C. A. Bower, E. Menard, and P. E. Garrou, Transfer printing: An approach for massively parallel assembly of microscale devices, 2008 58th Electronic Components and Technology Conference, pp.1105-1109, 2008.
DOI : 10.1109/ECTC.2008.4550113

C. A. Bower, E. Menard, S. Bonafede, and S. Burroughs, Transfer-printed microscale integrated circuits, 2009 59th Electronic Components and Technology Conference, pp.618-623, 2009.
DOI : 10.1109/ECTC.2009.5074077

J. Bryzek, S. Nasiri, A. Flannery, H. Kwon, M. Novack et al., Very large scale integration of moems mirrors, mems angular amplifiers and high-voltage, high-density IC electronics for photonic switching A new approach for a low cost CPV module design utilizing micro-transfer printing technology, Proc. 6 th International Conference on Concentrating Photovoltaic Systems, AIP Conference Proceedings, pp.428-431, 2003.

K. H. Chan, S. Y. Hsieh, and . Yang, Thin-film patterns directly fabricated using a transfer stamping technique, Journal of Micromechanics and Microengineering, vol.19, issue.2, pp.25010-406, 2002.
DOI : 10.1088/0960-1317/19/2/025010

C. H. Chen and Y. C. Lee, Contact printing for direct metallic pattern transfer based on pulsed infrared laser heating, Journal of Micromechanics and Microengineering, vol.17, issue.7, pp.1252-1256, 2007.
DOI : 10.1088/0960-1317/17/7/006

. M. Cho-03-]-k, J. A. Choi, and . Rogers, A photocurable poly(dimethylsiloxane) chemistry designed for soft lithographic molding and printing in the nanometer regime, Journal of the American Chemical Society, vol.125, issue.14, pp.4060-4061, 2003.

C. H. Chu, L. S. Huang, J. Y. Chen, I. L. Lee, and P. Chang, A new integration of device-scale micropackaging with bi-directional tunable capacitors Heterogeneous integration technology for combinaison of different wafer sizes using an expandable handle substrate, Proc. IEEE The Sixteenth Annual International Conference on Micro Electro Mechanical Systems Proc. IEEE 24th International Conference on Micro Electro Mechanical Systems, pp.654-657, 2003.

U. Dragoi, E. D. Gosele, K. Kyriakis-bitzaros, G. Minoglou, and . Halkias, Wafer-scale integration of GaAs optoelectronic devices with standard Si integrated circuits using a low temperature bonding procedure Low-cost AFM cantilever manufacturing Technology, Applied Physics Letters Journal of Micromechanics and Microengineering, vol.81, issue.18, pp.5099-5101, 2002.

U. R. Guerre, D. Drechsler, M. Jubin, and . Despont, Selective Transfer Technology for Microdevice Distribution, Journal of Microelectromechanical Systems, vol.17, issue.1, pp.157-165, 2008.
DOI : 10.1109/JMEMS.2007.911370

T. Milosavljevic, P. B. Vaha-heikkila, M. Kirby, H. Despont, M. Onoe et al., Wafer-level transfer technologies for PZTbased RF MEMS switches Hidden vertical comb-drive actuator on PDMS fabricated by parts-transfer, Proc. IEEE 21 st International Conference on Micro Electro Mechanical Systems, pp.548-560, 2008.

. B. Jos-10-]-m, S. J. Joshi, M. S. Hu, and . Goorsky, Low temperature processing of porous silicon films for wafer bonding-based thin-film layer transfer applications, Journal of The Electrochemical Society, vol.157, issue.10, pp.909-914, 2010.

A. Jourdain, X. Rottenberg, G. Carchon, H. A. Tilmans, H. Kawata et al., Optimization of 0-level packaging for RF-MEMS devices New fine metal pattern fabrication by transferral process Cantilever fabrication by force free release transfer process Cantilever fabrication by force-free release transfer, Proc. 12th International Conference on Solid-State Sensors, Actuators and Microsystems Conference, Transducers Proc. Microprocesses and Nanotechnology, pp.1915-1918, 2003.

H. Kawata, K. Ryugou, S. Ohta, M. Yasuda, Y. Hirai et al., Fabrication of cantilevers by two-step transfer process without lithography Deterministically assembled three-dimensional silicon microstructures using elastomeric stamps, Proc. IEEE 25 th International Conference on Micro Electro Mechanical Systems, pp.224-227, 2009.

]. J. Kim-05, N. Kim, B. Takamaand, and . Kim, Novel pattern transfer technique on flexible polymer structure for advanced microfluidic systems, Proc. the 13 th International Conference on Solid-State Sensors Actuators and Microsystems, Transducers, pp.1424-1428, 2005.

. K. Kim-07-]-y, S. H. Kim, S. W. Yi, B. K. Kim, and . Ju, A novel low-temperature microcap packaging using SU-8 bonding, Proc. Solid-State Sensors, Actuators and Microsystems Conference, Transducers, pp.2107-2110, 2007.

L. A. Kim, P. O. Anikeeva, S. A. Coe-sullivan, J. S. Steckel, M. G. Bawendi et al., Contact Printing of Quantum Dot Light-Emitting Devices, Nano Letters, vol.8, issue.12, pp.4513-4517, 2008.
DOI : 10.1021/nl8025218

]. S. Kim-10, J. Kim, A. Wu, S. H. Carlson, A. Jin et al., Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printing CMOS-integrable pistontype micromirror array for adaptive optics made of mono-crystalline silicon using 3D integration, Proc. of the National Academy of Sciences Proc. IEEE 22 nd International Conference on Micro Electro Mechanical Systems, pp.1007-1010, 2009.

. Nuzzo, Selective Transfer of Microstructured Silicon: A printing-based approach to highperformance thin-film transistors supported on flexible substrates High-resolution patterning of aluminum thin films with a water-mediated transfer process, Advanced Materials Advanced Materials, vol.17, issue.1913, pp.2332-2336, 2005.

