. Les-Écarts-relatifs, en %) par rapport à la courbe réelle sont tracés en figure 3.20. L'approche par l'équation de Steinhart-Hart est finalement admise car elle offre une précision relative sur la valeur de la résistance inférieure au pourcent sur la totalité de la gamme

M. E. Frerking, Fifty years of progress in quartz crystal frequency standards, Proceedings of 1996 IEEE International Frequency Control Symposium, pp.33-46, 1996.
DOI : 10.1109/FREQ.1996.559817

J. R. Norton and J. M. Cloeren, Brief History of the Developement of Ultra-Precise Oscillators for Ground and Space Applications, Proceedings of the 1996 IEEE International Frequency Control Symposium, pp.47-57, 1996.

P. R. Morris, A History of the World Semiconductor Industry, pp.978-0863412271, 1990.
DOI : 10.1049/PBHT012E

H. Hertz, Electric waves : being researches on the propagation of electric action with finite velocity through space, p.278, 1893.

N. Tesla, Electrical Oscillators, Electrical Experimenter, vol.229, issue.260, pp.228-276, 1919.

R. Hartley, United States Patent 1, p.763, 1920.

E. H. Colpitts, Oscillation Generator " . United States Patent 1, p.537, 1918.

W. G. Cady, The piezoelectric resonator, Physical Review, vol.17, pp.531-533, 1921.

G. W. Pierce, Piezoelectric Crystal Resonators and Crystal Oscillators Applied to the Precision Calibration of Wavemeters, Proceedings of the American Academy of Arts and Sciences, pp.81-106, 1923.
DOI : 10.2307/20026061

W. A. Marrison, The Evolution of the Quartz Crystal Clock*, Bell System Technical Journal, vol.27, issue.3, pp.510-588, 1948.
DOI : 10.1002/j.1538-7305.1948.tb01343.x

R. S. Ohl, Light-sensitive energy device, United States Patent 2, p.662, 1941.

J. Bardeen and W. Brattain, The Transistor, A Semi-Conductor Triode, Physical Review, vol.74, issue.2, pp.230-231, 1948.
DOI : 10.1103/PhysRev.74.230

J. Bardeen, Semiconductor research leading to the point contact transistor " . Nobel Lectures, Physics, pp.318-341, 1942.

W. H. Brattain, Surface properties of semiconductors " . Nobel Lectures, Physics 1942-1962, pp.377-384, 1956.

W. Shockley, Junction Transistors, Bell System Technical Journal, vol.28, issue.3, p.435, 1949.
DOI : 10.1002/j.1538-7305.1949.tb03645.x

W. Shockley, Transistor technology evokes new physics " . Nobel Lectures, Physics, pp.344-374, 1942.

J. K. Clapp, An Inductance-Capacitance Oscillator of Unusual Frequency Stability, Proceedings of the Institute of Radio Engineers, pp.356-358, 1948.
DOI : 10.1109/JRPROC.1948.233920

W. Shockley, M. Sparks, and G. K. Teal, Junction Transistors, Physical Review, vol.83, issue.1, pp.151-162, 1951.
DOI : 10.1103/PhysRev.83.151

P. G. Sulzer, Transistor Frequency Standard, Electronics, vol.59, issue.4, pp.206-214, 1953.

M. Tanenbaum, L. B. Valdes, E. Buehler, and N. B. Hannay, Grown Junction Transistors, Journal of Applied Physics, vol.26, issue.6, pp.686-692, 1955.
DOI : 10.1063/1.1722071

J. Andrus and W. L. Bond, Photoengraving in transistor fabrication, J. BIONDI, éditeur , Transistor Technology Vol, vol.3, pp.151-162, 1958.

