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Mises en œuvre de procédés de nettoyages en milieu aqueux de surfaces rugueuses d'alumine et étude de l'adhésion de particules sur ces surfaces

Abstract : Ultracleanliness of tool kit parts become necessary for wafer yield optimization in semiconductor industry. This study suggests parts cleaning improvement with focus on adhesion forces between two alumina substrates and their residual particles in aqueous medium. After physical chemical characterization and roughness measurement on our systems, forces are calculated by DLVO theory. A statistical study has been developed adhesion measured by atomic force microscopy force measurements with alumina colloid probe. This approach is compared to DLVO theory applied to rough surfaces. Then, we investigate some cleanings to overcome this adhesion. First with ultrasonic waves, it was developed a measurement method versus frequency, application time and power and fixed parameters were defined for each substrate. The cleaning improvements, always with the help of ultra-sonic, had driven to use temperature increase, pH solutions shift, and surfactants addition.
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https://tel.archives-ouvertes.fr/tel-00715201
Contributor : Séverine Blanc <>
Submitted on : Friday, July 6, 2012 - 2:43:52 PM
Last modification on : Thursday, October 15, 2020 - 9:00:03 AM
Long-term archiving on: : Sunday, October 7, 2012 - 2:30:40 AM

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  • HAL Id : tel-00715201, version 1

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Séverine Blanc. Mises en œuvre de procédés de nettoyages en milieu aqueux de surfaces rugueuses d'alumine et étude de l'adhésion de particules sur ces surfaces. Science des matériaux [cond-mat.mtrl-sci]. Université Claude Bernard - Lyon I, 2005. Français. ⟨tel-00715201⟩

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