]. V. Lin-10, M. Lindroos, A. Tilli, T. Lehto, S. Motooka et al., Handbook of silicon based MEMS materials and technologies Silicon wafer bonding technology for VLSI and MEMS applications Harvesting and transferring vertical pillar arrays of single-crystal semiconductor devices to arbitrary substrates, EMIS Processing Series IEEE Transactions on Electron Devices, vol.1, issue.578, pp.1856-1864, 2010.

Y. L. Loo, R. L. Willett, K. W. Baldwin, and J. A. Rogers, Additive, nanoscale patterning of metal films with a stamp and a surface chemistry mediated transfer process: Applications in plastic electronics, Applied Physics Letters, vol.81, issue.3, pp.562-564, 2002.
DOI : 10.1063/1.1493226

M. M. Maharbiz, M. B. Cohn, R. T. Howe, R. P. Horowitz-;-a, and . Pisano, Batch micropackaging by compression-bonded wafer-wafer transfer, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291), pp.482-489, 1999.
DOI : 10.1109/MEMSYS.1999.746876

]. T. Matsumura, M. Esashi, H. Harada, and S. Tanaka, Multi-band radio-frequency filters fabricated using polyimide-based membrane transfer bonding technology, Journal of Micromechanics and Microengineering, vol.20, issue.9, p.95027, 2010.
DOI : 10.1088/0960-1317/20/9/095027

V. Milanovic, M. Maharbiz, K. S. Pister, H. Moriceau, F. Fournel et al., Batch transfer integration of RF microrelays Microwave and Guided Wave Letters New layer transfers obtained by the SmartCut process, MOR 03, pp.313-315, 2000.

S. Hayazawa and . Kawata, Nanoscale patterning induced strain redistribution in ultrathin strained Si layers on oxide, Nanotechnology, vol.21, p.134013, 2010.

F. Niklaus, S. Haasl, and G. Stemme, Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding, Journal of Microelectromechanical Systems, vol.12, issue.4, pp.465-469, 2003.
DOI : 10.1109/JMEMS.2003.815833

F. Niklaus, G. Stemme, J. Q. Lu, R. J. Gutmann, H. Onoe et al., Adhesive wafer bonding Three-dimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transfer, Journal of Applied Physics Journal of Micromechanics and Microengineering, vol.99, issue.179, pp.31101-1818, 2006.

H. Onoe, A. Nakai, E. Iwase, K. Matsumoto, and I. Shimoyama, Temperature-controlled transfer and self-wiring for multi-color light-emitting diode arrays, Journal of Micromechanics and Microengineering, vol.19, issue.7, p.75015, 2009.
DOI : 10.1088/0960-1317/19/7/075015

S. Park, H. Schift, C. Padeste, B. Schnyder, R. Kötz et al., Anti-adhesive layers on nickel stamps for nanoimprint lithography, Microelectronic Engineering, vol.73, issue.74, pp.74-196, 2004.
DOI : 10.1016/S0167-9317(04)00098-X

H. A. Onishib, G. Tilmansa, J. Roelkens, D. Brouckaert, R. Van-thourhout et al., Adhesive bonding of InP/InGaAsP dies to processed silicon-on-insulator wafers using dvs-bisbenzocyclobutene, Proc. EurosensorsXXV, pp.1505-1508, 2006.

F. Saharil, R. V. Wright, P. Rantakari, P. B. Kirby, T. Vaha-heikkila et al., Low-temperature CMOS-compatible 3D-integration of monocrystalline-silicon based PZT RF MEMS switch actuators on rf substrates, 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), pp.47-50, 2010.
DOI : 10.1109/MEMSYS.2010.5442568

S. Seok, N. Rolland, P. A. Rolland, E. J. Smythe, M. D. Dickey et al., Packaging methodology for RF devices using a BCB membrane transfer technique, Journal of Physics: Conference Series, pp.2384-59, 2006.
DOI : 10.1088/0960-1317/16/11/019

W. C. Welch, I. , J. Chae, and K. Najafi, Hydrogen-implant induced exfoliation of silicon and other crystals Transfer of metal MEMS packages using a wafer-level solder transfer technique, IEEE Transactions on Advanced Packaging, pp.3519-643, 1997.

C. W. Wu, Y. K. Shen, S. Y. Chuang, and C. S. Wei, Anti-adhesive effects of diverse self-assembled monolayers in nanoimprint lithography, Sensors and Actuators A: Physical, vol.139, issue.1-2, pp.145-151, 2007.
DOI : 10.1016/j.sna.2006.10.017

]. J. Yoo-10, S. Yoon, I. S. Jo, I. Chun, H. S. Jung et al., GaAs photovoltaics and optoelectronics using releasable multilayer epitaxial assemblies, Nature, vol.465, pp.329-333, 2010.

Y. K. Zhao, S. O. Yoon, X. Choi, Z. Wu, M. G. Liu et al., Three dimensional metal pattern transfer for replica molded microstructures, Applied Physics Letters, vol.94, issue.2, pp.23301-1477, 2006.
DOI : 10.1063/1.3063122

F. Zimmer, F. Niklaus, M. Lapisa, T. Ludewig, M. Bring et al., Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding Room temperature vacuum sealing using surface activated bonding method Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices, Proc. 12 th International Conference on Solid-State Sensors Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices, pp.720807-1828, 2003.

]. T. Kekesi and M. Isshiki, Electrodeposition of copper from pure cupric chloride hydrochloric acid solutions, Journal of Applied Electrochemistry, vol.27, issue.8, pp.982-990, 1997.
DOI : 10.1023/A:1018418105908

. K. Kim-08-]-y, E. K. Kim, S. W. Kim, . Kim, and . Byeong-kwon, Low temperature epoxy bonding for wafer level MEMS packaging, Sensors and Actuators A: Physical, vol.143, issue.2, pp.323-328, 2008.
DOI : 10.1016/j.sna.2007.10.048

V. G. Kutchoukov, F. Laugere, W. Van-der-vlist, L. Pakula, Y. Garini et al., Fabrication of nanofluidic devices using glass-to-glass anodic bonding, Sensors and Actuators A: Physical, vol.114, issue.2-3, pp.521-527, 2004.
DOI : 10.1016/j.sna.2003.12.027

S. Lani, Etude de procédés d'encapsulation sur tranche sous vide ou quasi-hermétique pour les microsystems (opto)électronmécaniques, 2007.