J. S. Kilby, Invention of the integrated circuit, IEEE Transactions on Electron Devices, vol.23, issue.7, 1976.
DOI : 10.1109/T-ED.1976.18467

J. S. Kilby, TURNING POTENTIAL INTO REALITIES: THE INVENTION OF THE INTEGRATED CIRCUIT, International Journal of Modern Physics B, vol.16, issue.05, pp.474-485, 2000.
DOI : 10.1142/S0217979202010257

D. Kahng, Electric field controlled semiconductor device " . United States Patent 3, p.230, 1960.

E. P. Eernisse, Quartz Resonator Frequency Shifts Arising from Electrode Stress, 29th Annual Symposium on Frequency Control, pp.1-4, 1975.
DOI : 10.1109/FREQ.1975.200056

R. J. Besson, A New Electrodeless Resonator Design, Proceedings of the 31st Annual Symposium on Frequency Control, pp.147-152, 1977.

S. S. Iyer, G. L. Patton, S. L. Delage, S. Tiwari, and J. M. Stork, Silicon-germanium base heterojunction bipolar transistors by molecular beam epitaxy, 1987 International Electron Devices Meeting, pp.874-876, 1987.
DOI : 10.1109/IEDM.1987.191578

E. P. Eernisse, R. W. Ward, and R. B. Wiggins, Survey of quartz bulk resonator sensor technologies, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.35, issue.3, pp.323-330, 1988.
DOI : 10.1109/58.20453

D. L. Hammond and A. Benjaminson, The crystal resonator- a digital transducer, IEEE Spectrum, vol.6, issue.4, pp.53-58, 1969.
DOI : 10.1109/MSPEC.1969.5214053

L. Spassov, E. Yossiffov, V. Gregoriev, L. B. Vergov, L. Dulmet et al., A rotated Y-cut quartz resonator with a linear temperature-frequency characteristic " . Sensor and Actuator Design of a new miniature resonant temperature sensor in NLC-cut of quartz, Proceedings of the 19th European Frequency and Time Forum, pp.185-189, 1997.

A. Ballato, E. P. Eernisse, and T. Lukaszek, The force-frequency effect in doubly rotated quartz resonator, Proceedings of the 31st Annual Symposium Frequency Control, pp.426-430, 1980.

B. Dulmet, P. Tinguy, L. Spassov, and J. Lazarov, Last improvements in the analysis of resonant strip sensors, 2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, pp.363-368, 2007.
DOI : 10.1109/FREQ.2007.4319098

B. Parzen, Design of Crystal and Other Harmonic Oscillator, p.474, 1982.

M. Bernstein, Increased resistance of crystal units at oscillator noise levels, Proceedings of the 21th Annual Symposium on Frequency Control, pp.244-258, 1967.
DOI : 10.1109/PROC.1967.5819

S. Nonaka, T. Tuuki, and K. Hara, The Current Dependency of Crystal Unit Resistance, Proceedings of the 25th Annual Symposium on Frequency Control, pp.139-147, 1971.

J. R. Vig, Military applications of high accuracy frequency standards and clocks, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.40, issue.5, pp.522-527, 1993.
DOI : 10.1109/58.238104

N. M. Nguyen and R. G. Meyer, Start-up and frequency stability in high-frequency oscillators, IEEE Journal of Solid-State Circuits, vol.27, issue.5, pp.810-820, 1992.
DOI : 10.1109/4.133172

Y. Richard and J. M. Tarot, Analog Asic Design for Miniature Temperature Compensated Crystal Oscillators, Proceedings of the 9th European Frequency and Time Forum, pp.362-363, 1995.

S. Kovita, A. Myasnikov, A. Isakov, A. Borisenko, and O. Sokolov, High-precision IC quartz oscillator, 10th International Conference on European Frequency and Time, pp.176-179, 1996.
DOI : 10.1049/cp:19960041

E. A. Vittoz, M. G. Degrauwe, and S. Bitz, High-performance crystal oscillator circuits: theory and application, IEEE Journal of Solid-State Circuits, vol.23, issue.3, pp.774-783, 1988.
DOI : 10.1109/4.318

