V. Hauk, Structural and Residual Stress Analysis by Nondestructive Methods, 1997.

R. Hoffman, Stresses in thin films: The relevance of grain boundaries and impurities, Thin Solid Films, vol.34, issue.2, pp.185-190, 1976.
DOI : 10.1016/0040-6090(76)90453-3

G. G. Stoney, The Tension of Metallic Films Deposited by Electrolysis The Tension of Metallic Films deposited by Electrolysis, pp.172-175, 1909.

C. L. Bauer and R. J. Farris, Determination of poisson's ratio for polyimide films, Polymer Engineering and Science, vol.21, issue.16, pp.1107-1110, 1989.
DOI : 10.1002/pen.760291606

J. J. Vlassak and W. D. Nix, A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin films, Journal of Materials Research, vol.9, issue.12, pp.3242-3249, 1992.
DOI : 10.1063/1.1708831

K. Sato, M. Shikida, M. Yamasaki, and T. Yoshioka, Micro tensile-test system fabricated on a single crystal silicon chip, Proceedings of Ninth International Workshop on Micro Electromechanical Systems, pp.360-364, 1996.
DOI : 10.1109/MEMSYS.1996.494008

C. Malhaire, M. Ignat, K. Dogheche, S. Brida, C. Josserond et al., Realization of Thin Film Specimens for Micro Tensile Tests Solid-State Sensors, Actuators and Microsystems Conference, International, IEEE, pp.623-626, 2007.

C. Séguineau, Caractérisation mécanique de matériaux mince destinés aux micro et nano technologie, 2009.

J. Koskinen, J. Steinwall, R. Soave, and H. Johnson, Microtensile testing of free-standing polysilicon fibers of various grain sizes, Journal of Micromechanics and Microengineering, vol.3, issue.1, p.13, 1993.
DOI : 10.1088/0960-1317/3/1/004

G. M. Warren and C. Oliver, An Improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J. Mater. Res, vol.7, issue.6, 1992.

H. Hertz, Über die Berührung fester elastischer Körper, Journal für die reine und angewandte Mathematik, pp.156-171, 1881.

F. Lockett, Indentation of a rigid/plastic material by a conical indenter, Journal of the Mechanics and Physics of Solids, vol.11, issue.5, 1963.
DOI : 10.1016/0022-5096(63)90035-8

D. Tabor, A Simple Theory of Static and Dynamic Hardness, Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol.192, issue.1029, pp.247-274, 1947.
DOI : 10.1098/rspa.1948.0008

M. Sakai and O. Tabata, Reliability of MEMS Testing of Materials and Devices, p.324, 2007.

D. Read and J. Dally, A new method for measuring the strength and ductility of thin films, Journal of Materials Research, vol.20, issue.07, pp.1542-1549, 1993.
DOI : 10.1063/1.1657233

J. Florando and W. Nix, A microbeam bending method for studying stress???strain relations for metal thin films on silicon substrates, Journal of the Mechanics and Physics of Solids, vol.53, issue.3, pp.619-638, 2005.
DOI : 10.1016/j.jmps.2004.08.007

K. E. Petersen, Dynamic micromechanics on silicon: Techniques and devices, IEEE Transactions on Electron Devices, vol.25, issue.10, pp.1241-1250, 1978.
DOI : 10.1109/T-ED.1978.19259

J. B. Sauveplane, Caractérisation thermomécanique de films métalliques déposés en couche mince pour la simulation de la fiabilité de composants microélectroniques de puissance, 2007.

W. Sauter, Thin Film Mechanics Bulging and Stretching, 1999.

H. Henky, Über den Spannungszustand in kreisrunden platten mit verschwindender Biegungssteifigkeit, Zeitschrift fur Mathematik und Physik, pp.311-317, 1915.

J. Beams, Mechanical properties of thin films of gold and silver Structure and properties of thin films: proceedings, p.183, 1959.

S. Timoshenko, S. Woinowsky-krieger, and S. Woinowsky, Theory of plates and shells, 1959.

O. Tabata, K. Kawahata, S. Sugiyama, and I. Igarashi, Mechanical property measurements of thin films using load-deflection of composite rectangular membranes, Sensors and Actuators, vol.20, issue.1-2, pp.135-141, 1989.
DOI : 10.1016/0250-6874(89)87111-2

J. Y. Pan, P. Lin, F. Maseeh, and S. D. Senturia, Verification of FEM analysis of loaddeflection methods for measuring mechanical properties of thin films Solid-State Sensor and Actuator Workshop, pp.70-73, 1990.