S. Lani, A. Bosseboeuf, O. Garel, F. Parrain, N. Isac et al., Multilayer Au-Si Eutectic Wafer Bonding with Microstructured Sealing Rings, ECS Transactions, pp.147-154, 2008.
DOI : 10.1149/1.2982864

M. Lindblom, H. M. Hertz, and A. Holmberg, Pulse reverse plating for uniform nickel height in zone plates, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.24, issue.6, pp.2848-2851, 2006.
DOI : 10.1116/1.2395953

S. Lyer, J. Auberton-hervé, M. J. Madou, R. I. Made, C. L. Gan et al., Silicon wafer bonding technology for VLSI and MEMS applications Fundamentals of microfabrication. The science of miniaturization, Study of lowtemperature thermocompression bonding in Ag-In solder for packaging applications, pp.365-371, 2002.

W. Menz, J. Mohr, and O. Paul, Microsystem technology, 2001.
DOI : 10.1002/9783527613007

C. Taibi and . Deguet, Low temperature direct bonding: An attractive technique for heterostructures buildup, Microelectronics Reliability, vol.52, issue.2, pp.331-341

H. Moriceau, F. Rieutord, F. Fournel, B. Imbert, L. Dicioccio et al., Low temperature direct bonding assisted by CMP and plasma activation Low-temperature wafer-level transfer bonding A method to maintain wafer alignment precision during adhesive wafer bonding, Proc. 3 rd IEEE International Workshop on Low Temperature Bonding for 3D Integration Sensors and Actuators A, pp.123-129, 2001.

F. Niklaus, G. Stemme, J. Q. Lu, and R. J. Gutmann, Adhesive wafer bonding, Journal of Applied Physics, vol.99, issue.3, p.31101, 2006.
DOI : 10.1063/1.2168512

F. Niklaus, G. Stemme, J. Q. Lu, and R. J. Gutmann, Adhesive wafer bonding, Journal of Applied Physics, vol.99, issue.3, p.31101, 2006.
DOI : 10.1063/1.2168512

J. Oberhammer, F. Niklaus, and G. Stemme, Sealing of adhesive bonded devices on wafer level, Sensors and Actuators A: Physical, vol.110, issue.1-3, pp.407-412, 2004.
DOI : 10.1016/j.sna.2003.06.003

]. I. Pau-06, B. Paul, K. M. Majeed, J. Razeeb, and . Barton, Statistical fracture modeling of silicon with varying thickness, Acta Materialia, vol.54, issue.15, pp.3991-4000, 2006.

F. E. Rasmussen, J. T. Ravnkilde, P. T. Tang, O. Hansen, and S. Bouwstra, Croissance électrolytique sélective de métaux : application à la fabrication de micro-objets tri-dimensionnelsElectroplating and characterization of cobalt-nickel-iron and nickel-iron for magnetic Microsystems applications, Sensors and Actuators A, vol.92, pp.1-3242, 2001.

K. A. Reinhardt, W. Kern, and J. Robertson, Handbook of silicon wafer cleaning technology Diamond-like amorphous carbon, Materials Science and Engineering, vol.37, pp.4-6, 2002.

M. Paunovic, Modern Electroplating: Fourth Edition, 2000.

S. Seok, N. Rolland, and P. Rolland, A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications, Sensors and Actuators A: Physical, vol.147, issue.2, pp.677-682, 2008.
DOI : 10.1016/j.sna.2008.06.008

URL : https://hal.archives-ouvertes.fr/hal-00356915

A. Shigetou and T. Suga, Modified Diffusion Bonding of Chemical Mechanical Polishing Cu at 150 ??C at Ambient Pressure, Applied Physics Express, vol.2, p.56501, 2009.
DOI : 10.1143/APEX.2.056501

B. Meron, P. S. Lin, and . Pershan, Surface crystallization in a liquid AuSi alloy, Science, vol.313, issue.5783, pp.77-80, 2006.

L. De-stefano, K. Malecki, F. G. Della-corte, L. Moretti, I. Rea et al., A microsystem based on porous silicon-glass anodic bonding for gas and liquid optical sensing The fabrication of lab-on-chip devices from fluoropolymères, Sensors Journal of Micromechanics and Microengineering, vol.6, issue.18, pp.680-687, 2006.

H. Takagi, R. Maeda-;-t, R. Suga, and . Maeda, by Ar-beam surface activation, Journal of Micromechanics and Microengineering, vol.11, issue.4, pp.348-352, 2001.
DOI : 10.1088/0960-1317/11/4/311

U. Gösele, Rôle des propriétés d'un plasma hors équilibre He et NH 3 dans l'amélioration de l'adhésion des films de polypropylène. Caractérisation physico-chimique des interfaces aluminium/polypropylene Semiconductor wafer bonding -Science and technology, 1995.

M. Volpert, C. Kopp, J. Routin, A. Gasse, S. Bernabe et al., A fluxless bonding process using AuSn or Indium for a miniaturized hermetic package, 2009 59th Electronic Components and Technology Conference, pp.224-231, 2009.
DOI : 10.1109/ECTC.2009.5074021

. Caporiccio, Polymer film formation in C 2 F 6 -H 2 discharges, Thin Solid Films, vol.143, issue.2, pp.163-175, 1986.

F. Agostino, F. Cramarossa, and . Illuzzi, Mechanisms of deposition and etching of thin films of plasma?polymerized fluorinated monomers in radio frequency discharges fed with C 2 F 6 ?H 2 and C 2 F 6 ?O 2 mixtures, Journal of Applied Physics, vol.87, issue.618, pp.2754-2762, 1887.

F. Agostino, F. Cramarossa, F. Fracassi, G. Illuzzi, and . Caporiccio, Films, layers, tapes, plates and similar structures of metal or plastic materials coated with thin polyfluorocarbon films, 1988.