R. G. Meyer and D. C. Soo, MOS crystal oscillator design, IEEE Journal of Solid-State Circuits, vol.15, issue.2, pp.15-222, 1980.
DOI : 10.1109/JSSC.1980.1051366

M. Unkrich and R. G. Meyer, Conditions for start-up in crystal oscillators, IEEE Journal of Solid-State Circuits, vol.17, issue.1, pp.87-90, 1982.
DOI : 10.1109/JSSC.1982.1051693

]. J. Bibliographie47, R. G. Santos, and . Meyer, A One Pin Crystal Oscillator for VLSI Circuits, IEEE Journal of Solid-State Circuits, vol.19, issue.2, pp.228-236, 1984.

H. Kim, T. Jackson, J. Lim, K. Choi, and D. Kenny, Direct mounting of quartz crystal on a CMOS PLL chip, IEEE International Frequency Control Symposium and Exposition, pp.165-168, 2004.

W. W. Gärtner, Transistors Principles, Design, and Applications. The Van Nostrand Series in Electronics and Communications, p.692, 1960.

N. Semiconductor, Electrical Performance of Packages Application Note 1205, National Semiconductor, 2001.

T. Sakurai and K. Tamaru, Simple formulas for two- and three-dimensional capacitances, IEEE Transactions on Electron Devices, vol.30, issue.2, pp.183-185, 1983.
DOI : 10.1109/T-ED.1983.21093

O. L. Anderson, H. Christensen, and P. Andreatch, Technique for Connecting Electrical Leads to Semiconductors, Journal of Applied Physics, vol.28, issue.8, p.923, 1957.
DOI : 10.1063/1.1722893

B. Chylak, S. Kumar, and G. Perlberg, Optimizing the Wire Bonding Process for 35-µm Ultra-Fine-Pitch Packages, SEMICON Singapore, 2001.

Z. Lai and J. Liu, The Nordic Electronics Packaging Guideline URL : http ://extra.ivf.se/ngl/A-WireBonding, 2000.

F. W. Grover, Inductance Calculations : Working Formulas and Tables, pp.0-486, 2004.

F. Alimenti, P. Mezzanotte, L. Roseli, and R. Sorrentino, Modeling and characterization of the bonding-wire interconnection, IEEE Transactions on Microwave Theory and Techniques, vol.49, issue.1, pp.142-150, 2001.
DOI : 10.1109/22.899975

H. H. Ghouz and E. El-sharawy, An accurate equivalent circuit model of flip chip and via interconnects, IEEE Transactions on Microwave Theory and Techniques, vol.44, issue.12, pp.2543-2554, 1996.
DOI : 10.1109/22.554598

J. D. Cressler and G. Niu, Silicon-Germanium Heterojunction Bipolar Transistor, 2003.
DOI : 10.1007/978-1-4757-3318-1_4

A. Austriamicrosystems, Analog Standard Cell Mixed-Signal Hit-Kit " . Datasheets (NC)

K. S. Kundert, The Designer's Guide to Spice and Spectre ISBN :0-7923-9571-9, 404p. [63] Cadence Design System Inc. Virtuoso Spectre Circuit Simulator RF Analysis Theory, 1995.

R. Brendel, D. Gillet, N. Ratier, F. Lardet-vieudrin, and J. Delporte, Nonlinear Dipolar Modelling of Quartz Crystal Oscillators, Proc. of, p.14, 2000.

M. Addouche, N. Ratier, D. Gillet, R. Brendel, F. Lardet-vieudrin et al., Modeling of quartz crystal oscillators by using nonlinear dipolar method, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.50, issue.5, pp.487-495, 2003.
DOI : 10.1109/TUFFC.2003.1201461

URL : https://hal.archives-ouvertes.fr/hal-00077166

M. Addouche, N. Ratier, D. Gillet, R. Brendel, F. Lardet-vieudrin et al., ADOQ: a quartz crystal oscillator simulation software, Proceedings of the 2001 IEEE International Frequncy Control Symposium and PDA Exhibition (Cat. No.01CH37218), pp.753-757, 2001.
DOI : 10.1109/FREQ.2001.956375

M. Addouche, Modélisation Non Lineaire des Oscillateurs à Quartz, Développement d'un Logiciel de Simulation, Thèse de doctorat, UFR des Sciences et Techniques de l'Université de Franche-Comté, 2002.

