel, A. Deutsch, H. H. Smith, B. J. Rubin, and G. V. Kopcsay, A Multiconductor Transmission Line Methodology for Global On-Chip Interconnect Modeling and Analysis, IEEE Transactions on Advanced Packaging, vol.27, issue.1, pp.71-78, 2004.
DOI : 10.1109/TADVP.2004.825478

]. G. Engen and C. A. Hoer, Thru-Reflect-Line: An Improved Technique for Calibrating the Dual Six-Port Automatic Network Analyzer, IEEE Transactions on Microwave Theory and Techniques, vol.27, issue.12, 1979.
DOI : 10.1109/TMTT.1979.1129778

]. A. Farcy, M. Gallitre, V. Arnal, J. Torres, B. Fléchet et al., Evolution and challenges of interconnect technologies and performance, 12th IEEE Signal Propagation on Interconnects, 2008.
URL : https://hal.archives-ouvertes.fr/hal-00397838

]. J. Gambino, F. Chen, and J. He, Copper interconnect technology for the 32nm node and beyond, Proceeding of IEEE Custom Integrated Circuits Conference, CICC'09, pp.141-148, 2009.

E. Kamel, Resistance switching in HfO2 metal-insulator-metal devices, Journal of Applied Physics, 2010.
URL : https://hal.archives-ouvertes.fr/hal-00623440

]. Y. Ismail and E. G. Friedman, Optimum repeater insertion based on a CMOS delay model for on-chip RLC interconnect, Proceedings Eleventh Annual IEEE International ASIC Conference (Cat. No.98TH8372), pp.369-373, 1998.
DOI : 10.1109/ASIC.1998.723040

]. F. Kamel, P. Gonon, C. Vallée, and C. , Electrode effects on the conduction mechanisms in HfO2-based metal-insulator-metal capacitors, Journal of Applied Physics, vol.106, issue.6, 2009.
DOI : 10.1063/1.3226857
URL : https://hal.archives-ouvertes.fr/hal-00455514

H. Kawaguchi and T. Sakurai, Delay and noise formulas for capacitively coupled distributed RC lines, Proceedings of 1998 Asia and South Pacific Design Automation Conference, pp.35-43, 1998.
DOI : 10.1109/ASPDAC.1998.669394

]. K. Kouicem, Analyse et correction des erreurs résiduelles sur analyseur de réseau hyperfréquences, Thèse de doctorat, 1996.

]. W. Kruppa and K. F. Sodomsky, An Explicit Solution for the Scattering Parameters of a Linear Two-Port Measured with an Imperfect Test Set (Correspondence), IEEE Transactions on Microwave Theory and Techniques, vol.19, issue.1, pp.122-123, 1971.
DOI : 10.1109/TMTT.1971.1127466

]. N. Magen, A. Kolodny, U. Weiser, and N. Shamir, Interconnect-power dissipation in a microprocessor, Proceedings of the 2004 international workshop on System level interconnect prediction , SLIP '04, pp.7-13, 2004.
DOI : 10.1145/966747.966750

. Oppenheim, Digital Signal Processing, IEEE Transactions on Systems, Man, and Cybernetics, vol.8, issue.2, 1975.
DOI : 10.1109/TSMC.1978.4309917

J. Charbonnier, C. Ferrandon, C. Fuchs, and . Flechet, Electrical Characterization and Impact on Signal Integrity of New Basic Interconnection Elements inside 3D Integrated Circuits, Proc 61th Electronic Components and Technology Conference, 2011.
URL : https://hal.archives-ouvertes.fr/hal-01069258

R. Abinash and M. H. Chowdhury, Analysis of the Impacts of Signal Slew and Skew on the Behavior of Coupled RLC Interconnects for Different Switching Patterns, IEEE Trans. on Very Large Scale Integration, vol.18, issue.2, pp.338-342, 2010.

