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Le transfert de films : vers une intégration hétérogène des micro et nanosystèmes

Abstract : Nowadays, micro and nano systems fabrication technologies should allow the integration of any passive or active materials (magnetic, piezoelectric, polymers, etc.) in various forms (films, micro/nanostructures, etc.) to build and/or package highly integrated multi-functional systems. A generic technology able to solve incompatibility issues related to the mixing of different technologies is pattern or device transfer by wafer bonding from a donor wafer to the target substrate. Ideally, such a process should be versatile, low cost, selective and over all should involve minimum interaction and processing steps on the target wafer. From this perspective, a low cost and low temperature MEMS transfer process has been developed. The process is based on adhesion control of molded electroplated Ni microstructures on the donor wafer by using plasma deposited fluorocarbon films and sputtered carbon films (for high temperature materials). Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing off from the donor wafer. This proposed process has allowed us to realize various Ni patterns on Si, Pyrex glass wafers and Kapton foils. Furthermore, BCB sealing leads to freestanding microstructures which are thermally and electrically isolated from the target substrate. Thanks to multiple transfers, Ni stacked microstructures have been achieved. The transfer of various materials has been demonstrated for simple and complex structures. This transfer process is very promising for numerous applications and brings new perspectives towards 3D microfabrication and heterogeneous integration of MEMS/NEMS.
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Submitted on : Thursday, November 22, 2012 - 11:47:19 AM
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Guillaume Schelcher. Le transfert de films : vers une intégration hétérogène des micro et nanosystèmes. Autre [cond-mat.other]. Université Paris Sud - Paris XI, 2012. Français. ⟨NNT : 2012PA112244⟩. ⟨tel-00755977⟩

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