F. Chirouf, Développement d'un logiciel industriel d'aide à la conception des oscillateurs à quartz, Thèse de doctorat, UFR des Sciences et Techniques de l'Université de Franche-Comté, 2005.

R. D. Middlebrook, Measurement of loop gain in feedback systems???, International Journal of Electronics, vol.14, issue.4, pp.485-512, 1975.
DOI : 10.1080/00207217508920421

R. D. Middlebrook, Applications notes - The general feedback theorem: a final solution for feedback systems, IEEE Microwave Magazine, vol.7, issue.2, pp.50-63, 2006.
DOI : 10.1109/MMW.2006.1634022

M. Tian, V. Visvanathan, J. Hantgan, and K. Kundert, Striving for small-signal stability, IEEE Circuits and Devices Magazine, pp.31-41, 2001.
DOI : 10.1109/101.900125

D. B. Leeson, A simple model of feedback oscillator noise spectrum, Proc. IEEE, pp.329-330, 1966.
DOI : 10.1109/PROC.1966.4682

G. Sauvage, Phase Noise in Oscillators: A Mathematical Analysis of Leeson's Model, IEEE Transactions on Instrumentation and Measurement, vol.26, issue.4, pp.408-410, 1977.
DOI : 10.1109/TIM.1977.4314586

A. Hajimiri and T. H. Lee, A general theory of phase noise in electrical oscillators, IEEE Journal of Solid-State Circuits, vol.33, issue.2, pp.179-194, 1998.
DOI : 10.1109/4.658619

T. H. Lee and A. Hajimiri, Oscillator phase noise: a tutorial, IEEE Journal of Solid-State Circuits, vol.35, issue.3, pp.326-336, 2000.
DOI : 10.1109/4.826814

A. Mehrotra and A. Sangiovanni-vincentelli, Noise Analysis of Radio Frequency Circuits, pp.978-979, 2004.
DOI : 10.1007/978-1-4757-6007-1

U. L. Rohde, A. K. Poddar, and G. Böck, The Design of Modern Microwave Oscillators for Wireless Applications Theory and Optimization, 2005.

E. Rubiola, Phase Noise and Frequency Stability in Oscillators, 2009.
DOI : 10.1017/CBO9780511812798

URL : https://hal.archives-ouvertes.fr/hal-00344308

E. Rubiola and R. Brendel, A generalization of the Leeson effect, 2010.

A. Hastings, The Art of ANALOG LAYOUT, 2006.

B. Razavi, Design of Analog CMOS Integrated Circuits, 2000.

R. J. Widlar, New Developments in IC Voltage Regulators, IEEE Journal of Solid-State Circuits, issue.6, pp.2-7, 1971.

A. P. Brokaw, A simple tree-terminal IC bandgap reference, IEEE Journal of Solid-State Circuits, issue.9, pp.388-393, 1974.

G. A. Rincon-mora, Voltage References From Diodes to Precision High-Order Bandgap Circuits, 2002.

A. Austriamicrosystems, 0.35 µm S35 HBT BICMOS Process Parameters, 2009.

J. Berkner, Bandgap Reference Simulation Principles and Problems, 2007.

F. Fruett, G. C. Meijer, and A. Bakker, Minimization of the mechanical-stress-induced inaccuracy in bandgap voltage references, IEEE Journal of Solid-State Circuits, vol.38, issue.7, pp.1288-1291, 2003.
DOI : 10.1109/JSSC.2003.813286

]. C. Simpson, National Semiconductor Linear and Switching Voltage Regulator Fundamentals " . White paper, National Semiconductor, 2006.