D. Maier-schneider, J. Maibach, and E. Obermeier, A new analytical solution for the load-deflection of square membranes, Journal of Microelectromechanical Systems, vol.4, issue.4, pp.238-241, 1995.
DOI : 10.1109/84.475551

E. Bonnotte, P. Delobelle, L. Bornier, B. Trolard, and G. Tribillon, Two interferometric methods for the mechanical characterization of thin films by bulging tests. Application to single crystal of silicon, Journal of Materials Research, vol.5, issue.09, pp.2234-2248, 1997.
DOI : 10.1063/1.323119

R. Divan, H. Camon, N. Moldovan, and M. Dilhan, Limiting roughness in anisotropic etching, 1997 International Semiconductor Conference 20th Edition. CAS '97 Proceedings, pp.553-556, 1997.
DOI : 10.1109/SMICND.1997.651316

M. Saadaoui, Optimisation des circuits passifs micro-ondes suspendus sur membrane diélectrique, 2005.

J. S. Mitchell, C. Zorman, T. Kicher, S. Roy, and M. Mehregany, Examination of Bulge Test for Determining Residual Stress, Young???s Modulus, and Poisson???s Ratio of 3C-SiC Thin Films, Journal of Aerospace Engineering, vol.16, issue.2, p.46, 2003.
DOI : 10.1061/(ASCE)0893-1321(2003)16:2(46)

S. Jayaraman, R. L. Edwards, K. J. Hemker, . Relating, . Testing et al., Relating mechanical testing and microstructural features of polysilicon thin films, Journal of Materials Research, vol.2880, issue.03, pp.688-697, 1999.
DOI : 10.1557/JMR.1988.0931

R. Zhang, Pressure Bulge Test for Thin Film Characterization, 2006.

R. J. Hohlfelder, Bulge and Blister testing of thin films and their interfaces, 1999.

S. D. Senturia and P. Lin, The in-situ measurement of mechanical properties of multilayer coatings, Massachusetts Institute of Technology, 1990.

M. K. Small and W. D. Nix, Analysis of the accuracy of the bulge test in determining the mechanical properties of thin films, Journal of Materials Research, vol.41, issue.06, pp.1553-1563, 1992.
DOI : 10.1016/0040-6090(81)90407-7

P. Martins and D. Lyon, Caractérisation mécanique des matériaux pour les micro / nanosystèmes Procédés applicables aux épaisseurs submicroniques, National, L Institut Sciences, 2009.

R. Yahiaoui, <title>Automated interferometric system for bulge and blister test measurements of micromachined membranes</title>, Microsystems Engineering: Metrology and Inspection, pp.160-169, 2001.
DOI : 10.1117/12.445600

S. Petitgrand, R. Yahiaoui, K. Danaie, A. Bosseboeuf, and J. Gilles, 3D measurement of micromechanical devices vibration mode shapes with a stroboscopic interferometric microscope, Optics and Lasers in Engineering, vol.36, issue.2, pp.77-101, 2001.
DOI : 10.1016/S0143-8166(01)00040-9

X. Chauffleur, G. Blasquez, and P. Pons, Influence of the bonding conditions on the response of capacitive pressure sensors, Sensors and Actuators A: Physical, vol.46, issue.1-3, pp.121-124, 1995.
DOI : 10.1016/0924-4247(94)00873-G

C. Malhaire, Effect of clamping conditions and built-in stresses on the thermopneumatic deflection of SiO2/Si membranes with various geometries, Sensors and Actuators A: Physical, vol.74, issue.1-3, pp.174-177, 1999.
DOI : 10.1016/S0924-4247(98)00312-4

Y. Xiang, X. Chen, and J. Vlassak, Plane-strain Bulge Test for Thin Films, Journal of Materials Research, vol.63, issue.09, pp.2360-2370, 2005.
DOI : 10.1016/j.jmps.2003.07.001

X. B. Et and J. M. , Incertitude expérimentale, 2008.

W. Brantley, Calculated elastic constants for stress problems associated with semiconductor devices, Journal of Applied Physics, vol.44, issue.1, 1973.
DOI : 10.1063/1.1661935

D. Gay, Matériaux composites (5 Éd, 2005.

R. Cauchois, M. Saadaoui, J. Legeleux, T. Malia, B. Dubois-bonvalot et al., Wire-bonding on inkjet-printed silver pads reinforced by electroless plating for chip on flexible board packages, 3rd Electronics System Integration Technology Conference ESTC, pp.1-6, 2010.
DOI : 10.1109/ESTC.2010.5642997
URL : https://hal.archives-ouvertes.fr/emse-00530148

H. Youssef, P. Ferrand, R. Pons, and . Plana, A new iterative algorithm for the solution for the load deflection square membranes, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), pp.1-5, 2010.
DOI : 10.1109/ESIME.2010.5464523

H. Youssef, P. Ferrand, P. Calmon, R. Pons, and . Plana, Methods to improve reliability of bulge test technique to extract mechanical properties of thin films, Microelectronics Reliability, vol.50, issue.9-11, pp.1888-1893, 2010.
DOI : 10.1016/j.microrel.2010.07.013

J. Goupy, modélisation par les plans d?expériences

J. Goupy, Plans d?Expériences pour Surfaces de Réponse, Génie Industriel, 1999.

S. Wolf, Silicon Processing for the VLSI Era: Process Technology, 1990.

H. Seidel, Anisotropic Etching of Crystalline Silicon in Alkaline Solutions, Journal of The Electrochemical Society, vol.137, issue.11, p.3612, 1990.
DOI : 10.1149/1.2086277

K. Bean, Anisotropic etching of silicon Electron Devices, IEEE Transactions on, pp.1185-1193, 1978.