R. Agostino, P. Favia, and F. Fracassi, Plasma peocessing polymers, 1997.

F. Awaja, M. Gilbert, G. Kelly, G. , B. Fox et al., Adhesion of polymers, Progress in Polymer Science, vol.34, issue.9, pp.948-968, 2009.
DOI : 10.1016/j.progpolymsci.2009.04.007

A. A. Ayóna1, D. Chena1, R. Khannaa1, R. Braffa1, H. H. Sawina1 et al., A novel integrated MEMS process using fluorocarbon films deposited with a deep reactive ion etching (DRIE) tool, MRS Proceedings, pp.141-147, 1999.

E. J. Badey, D. Espuche, B. Sage, Y. Chabert, C. Jugnet et al., A comparative study of the effects of ammonia and hydrogen plasma downstream treatment on the surface modification of polytetrafluoroethylene, Polymer, vol.37, issue.8, pp.1377-1386, 1996.
DOI : 10.1016/0032-3861(96)81135-9

M. Beck, M. Graczyk, I. Maximov, E. L. Sarwe, T. Ling et al., Improving stamps for 10 nm level wafer scale nanoimprint lithography, Microelectronic Engineering, vol.61, issue.62, pp.441-448, 2002.
DOI : 10.1016/S0167-9317(02)00464-1

B. Bhushan, Handbook of nanotechnology, 2004.

H. Biederman and D. Slav-nsk, Plasma polymer films and their future prospects, Surface and Coatings Technology, vol.125, issue.1-3, pp.371-376, 2000.
DOI : 10.1016/S0257-8972(99)00578-2

F. A. Billard and . Perry, Pulvérisation cathodique magnetron, 1654.

. S. Bod-05-]-d, S. A. Bodas, and . Gangal, PTFE as a masking material for MEMS fabrication, Journal of Micromechanics and Microengineering, vol.15, issue.4, pp.802-806, 2005.

. S. Brault, Etude du procédé de transfert de films. Applications : Encapsulation sur tranche et élaboration de micro-dispositifs, 2010.

O. S. Brault, G. Garel, N. Schelcher, F. Isac, A. Parrain et al., MEMS packaging process by film transfer using an anti-adhesive layer, Microsystem Technologies, pp.1277-1284, 2010.
DOI : 10.1007/s00542-010-1021-0

. S. But-97-]-r, D. R. Butter, A. H. Waterman, R. T. Lettington, E. J. Ramos et al., Production and wetting properties of fluorinated diamond-like carbon coatings, Thin Solid Films, vol.311, issue.12, pp.107-113, 1997.

T. M. Alami and . Duc, Surface modification of poly(tetrafluoroethylene) in RF glow-discharge NH 3 ) plasmas. XPS characterization, Polymer Surface Modification: Relevance to Adhesion, vol.2, issue.2 2 2, pp.3-27, 2000.

S. P. Chevallier, S. Holvoet, P. Turgeon, J. J. Horny, D. Pireaux et al., Annealing and ultraviolet treatment of plasma fluorocarbon films for enhanced cohesion and stability, Journal of Applied Polymer Science, vol.2482, issue.6, pp.3176-3186, 2010.
DOI : 10.1002/app.32621

W. M. Choi and O. O. Park, A soft-imprint technique for direct fabrication of submicron scale patterns using a surface-modified PDMS mold, Microelectronic Engineering, vol.70, issue.1, pp.131-136, 2003.
DOI : 10.1016/S0167-9317(03)00436-2

W. K. Choi, T. Y. Ong, L. S. Tan, F. C. Loh, and K. L. Tan, Infrared and x-ray photoelectron spectroscopy studies of as-prepared and furnace-annealed radio-frequency sputtered amorphous silicon carbide films, Journal of Applied Physics, vol.83, issue.9, pp.4968-4973, 1998.
DOI : 10.1063/1.367299

C. Corr, R. Boswell, and R. Carman, Gas phase optical emission spectroscopy during remote plasma chemical vapour deposition of GaN and relation to the growth dynamics, Journal of Physics D: Applied Physics, vol.44, issue.4, p.45201, 2011.
DOI : 10.1088/0022-3727/44/4/045201

B. Cruden, K. Chu, K. Gleason, and H. Sawin, Thermal Decomposition of Low Dielectric Constant Pulsed Plasma Fluorocarbon Films: I. Effect of Precursors and Substrate Temperature, Journal of The Electrochemical Society, vol.146, issue.12, pp.4590-4596, 1999.
DOI : 10.1149/1.1392679

G. C. Cuminatto, G. Schelcher, F. Parry, M. Parrain, and . Braccini, Crack propagation at BCB-Si patterned interface: mechanical characterization and modeling, 2011.

K. Danaie, Membranes micro-usinées par gravure chimique anisotrope : Application à la caractérisation des films minces, 2002.

W. A. Daoud, J. H. Xin, Y. H. Zhang, and C. L. Mak, Pulsed laser deposition of superhydrophobic thin Teflon films on cellulosic fibers, Thin Solid Films, vol.515, issue.2, pp.835-837, 2006.
DOI : 10.1016/j.tsf.2005.12.245

F. S. Denes and S. Manolache, Macromolecular plasma-chemistry: an emerging field of polymer science, Progress in Polymer Science, vol.29, issue.8, pp.815-885, 2004.
DOI : 10.1016/j.progpolymsci.2004.05.001

F. Rabold, P. Goldschmidtböing, and . Woias, Versatile low temperature wafer bonding and bond strength measurement by a blister test method, Microsystem Technologies, pp.418-429, 2006.

J. Filika, P. W. Maya, S. R. Pearcea, R. K. Wildb, and K. R. Hallamb, XPS and laser Raman analysis of hydrogenated amorphous carbon films, Diamond and Related Materials, vol.12, issue.3-7, pp.3-7, 2003.
DOI : 10.1016/S0925-9635(02)00374-6

. Gabriel, J. Stepanov, and . Meichsner, plasmas and their relation to surface processes, Journal of Physics D: Applied Physics, vol.40, issue.23, pp.7383-7391, 2007.
DOI : 10.1088/0022-3727/40/23/020

P. Garrou, C. Bower, and P. Wiley-vch, Handbook of 3D integration, 2008.

. K. Gna-08-]-a, O. Gnanappa, F. Slattery, C. Peters, C. O-'murchu et al., Factors influencing adhesion of fluorocarbon (FC) thin film on silicon substrate, Thin Solid Films, vol.516, issue.16, pp.5673-5680, 2006.