P. E. Gray, D. Dewit, A. R. Boothroyd, and J. F. Gibbons, de Semiconductor Electronics Education Committee, Physical Electronics and Circuit Models of Transistors, vol.2, 1964.

I. Gutierrez, J. Melendez, and E. Hernandez, Design and Characterization of Integrated Varactors for RF Applications, 2006.
DOI : 10.1002/9780470035924

M. E. Frerking, Crystal Oscillator Design and Temperature Compensation ISBN :0-442-22459-1, 240p. [95] R, J. MATTHYS, p.247, 1978.

R. W. Rhea, Oscillator Design and Computer Simulation, 1997.
DOI : 10.1049/SBEW023E

H. Nyquist, Regeneration Theory, Bell System Technical Journal, vol.11, issue.1, pp.126-147, 1932.
DOI : 10.1002/j.1538-7305.1932.tb02344.x

G. C. Meijer, G. Wang, and F. Fruett, Temperature sensors and voltage references implemented in CMOS technology, IEEE Sensors Journal, vol.1, issue.3, pp.225-234, 2001.
DOI : 10.1109/JSEN.2001.954835

R. Wagner, IC design for laser trimming, Proc. 26th Midwest Symposium Circuit System, pp.223-226, 1983.

G. Erdi, A precision trim technique for monolithic analog circuits, IEEE Journal of Solid-State Circuits SC, issue.1012, pp.412-416, 1975.

A. Technologies, Agilent Accessories Selection Guide For Impedance Measurements, p.43, 2008.

W. P. Mason, Zero Temperature Coefficient Quartz Crystals for Very High Temperatures, Bell System Technical Journal, vol.30, issue.2, pp.366-380, 1951.
DOI : 10.1002/j.1538-7305.1951.tb03662.x

A. Ballato and J. R. Vig, Static and Dynamic Frequency-Temperature Behaviour of Singly and Doubly Rotated Oven-Controlled Quartz Resonators, Proceedings of the 32nd Annual Symposium Frequency Control, pp.180-188, 1978.

G. Theobald, G. Marianneau, R. Pretot, and J. J. Gagnepain, Dynamic Thermal Behaviour of Quartz Resonators, Proceedings of the 33rd Annual Symposium on Frequency Control, pp.239-246, 1979.

R. Bechmann, Frequency-Temperature-Angle Characteristics of AT-Type Resonators Made of Natural and Synthetic Quartz, Proceedings of the Institute of Radio Engineers, pp.1600-1607, 1956.
DOI : 10.1109/JRPROC.1956.274879

A. R. Chi, Frequency Temperature Behaviour of AT-Cut Quartz Resonators, Proceedings of the 10th Annual Symposium on Frequency Control, pp.46-59, 1956.

J. A. Kusters, The SC Cut Crystal - An Overview, 1981 Ultrasonics Symposium, pp.402-409, 1981.
DOI : 10.1109/ULTSYM.1981.197652

S. Galliou, Thermal behaviour simulation of quartz resonators in an oven environment, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.42, issue.5, pp.832-839, 1995.

B. Hillerich and O. Nagler, Application of finite element method and SPICE simulation for design optimization of oven-controlled crystal oscillators, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.48, issue.6, pp.1662-1668, 2001.
DOI : 10.1109/58.971719

M. R. Hamrour, Etude et Analyse de l'Influence du Rayonnement Infrarouge sur un Résonateur à Quartz : Applications aux Capteurs, Thèse de doctorat, UFR des Sciences et Techniques de l'Université de Franche-Comté, 1996.

I. Abramzon and R. Boroditsky, Miniature Double OCXO With Low Power Consumption, Proceedings of the 15th European Frequency and Time Forum, pp.332-335, 2001.

W. J. Garland, L. J. Hassencahl, D. D. Lenhart, and G. Wolfe, Internally Heated Crystal Devices " . United States Patent 3, p.392, 1969.