P. Ewout and . Vandamme, Improved Three-Step De-Embedding Method to Accurately Account for the Influence of Pad Parasitics in Silicon On-Wafer RF Test- Structures, IEEE Transactions on Electron Devices, vol.48, p.4, 2001.

]. H. Veendrick, Short-circuit power dissipation of static CMOS circuitry and its impact on the design of buffer circuits, SC- 19, pp.468-473, 1984.

. Chr, R. Werner, A. Göttsche, U. Wörner, and . Ramacher, Crosstalk Noise in Future Digital CMOS Circuits, 0331, Design, Automation, and Test in Europe (DATE '01), 2001.

I. Rolfes and B. Schiek, Fully Automated Measurements of Calibrated Scattering Parameters of Multi-Ports with a Two-Port Network Analyzer, Microwave Conference, 2007.

D. F. Williams, Characteristic-impedance measurement error on lossy substrates, IEEE Microwave and Wireless Components Letters, vol.11, issue.7, pp.299-301, 2001.
DOI : 10.1109/7260.933777

. M. Winkel-1-]-t, L. S. Winkel, H. Dutta, and . Grabinski, An accurate Determination of the Impedance of Lossy Lines on Chips Based on High Frequency S-parameter Measurements, 1996.

]. T. Winkel, L. S. Dutta, and H. Grabinski, An On-Wafer Deembedding Procedure for Devices under Measurement with Error-Networks Containing Arbitrary Line Lengths, 47th ARFTG Conference Digest, pp.102-111, 1996.
DOI : 10.1109/ARFTG.1996.327170

]. Wong, G. Lee, and D. Ma, Modeling of interconnect capacitance, delay, and crosstalk in VLSI, IEEE Transactions on Semiconductor Manufacturing, vol.13, issue.1, pp.108-111, 2000.
DOI : 10.1109/66.827350

@. S. De-rivaz, A. Farcy, D. Deschacht, T. Lacrevaz, and B. Fléchet, Règles de conception des Réseaux d'Interconnexions de Circuits CMOS-45 nm en vue de la Réduction Conjointe de la Diaphonie et des Délais pour la Transmission de Signaux Numériques Très Rapides, Colloque International TELECOM'2011 & 7èmes JFMMA, pp.16-18, 2011.

@. S. De-rivaz, A. Farcy, D. Deschacht, T. Lacrevaz, and B. Fléchet, Effective interconnect networks design in CMOS 45 nm circuits to joint reductions of XT and delay for transmission of very high speed signals, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, 2010.
DOI : 10.1109/EDAPS.2010.5683042
URL : https://hal.archives-ouvertes.fr/lirmm-00546304

@. S. De-rivaz, A. Farcy, D. Deschacht, T. Lacrevaz, and B. Flechet, Benefit on interconnect performance of a relaxed wire density in a 45 nm node of the Back End of Line, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects, 2010.
DOI : 10.1109/SPI.2010.5483594
URL : https://hal.archives-ouvertes.fr/lirmm-00485629

@. S. De-rivaz, T. Lacrevaz, C. Bermond, A. Farcy, and B. Fléchet, Rise time reduction of high speed digital signals on interconnects of the CMOS 45 nm node by optimizing interconnect inductance, 2009 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC), 2009.
DOI : 10.1109/IMOC.2009.5427556
URL : https://hal.archives-ouvertes.fr/hal-00602870

@. S. De-rivaz, T. Lacrevaz, M. Gallitre, A. Farcy, B. Blampey et al., Impact of ULK Dielectric Loss on Interconnect Response for 45 nm Node Integrated Circuits, 2009 International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects, 2009.
DOI : 10.1109/IMWS.2009.4814921
URL : https://hal.archives-ouvertes.fr/hal-00399022

@. B. Fléchet, M. Blampey, A. Gallitre, T. Farcy, S. Lacrevaz et al., II Publications comme co-auteur II.1 Revue avec référés et publication des actes Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node, Dielectric Loss Effects on the Modeling of Interconnect Responses for the 45 nm Node Propagation on Interconnects, pp.329-332, 2008.