M. Grischke, A. Hieke, F. Morgenweck, and H. Dimigen, Variation of the wettability of DLC-coatings by network modification using silicon and oxygen, Diamond and Related Materials, vol.7, issue.2-5, pp.454-458, 1998.
DOI : 10.1016/S0925-9635(97)00237-9

M. K. Hooda, M. Wadhwa, S. Verma, M. M. Nayak, P. J. George et al., A systematic study of DRIE process for high aspect ratio microstructuring, Vacuum, vol.84, issue.9, pp.1142-1148, 2010.
DOI : 10.1016/j.vacuum.2010.01.052

. W. Jas-99-]-r, H. Jaszewski, B. Schift, A. Schnyder, P. Schneuwly et al., The deposition of antiadhesive ultra-thin teflon-like films and their interaction with polymers during hot embossing, Applied Surface Science, vol.143, issue.1, pp.301-308, 1999.

B. J. Jeon, S. Lee, and J. K. Lee, Adhesion characteristics of copper thin film deposited on PET substrate by electron cyclotron resonance???metal organic chemical vapor deposition, Surface and Coatings Technology, vol.202, issue.9, pp.1839-1846, 2008.
DOI : 10.1016/j.surfcoat.2007.08.015

. J. Kan-07-]-s, V. M. Kang, and . Donnelly, Optical absorption and emission spectroscopy studies of ammoniacontaining plasmas, Plasma Sources Science and Technology, vol.16, pp.265-272, 2007.

S. Keller, D. Haefliger, and A. Boisen, Optimized plasma-deposited fluorocarbon coating for dry release and passivation of thin SU-8 cantilevers, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.25, issue.6, pp.1903-1908, 2007.
DOI : 10.1116/1.2806960

U. König, M. Nitschke, M. Pilz, F. Simon, C. Arnhold et al., Stability and ageing of plasma treated poly(tetrafluoroethylene) surfaces, Colloids and Surfaces B: Biointerfaces, vol.25, issue.4, pp.313-324, 2002.
DOI : 10.1016/S0927-7765(01)00333-2

C. B. Labelle, R. Opila, and A. Kornblit, Plasma deposition of fluorocarbon thin films from c-C4F8 using pulsed and continuous rf excitation, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.23, issue.1, pp.190-196, 2005.
DOI : 10.1116/1.1830496

A. F. Laermer and . Schilp, Method of Anisotropically Etching Silicon

]. U. Lappan, H. M. Buchhammer, and K. Lunkwitz, Surface modification of poly(tetrafluoroethylene) by plasma pretreatment and adsorption of polyelectrolytes, Polymer, vol.40, issue.14, pp.4087-4091, 1999.
DOI : 10.1016/S0032-3861(98)00647-8

S. D. Lawes, The application of surface coatings for low wear and low friction performance between valve-train components, 2009.

F. Lewis, . Horny, . Hale, . Turgeon, D. Tatoulian et al., Study of the adhesion of thin plasma fluorocarbon coatings resisting plastic deformation for stent applications, Journal of Physics D: Applied Physics, vol.41, issue.4, p.45310, 2008.
DOI : 10.1088/0022-3727/41/4/045310

F. Lewis, Etude et optimisation de l'adhérence d'un revêtement fluorocarboné déposé par plasma sur de l'acier inoxydable 316L pour les stents coronariens, 2009.

]. F. Lew-10, S. Lewis, P. Turgeon, J. J. Chevallier, M. Pireaux et al., On the growth of fluorocarbon thin films deposited on plasma-etched 316L stainless steel, Plasma Processes and Polymers, vol.7, issue.3, pp.309-317, 2010.

. M. Lis-91-]-e and . Liston, Plasma modification of polymer surfaces, Proc. Polymer-Solid Interfaces, pp.429-442, 1992.

D. Liu, J. Gu, B. , Z. Fenga, D. Lib et al., Plasma deposition of fluorocarbon thin films using pulsed /continuous and downstream radio frequency plasmas, Thin Solid Films, vol.517, issue.9, pp.3011-3019, 2008.
DOI : 10.1016/j.tsf.2008.11.105

L. Liu, Z. Wang, J. Zhu, Z. Zhang, M. Tan et al., Intrinsic stress analysis of sputtered carbon film, Chinese Optics Letters, vol.6, issue.5, pp.384-385, 2008.
DOI : 10.3788/COL20080605.0384

D. Liu, J. Gu, Z. Feng, D. Li, and J. Niu, Plasma deposition of fluorocarbon thin films using pulsed /continuous and downstream radio frequency plasmas, Thin Solid Films, vol.517, issue.9, pp.3011-3019, 2009.
DOI : 10.1016/j.tsf.2008.11.105

D. Liu, J. Gu, Z. Fenga, D. Li, J. Niu et al., Comparison of fluorocarbon film deposition by pulsed/continuous wave and downstream radio frequency plasmas, Vacuum, vol.85, issue.2, pp.253-262, 2010.
DOI : 10.1016/j.vacuum.2010.06.005

G. P. López and B. D. Ratner, Substrate temperature effects on film chemistry in plasma depositions of organics. II. Polymerizable precursors, Journal of Polymer Science Part A: Polymer Chemistry, vol.30, issue.11, pp.2415-2425, 1992.
DOI : 10.1002/pola.1992.080301116

N. M. Mackie, N. F. Dalleska, D. G. Castner, and E. R. Fisher, Inductively Coupled rf Plasmas, Chemistry of Materials, vol.9, issue.1, pp.349-362, 1997.
DOI : 10.1021/cm960388q