B. Long and G. Weaver, Quartz crystal oscillators with direct resonator heating, Proceedings of the 45th Annual Symposium on Frequency Control 1991, pp.384-392, 1991.
DOI : 10.1109/FREQ.1991.145925

I. Abramzon, OCXO design using composite-heating of the crystal resonator, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol.41, issue.2, pp.284-289, 1994.
DOI : 10.1109/58.279145

I. Abramzon, R. Boroditsky, and D. A. Cocuzzi, Miniature OCXO using DHR technology, Proceedings of International Frequency Control Symposium, pp.943-946, 1997.
DOI : 10.1109/FREQ.1997.639213

S. Galliou, M. Mourey, and B. Dulmet, A Single Bridge Resonator, Proceedings of 8th European Frequency and Time Forum with Exhibition, pp.792-801, 1994.

S. Galliou, B. Dulmet, and M. Mourey, A single bridge resonator for low consumption OCXO, Proceedings of the 1995 IEEE International Frequency Control Symposium (49th Annual Symposium), pp.557-564, 1995.
DOI : 10.1109/FREQ.1995.484054

I. Abramzon, S. Baranushkin, A. Gubarev, O. Rotova, and V. Tapkov, High-Stability Miniature OCXOs Based on Advanced IHR Technology, 2007 IEEE International Frequency Control Symposium Joint with the 21st European Frequency and Time Forum, pp.242-245, 2007.
DOI : 10.1109/FREQ.2007.4319073

H. Kim, T. Jackson, J. Lim, K. Choi, and D. Kenny, Miniature Oven Controlled Crystal Oscillator -OCXO -on a CMOS Chip, IEEE International Frequency Control Symposium and Exposition, pp.401-404, 2006.

H. Kim, T. Jackson, J. Lim, K. Choi, and D. Kenny, Frame Enclosed Resonator for Miniature Oven Controlled Crystal Oscillator (OCXO), 2006 IEEE International Frequency Control Symposium and Exposition, pp.491-493, 2006.
DOI : 10.1109/FREQ.2006.275435

R. A. Pease-r, F. Bianchi, S. Vinci-dos, J. M. Karam, B. Courtois et al., A New Fahrenheit Temperature Sensor CMOS-compatible smart temperature sensors, IEEE Journal of Solid-State Circuits, SC- Micropelectronics Journal, vol.19125, issue.29, pp.971-977, 1984.

K. S. Kundert and O. Zinke, The Designer's Guide to Verilog AMS, p.270, 2004.

J. A. Becker, C. B. Green, and G. L. Pearson, Properties and Uses of Thermistors--- Thermally Sensitive Resistors, Transactions of the American Institute of Electrical Engineers, vol.65, issue.11, pp.711-725, 1946.
DOI : 10.1109/T-AIEE.1946.5059235

G. Bosson, F. Gutmann, and L. M. Simmons, A Relationship between Resistance and Temperature of Thermistors, Journal of Applied Physics, vol.21, issue.12, pp.1267-1268, 1950.
DOI : 10.1063/1.1699586

J. S. Steinhart and S. R. Hart, Calibration curves for thermistors " . Deep Sea Research and Oceanographic Abstracts, pp.497-503, 1968.

H. K. Gummel and H. C. Poon, An Integral Charge Control Model of Bipolar Transistors, Bell System Technical Journal, vol.49, issue.5, pp.827-852, 1970.
DOI : 10.1002/j.1538-7305.1970.tb01803.x

G. Rey and P. Leturcq, Théorie approfondie du transistor bipolaire, p.248, 1972.

I. E. Getreu, Modeling the Bipolar Transistor (Computer-Aided design of electronic circuits

P. Antognetti and G. Massobrio, Semiconductor Device Modeling with SPICE, 1987.

P. R. Gray, P. J. Hurst, S. H. Lewis, and R. G. Meyer, Analysis and Design of Analog Integrated Circuits, p.875, 2001.

M. Reisch, High-Frequency Bipolar Transistors, 2003.
DOI : 10.1007/978-3-642-55900-6

H. C. Poon and H. K. Gummel, Modeling of emitter capacitance, Proc. IEEE, pp.2181-2182, 1969.
DOI : 10.1109/PROC.1969.7529

X. Cao, J. Mcmacken, K. Stiles, P. Layman, J. J. Liou et al., Comparison of the New VBIC and Conventional Gummel-Poon Bipolar Transistor Models, IEEE Transactions on Electron Devices, issue.2, pp.47-427, 2000.