@. D. Deschacht, S. De-rivaz, A. Farcy, T. Lacrevaz, and B. Fléchet, Keep on shrinking interconnect size: Is it still the best solution?, 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2010.
DOI : 10.1109/IEMT.2010.5746734
URL : https://hal.archives-ouvertes.fr/hal-01074798

@. E. Eid, T. Lacrevaz, C. Bermond, S. De-rivaz, S. Capraro et al., Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects, 2010.
DOI : 10.1109/SPI.2010.5483585
URL : https://hal.archives-ouvertes.fr/hal-00604327

@. E. Eid, T. Lacrevaz, C. Bermond, S. De-rivaz, S. Capraro et al., Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking, Materials for Advanced Metallization, 2010.
URL : https://hal.archives-ouvertes.fr/hal-01068838

@. E. Eid, T. Lacrevaz, S. De-rivaz, C. Bermond, B. Fléchet et al., Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking, 2009 IEEE International Conference on 3D System Integration, 2009.
DOI : 10.1109/3DIC.2009.5306547
URL : https://hal.archives-ouvertes.fr/hal-00602866

I. Encadrement and @. Martin, Architectures de coupleurs dans les circuits intégrés», 2009.

@. F. Tchoffo-talom, S. Bories, C. Delaveaud, S. De-rivaz, and B. Uguen, Comparison of UWB antennas according to systems performances, 2nd European Conference on Antennas and Propagation (EuCAP 2007), 2007.
DOI : 10.1049/ic.2007.0846
URL : https://hal.archives-ouvertes.fr/hal-00438615

@. S. De-rivaz, B. Denis, M. Pezzin, and L. Ouvry, Performance of IEEE 802.15.4a UWB Systems Under Multi-User Interference, 2007 IEEE 18th International Symposium on Personal, Indoor and Mobile Radio Communications, 2007.
DOI : 10.1109/PIMRC.2007.4394401

@. S. Dubouloz, S. De-rivaz, M. Sambuq, and L. Ouvry, Effects of Hard Decision on the Detection of Regular Preambles for UWB Non-Coherent Communications, IEEE ICUWB, pp.24-27, 2006.

@. B. Denis, M. Pezzin, S. De-rivaz, S. Dubouloz, M. Sambuq et al., A LDR IR-UWB Receiver Architecture Based on 1-bit Direct Sampling, 2006.

@. S. Dubouloz, A. Rabbachin, S. De-rivaz, B. Denis, and L. Ouvry, Performance analysis of low complexity solutions for UWB low data rate impulse radio, 2006 IEEE International Symposium on Circuits and Systems, 2006.
DOI : 10.1109/ISCAS.2006.1693115

@. S. Dubouloz, B. Denis, S. De-rivaz, and L. Ouvry, Performance Analysis of LDR UWB Non-Coherent Receivers in Multipath Environments, 2005 IEEE International Conference on Ultra-Wideband, 2005.
DOI : 10.1109/ICU.2005.1570037

@. S. De-rivaz, B. Denis, J. Keignart, M. Pezzin, N. Daniele et al., Performances analysis of a UWB receiver using complex processing, IEEE Conference on Ultra Wideband Systems and Technologies, 2003, 2003.
DOI : 10.1109/UWBST.2003.1267838

.. En-puissance, 250 XII Annexe 12 : Problème numérique des sauts de phase lors de l'application de fonctions sinus et cosinus hyperboliques inverses et de racines carrées 259 XIII Annexe 13 : Modèle localisé et propagation, XI Annexe 11 : Gains en tension et 260 XIV Annexe 14: Effet d'un élément parasite sur un système du 1 er 264 XV Annexe 15 : Rappels théoriques sur les matériaux diélectriques, p.270