M. E. Maia-da-costa, I. J. Baumvol, C. Radke, L. G. Jacobsohn, R. R. Zamora et al., Effects of thermal annealing on the structural, mechanical, and tribological properties of hard fluorinated carbon films deposited by plasma enhanced chemical vapor deposition, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.22, issue.6, pp.2321-2328, 2010.
DOI : 10.1116/1.1795833

T. K. Markkula, J. A. Hunt, F. R. Pu, R. L. Williams, I. T. Martin et al., Surface chemical derivatization of plasma-treated PET and PTFE, Surface and Interface Analysis, vol.26, issue.1, pp.583-587, 2002.
DOI : 10.1002/sia.1365

W. P. Maszara, G. Goetz, A. Caviglia, A. Milella, F. Palumbo et al., Bonding of silicon wafers for silicon-on-insulator Continuous and modulated deposition of fluorocarbon films from c-C 4 F 8 plasmas, Journal of Applied Physics Plasma Processes and Polymers, vol.64, issue.12, pp.4943-4950, 1988.

A. Milella, F. Palumbo, P. Favia, G. Cicala, and R. Agostino, Deposition mechanism of nanostructured thin films from tetrafluoroethylene glow discharges, Pure and Applied Chemistry, vol.77, issue.2, pp.399-414, 2005.
DOI : 10.1351/pac200577020399

. L. Mit-76-]-k, Adhesion measurement of thin films, Electrocomponent Science and Technology, vol.3, issue.1, pp.21-42, 1976.

H. Nassar, S. Pellerin, K. Musiol, O. Martinie, N. Pellerin et al., overlapped molecular emission spectra, Journal of Physics D: Applied Physics, vol.37, issue.14, pp.1904-1916, 2004.
DOI : 10.1088/0022-3727/37/14/005

E. Neubauer, G. Korb, C. Eisenmenger-sittner, H. Bangert, S. Chotikaprakhan et al., The influence of mechanical adhesion of copper coatings on carbon surfaces on the interfacial thermal contact resistance, Thin Solid Films, vol.433, issue.1-2, pp.160-165, 2003.
DOI : 10.1016/S0040-6090(03)00318-3

B. Olbrechts and J. P. Raskin, PECVD oxide as intermediate film for wafer bonding: Impact of residual stress, Microelectronic Engineering, vol.87, issue.11, pp.2178-2186, 2010.
DOI : 10.1016/j.mee.2010.01.022

A. Polyakov, M. Bartek, and J. N. Burghartz, Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications, Journal of Electronic Packaging, vol.127, issue.1, pp.7-11, 2005.
DOI : 10.1115/1.1846059

S. D. Pringle, V. S. Joss, and C. Jones, Ammonia Plasma Treatment of PTFE Under Known Plasma Conditions, Surface and Interface Analysis, vol.20, issue.150, pp.821-829, 1996.
DOI : 10.1002/(SICI)1096-9918(199611)24:12<821::AID-SIA189>3.0.CO;2-B

M. A. Quade, K. Polak, A. Schröder, K. D. Ohl, and . Weltmann, Formation of PTFE-like films in CF4 microwave plasmas, Thin Solid Films, vol.518, issue.17, pp.4835-4839, 2010.
DOI : 10.1016/j.tsf.2010.02.005

S. Ramachandran, L. Tao, T. H. Lee, S. Sant, L. J. Overzet et al., Deposition and patterning of diamondlike carbon as antiwear nanoimprint templates, Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol.24, issue.6, pp.2993-2997, 2006.
DOI : 10.1116/1.2363409

. D. Rickerby, A review of the methods for the measurement of coating-substrate adhesion, Surface and Coatings Technology, vol.36, issue.1-2, 1988.
DOI : 10.1016/0257-8972(88)90181-8

J. Robertson, Diamond-like amorphous carbon, Materials Science and Engineering: R: Reports, vol.37, issue.4-6, pp.129-281, 2002.
DOI : 10.1016/S0927-796X(02)00005-0

URL : http://citeseerx.ist.psu.edu/viewdoc/summary?doi=

B. Saha, E. Liu, S. B. Tor, N. W. Khun, D. E. Hardt et al., Anti-sticking behavior of DLC-coated silicon micro-molds, Journal of Micromechanics and Microengineering, vol.19, issue.10, p.105025, 2009.
DOI : 10.1088/0960-1317/19/10/105025

A. Satyaprasada, S. K. Nemaa, N. K. Sinhab, and B. Raj, Deposition of thick and adherent Teflon-like coating on industrial scale stainless steel shell using pulsed dc and RF PECVD, Applied Surface Science, vol.256, issue.13, pp.4334-4338, 2010.
DOI : 10.1016/j.apsusc.2010.02.027

F. Osenberg, ;. J. Engemann-;-h, and . Scheer, Mask fabrication by nanoimprint lithography using antisticking layers, Proc. SPIE, pp.244-249, 2000.

M. J. Schabel, T. W. Peterson, and A. J. Muscat, Macromolecule formation in low density CF4 plasmas: The influence of H2, Journal of Applied Physics, vol.93, issue.3, pp.1389-1402, 2003.
DOI : 10.1063/1.1535747

]. S. Schmidbauer, J. Hahn, and F. Richter, Adhesion of metal coatings on ceramics deposited by different techniques, Surface and Coatings Technology, vol.59, issue.1-3, pp.325-329, 1993.
DOI : 10.1016/0257-8972(93)90106-X

F. F. Shi, Recent advances in polymer thin films prepared by plasma polymerization Synthesis, structural characterization, properties and applications, Surface and Coatings Technology, vol.82, issue.1-2, pp.1-15, 1995.
DOI : 10.1016/0257-8972(95)02621-5

B. K. Smith, J. J. Sniegowski, G. Lavigne, and C. Brown, Thin Teflon-like films for eliminating adhesion in released polysilicon microstructures, Sensors and Actuators A: Physical, vol.70, issue.1-2, pp.159-163, 1998.
DOI : 10.1016/S0924-4247(98)00127-7

. G. Sto-09-]-g and . Stoney, The tension of metallic films deposited by electrolysis, Proceedings of the Royal Society A, pp.172-175, 1909.