D. T. Zweidinger, S. Lee, and R. M. Fox, Compact modeling of BJT self-heating in SPICE, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.12, issue.9, pp.1368-1375, 1993.
DOI : 10.1109/43.240084

M. D. Godfrey and J. Lazzaro, A Device Model for Analog VLSI Cricuits, 2008.

J. J. Blanchard and B. Fallou, Constantes électriques Matériaux isolants solides, Constantes Physico-Chimiques K712, 1988.

C. J. Glassbrenner and G. A. Slack, Thermal Conductivity of Silicon and Germanium from 3??K to the Melting Point, Physical Review, vol.134, issue.4A, pp.1058-1069, 1964.
DOI : 10.1103/PhysRev.134.A1058

A. S. Grove, Physics and Technology of Semiconductor Devices, pp.978-0471329985, 1967.

S. Kang, P. M. Williams, and Y. Lee, Modeling and Experimental Studies on Thermosonic Flip-Chip Bonding, IEEE Transactions on Components, Packaging, and Manufacturing Technology PartB : Advanced Packaging, pp.728-733, 1995.

T. Mclaren, S. Kang, W. Zhang, D. Hellman, T. Ju et al., Thermosonic Flip Chip Bonding for an 8x8 VCSEL Array, Proc. 45 th Electronic Components and Technology Conference, pp.393-400, 1995.

D. S. Patterson, P. Elenius, and J. A. Leal, Wafer Bumping Technologies -A Comparative Analysis of Solder Deposition Processes and Assembly Considerations, Advances in Electronic Packaging 1997 Proceedings of the Pacific RIM/ASME International Intersociety Electronic and Photonic Packaging Conference, pp.337-351, 1997.

J. Vähäkangas, O. Rusanen, T. Jaakola, and J. Lenkkeri, The Nordic Electronics Packaging Guideline URL : http ://extra.ivf.se, 2000.

G. Harman, Wire Bonding in Microelectronics, p.446, 2010.

J. Qu and C. P. Wong, Effective Elastic Modulus of Underfill Material for Flip Chip Applications, IEEE Transactions on Components and Packaging Technologies, vol.25, issue.1, pp.53-55, 2002.

K. Gilleo and D. Blumel, The Great Underfill Race, SPIE Proceedings Series International Symposium on Microelectronics, pp.701-706, 1998.

C. P. Wong, M. B. Vincent, and S. Shi, Fast-flow underfill encapsulant: flow rate and coefficient of thermal expansion, IEEE Transactions on Components, Packaging, and Manufacturing Technology-PartA, pp.360-364, 1998.
DOI : 10.1109/95.705485

J. M. Hurley, X. Ye, T. L. Berfield, A. Crane, E. Torres-filho et al., Possibilities and limitations of no-flow fluxing underfill, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium
DOI : 10.1109/IEMT.2002.1032729

L. Wang, H. Li, and C. P. Wong, Reworkable no-flow underfills for flip chip applications, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507), pp.115-122, 2001.
DOI : 10.1109/ISAPM.2000.869262

K. Chiang, Z. Liu, and C. Peng, Parametric reliability analysis of no-underfill flip chip package, IEEE Transactions on Components and Packaging Technologies, vol.24, issue.4, pp.635-640, 2001.
DOI : 10.1109/6144.974953

E. Kirkendall, L. Thomasson, and C. Upthegrove, Rates of diffusion of Copper and Zinc in Alpha Brass " . Transaction of the AIME, pp.186-203, 1939.

E. O. Kirkendall, Diffusion of Zinc in Alpha Brass " . Transaction of the AIME, pp.104-110, 1942.

A. D. Smigelskas and E. O. Kirkendall, Zinc Diffusion in Alpha Brass " . Transaction of the AIME, pp.130-142, 1947.

S. L. Khoury, D. J. Burkhard, D. P. Galloway, and T. A. Scharr, A comparison of copper and gold wire bonding on integrated circuit devices, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.13, issue.4, pp.673-681, 1990.
DOI : 10.1109/33.62578

T. C. Wein and A. R. Daud, Cratering on Thermosonic Copper Wire Ball Bonding, Journal of Materials Engineering and Performance, vol.11, issue.3, pp.283-287, 2002.

E. Philofsky, Intermetallic formation in gold-aluminum systems, Solid-State Electronics, vol.13, issue.10, pp.1391-1399, 1970.
DOI : 10.1016/0038-1101(70)90172-3

E. Philofsky, Purple Plague Revisited, 8th Reliability Physics Symposium, pp.177-185, 1970.
DOI : 10.1109/IRPS.1970.362455

E. Philofsky, Design Limits When using Gold-Aluminum Bonds, 9th Reliability Physics Symposium, pp.11-16, 1971.
DOI : 10.1109/IRPS.1971.362502

C. W. Horsting, Purple Plague and Gold Purity, 10th Reliability Physics Symposium, pp.155-158, 1972.
DOI : 10.1109/IRPS.1972.362544

H. Xu, C. Liu, V. V. Silberschmidt, S. S. Pramana, T. J. White et al., Intermetallic phase transformations in Au???Al wire bonds, Intermetallics, vol.19, issue.12, pp.1808-1816, 2011.
DOI : 10.1016/j.intermet.2011.07.003

N. T. Panousis and R. T. Kershner, Thermocompression Bondability of Thick-film Gold-A Comparison to Thin-Film Gold, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol.3, issue.4, pp.617-623, 1980.
DOI : 10.1109/TCHMT.1980.1135661

G. G. Zhang and C. C. Wong, Review of Direct Metal Bonding for Microelectronic Interconnections " . Report in advanced materials for micro-and nano-systems, 2004.

P. Tinguy, Sonde de température à quartz à électronique intégrée, Numéro d'ordre, pp.2007-2010, 2007.

J. L. Jellison, Effect of Surface Contamination on the Thermocompression Bondability of Gold, IEEE Transactions on Parts, Hybrids, and Packaging, vol.11, issue.3, pp.206-211, 1975.
DOI : 10.1109/TPHP.1975.1135065

J. L. Jellison, Kinetics of Thermocompression Bonding to Organic Contaminated Gold Surfaces, IEEE Transactions on Parts, Hybrid, and Packaging, pp.132-137, 1977.
DOI : 10.1109/TPHP.1977.1135191

X. F. Ang, G. G. Zhang, J. Wei, Z. Chen, and C. C. Wong, Temperature and pressure dependence in thermocompression gold stud bonding, Thin Solid Films, vol.504, issue.1-2, pp.379-383, 2006.
DOI : 10.1016/j.tsf.2005.09.071

G. G. Zhang, X. F. Ang, Z. Chen, C. C. Wong, and J. Wei, Critical temperatures in thermocompression gold stud bonding, Journal of Applied Physics, vol.102, issue.6, 2007.
DOI : 10.1063/1.2783974

P. Tinguy, Y. Gruson, V. Petrini, and B. Beck, Test d'assemblage par Flip Chip à Karlsruhe (Allemagne) -Mission de Septembre, pp.FEMTO-ST, 2007.

=. Th and . Temp, THA)+'P_CELSIUS0 ; //Temperature without self-heating effects end else begin Pwr(TJ) <+ -Pbjt

=. Th and . Temp, THA)+Temp(THA)+'P_CELSIUS0 ;//Temperature with self-heating effects end, TJ