A. Taberham, M. Kraft, M. Mowlem, and H. Morgan, The fabrication of lab-on-chip devices from fluoropolymers, Journal of Micromechanics and Microengineering, vol.18, issue.6, p.64011, 2008.
DOI : 10.1088/0960-1317/18/6/064011

K. K. Takahashi and . Tachibana, Solid particle production in fluorocarbon plasmas. I. Correlation with polymer film deposition, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.19, issue.5, pp.2055-2060, 2001.
DOI : 10.1116/1.1372901

W. Willson, W. Wu, and . Hu, Durable diamond-like carbon templates for UV nanoimprint lithography, Nanotechnology, vol.19, issue.10, p.105302, 2008.

M. Tatoulian, F. Cavalli, G. Lorang, J. Amouroux, and F. Arefi-khonsari, Copper metallization of plasma-treated fluorinated polymers. Study of the interface and adhesion measurements, Polymer Surface Modification: Relevance to Adhesion, pp.183-197, 2000.

H. Usui, H. Koshikawa, and K. Tanaka, Effect of substrate temperature on the deposition of polytetrafluoroethylene by an ionization???assisted evaporation method, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.13, issue.5, pp.2318-2324, 1995.
DOI : 10.1116/1.579515

]. O. Vallin, K. Jonsson, and U. Lindberg, Adhesion quantification methods for wafer bonding, Materials Science and Engineering: R: Reports, vol.50, issue.4-5, pp.109-165, 2005.
DOI : 10.1016/j.mser.2005.07.002

P. Wang, X. Wang, T. Xu, W. Liu, and J. Zhang, Comparing internal stress in diamond-like carbon films with different structure, Thin Solid Films, vol.515, issue.17, pp.6899-6903, 2007.
DOI : 10.1016/j.tsf.2007.02.069

C. Wang, J. R. Chen, and R. Li, Studies on surface modification of poly(tetrafluoroethylene) film by remote and direct Ar plasma, Applied Surface Science, vol.254, issue.9, pp.2882-2888, 2008.
DOI : 10.1016/j.apsusc.2007.10.029

D. J. Wilson, R. L. Williams, and R. C. Pond, Plasma modification of PTFE surfaces. Part I: Surfaces immediately following plasma treatment, Surface and Interface Analysis, vol.2, issue.5, pp.385-396, 2001.
DOI : 10.1002/sia.1065

]. B. Yacobi, S. Martin, K. Davis, A. Hudson, and M. Hubert, Adhesive bonding in microelectronics and photonics, Journal of Applied Physics, vol.91, issue.10, pp.6227-6262, 2002.
DOI : 10.1063/1.1467950

V. Yanev, S. Krischok, A. Opitz, H. Wurmus, J. A. Schaefer et al., Influence of the RF power on the deposition rate and the chemical surface composition of fluorocarbon films prepared in dry etching gas plasma, Surface Science, vol.566, issue.568, pp.568-1229, 2004.
DOI : 10.1016/j.susc.2004.06.096

X. B. Yan, T. Xu, S. R. Yang, H. W. Liu, and Q. J. Xue, Characterization of hydrogenated diamond-like carbon films electrochemically deposited on a silicon substrate, Journal of Physics D: Applied Physics, vol.37, issue.17, pp.2416-2424, 2004.
DOI : 10.1088/0022-3727/37/17/012

C. H. Yang, S. C. Lee, J. M. Wu, and T. C. Lin, The properties of copper films deposited on polyimide by nitrogen and oxygen plasma pre-treatment, Applied Surface Science, vol.252, issue.5, pp.1818-1825, 2005.
DOI : 10.1016/j.apsusc.2005.03.182

A. Zhuang and . Menon, Wettability and thermal stability of fluorocarbon films deposited by deep reactive ion etching, Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol.23, issue.3, pp.434-439, 2005.
DOI : 10.1116/1.1875232

. S. Brault, Etude du procédé de transfert de films. Applications : Encapsulation sur tranche et élaboration de micro-dispositifs, 2010.

O. S. Brault, G. Garel, N. Schelcher, F. Isac, A. Parrain et al., MEMS packaging process by film transfer using an anti-adhesive layer, Microsystem Technologies, pp.1277-1284, 2010.
DOI : 10.1007/s00542-010-1021-0

P. Bruschi, M. Piotto, and G. Barillaro, Effects of gas type on the sensitivity and transition pressure of integrated thermal flow sensors, Proc. SPIE, pp.182-187, 1996.
DOI : 10.1016/j.sna.2006.03.021

E. Tatoulian and . Dufour-gergam, Fabrication of metallic patterns on polydimethylsiloxane using transfer technology: application to MRI microcoils, Micro & Nano Letters, vol.7, issue.6, pp.519-522, 2012.

O. Garel, C. Breluzeau, E. Dufour-gergam, . Bosseboeuf, . Belier et al., Fabrication of free-standing porous silicon microstructures, Journal of Micromechanics and Microengineering, vol.17, issue.7, pp.164-167, 2007.
DOI : 10.1088/0960-1317/17/7/S13

]. K. Kho-09, A. M. Khosraviani, and . Leung, The nanogap Pirani -a pressure sensor with superior linearity in an atmospheric pressure range, Journal of Micromechanics and Microengineering, vol.19, p.45007, 2009.

M. Kimura, F. Sakuraib, H. Ohtab, and T. Terada, Proposal of a new structural thermal vacuum sensor with diode-thermistors combined with a micro-air-bridge heater, Microelectronics Journal, vol.38, issue.2, pp.171-176, 2007.
DOI : 10.1016/j.mejo.2006.09.018

E. Lefeuvre, E. Martincic, M. Woytasik, X. Leroux, S. Edmond et al., Silicon on insulator temperature and pressure sensor for MEMS smart packaging, Proc. Chemistry, pp.782-785, 2009.
DOI : 10.1016/j.proche.2009.07.195

URL : https://hal.archives-ouvertes.fr/lirmm-00436120

M. Liu, W. M. Lau, J. J. Yang, G. R. Mitchell, K. Lahiji et al., On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points, Journal of Micromechanics and Microengineering, vol.17, issue.11, pp.2163-2168, 2007.
DOI : 10.1088/0960-1317/17/11/001

]. C. Morris, B. Isaacson, M. D. Grapes, and M. Dubey, Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions, Micromachines, vol.2, issue.4, pp.69-81, 2011.
DOI : 10.3390/mi2010069

J. Moulin, F. Mazaleyrat, A. Mendez, and E. Dufour-gergam, Internal stress influence on the coercivity of FeCuNbSiB thin films, Journal of Magnetism and Magnetic Materials, vol.322, issue.9-12, pp.9-12, 2010.
DOI : 10.1016/j.jmmm.2009.06.043

]. J. Mou-11, I. Moulin, F. Shahosseini, F. Alves, and . Mazaleyrat, Ultrasoft Finemet thin films for magnetoimpedance microsensors, Journal of Micromechanics and Microengineering, vol.21, p.74010, 2011.

]. S. Nazeer, Conception et réalisation de micro-capteurs de pression pour l'instrumentation d'interface à retour d'effort, 2012.

M. Pirani, Selbstzeigendes Vakuum-Messinstrument, Verhandlungen, der Deutschen Physikalischen, vol.8, issue.24, pp.686-694, 1906.

R. Puers, S. Reyntjens, and D. D. Bruyker, The NanoPirani ? an extremely miniaturised pressure sensor fabricated by focused ion beam rapid prototyping, Sensors and Actuators A, pp.97-98, 2002.

G. Schelcher, F. Fabbri, E. Lefeuvre, S. Brault, P. Coste et al., Modeling and Characterization of MicroPirani Vacuum Gauges Manufactured by a Low-Temperature Film Transfer Process, Journal of Microelectromechanical Systems, vol.20, issue.5, pp.1184-1191, 2011.
DOI : 10.1109/JMEMS.2011.2162492

F. Volklein and A. Meier, Microstructured vacuum gauges and their future perspectives, Vacuum, vol.82, issue.4, pp.420-430, 2008.
DOI : 10.1016/j.vacuum.2007.08.001

V. Lavalley and . Mathet, Fabrication of planar and three-dimensional microcoils on flexible substrates, Microsystem Technologies, pp.10-11, 2006.

P. Mathias and . Crozat, Two-and three-dimensional microcoil fabrication process for three-axis magnetic sensors on flexible substrates, Sensors and Actuators A, vol.132, issue.1, pp.2-7, 2006.

F. T. Zhang, Z. Tang, J. Yu, and R. C. Jin, A micro-Pirani vacuum gauge based on micro-hotplate technology, Sensors and Actuators A: Physical, vol.126, issue.2, pp.300-305, 2006.
DOI : 10.1016/j.sna.2005.10.016

. W. Bai-26-]-j, D. G. Mcbain, and . Hopkins, Films of adhesives, Journal of Physical Chemistry, vol.30, issue.1, pp.114-125, 1926.

J. J. Bikerman, The science of adhesive joints, 1968.

B. V. Deryagin, S. K. Zherebkov, and A. M. Medvedeva, The Role of Diffusion of Polymer Chains in the Mechanism of Adhesion and Autohesion of Rubbers, Rubber Chemistry and Technology, vol.30, issue.3, pp.837-846, 1957.
DOI : 10.5254/1.3542728

. H. Sha-63-]-l, H. Sharpe, and . Schonhorn, Theory gives direction to adhesion work, Chemical and Engineering News, vol.41, issue.15, pp.67-68, 1963.

S. S. Voyutski?, The Diffusion Theory of Adhesion, Rubber Chemistry and Technology, vol.33, issue.3, pp.748-756, 1960.
DOI : 10.5254/1.3542193

C. Annexe, G. Scientifiques-articles-de-revue-internationales, F. Schelcher, E. Fabbri, S. Lefeuvre et al., Modeling and characterization of micro Pirani vacuum gauges manufactured by a low temperature film transfer process, Journal of Microelectromechanical Systems, vol.20, issue.5, pp.1184-1191, 2011.

G. Schelcher, S. Brault, F. Parrain, E. Lefeuvre, E. Dufour-gergam et al., MEMS Process by Film Transfer Using a Fluorocarbon Anti-Adhesive Layer, Journal of The Electrochemical Society, vol.158, issue.5, pp.545-550, 2011.
DOI : 10.1149/1.3568823

S. Brault, O. Garel, G. Schelcher, N. Isac, F. Parrain et al., MEMS packaging process by film transfer using an anti-adhesive layer, Microsystem Technologies, vol.16, issue.(12), pp.1277-1284, 2010.
DOI : 10.1007/s00542-010-1021-0

M. Aubry, G. Woytasik, R. Schelcher, and . Dussart, Study of dc micro-discharge arrays made in silicon using CMOS compatible technology, Journal of Physics D, vol.45, issue.28, p.285202, 2012.
URL : https://hal.archives-ouvertes.fr/hal-00713105

G. Schelcher, S. Brault, F. Parrain, E. Lefeuvre, E. Dufour-gergam et al., MEMS process by film transfer using fluorocarbon anti-adhesive layer, ECS Transactions, vol.33, issue.4, pp.287-296, 2010.
DOI : 10.1149/1.3483518

G. Schelcher, E. Lefeuvre, S. Brault, E. Dufour-gergam, and F. Parrain, Micro Pirani vacuum gauges manufactured by a film transfer process, Proc. Engineering -Elsevier, pp.1136-1139, 2010.
DOI : 10.1016/j.proeng.2010.09.311

G. Schelcher and S. Brault, Tranfert de films minces fondé sur l'ingénierie de l'adhérence pour l'intégration 3D hétérogène, Proc. JNRDM, 2010.

G. Schelcher, S. Brault, F. Parrain, M. Tatoulian, E. Dufour-gergam et al., Transfert de films minces fondé sur l'ingénierie de l'adhérence pour l'intégration hétérogène

A. Poster, Technological Meeting of French National Nanofabrication Network Pattern transfer processes & applications, 2012.