]. C. Koch07 and . Koch, Structural nanocrystalline materials: an overview, Journal of Materials Science, vol.86, issue.5, pp.1403-1414, 2007.
DOI : 10.1007/s10853-006-0609-3

]. C. Kollia90, N. Kollia, and . Spyrellis, Nickel plating by pulse electrolysis: textural and microstructural modifications due to adsorption/desorption phenomena, Journal of Applied Electrochemistry, vol.21, issue.6, pp.1025-1032, 1990.
DOI : 10.1007/BF01019584

]. C. Kollia93, N. Kollia, and . Spyrellis, Textural modifications in nickel electrodeposition under pulse reserved current, Surface and Coatings Technology, vol.57, issue.1, pp.71-75, 1993.
DOI : 10.1016/0257-8972(93)90338-O

]. V. Kozlov02, L. P. Kozlov, and . Bicelli, Texture formation of electrodeposited fcc metals, Materials Chemistry and Physics, vol.77, issue.1, pp.289-293, 2002.
DOI : 10.1016/S0254-0584(02)00004-4

]. K. Kumar03, H. Kumar, S. Van-swygenhoven, and . Suresh, Mechanical behavior of nanocrystalline metals and alloys11The Golden Jubilee Issue???Selected topics in Materials Science and Engineering: Past, Present and Future, edited by S. Suresh, Acta Materialia, vol.51, issue.19, pp.5743-5774, 2003.
DOI : 10.1016/j.actamat.2003.08.032

L. S. Lin, P. C. Hsu, L. Chang, and C. H. Chen, Properties and microstructure of nickel electrodeposited from a sulfamate bath containing ammonium ions, Journal of Applied Electrochemistry, pp.31-925, 2001.

M. A. Malygin, Plasticity and strength of micro- and nanocrystalline materials, Physics of the Solid State, vol.49, issue.6, pp.1013-1033, 2007.
DOI : 10.1134/S1063783407060017

]. P. Marcus79 and . Marcus, Etude de l'influence du soufre sur la passivation du nickel

]. P. Marcus02, E. Marcus, and . Protopopoff, Corrosion Mechanisms in Theory and Practrice Surface Effects on Hydrogen Entry into Metals, pp.53-96, 2002.

]. E. Marquis06, A. A. Marquis, J. J. Talin, S. H. Kelly, J. R. Goods et al., Effects of current density on the structure of Ni and Ni???Mn electrodeposits, Journal of Applied Electrochemistry, vol.17, issue.6, pp.669-676, 2006.
DOI : 10.1007/s10800-006-9119-x

]. R. Masumura98, P. M. Masumura, C. S. Hazzledine, and . Pande, Yield stress of fine grained materials, Acta Materialia, vol.46, issue.13, pp.4527-4534, 1998.
DOI : 10.1016/S1359-6454(98)00150-5

]. S. Mcfadden05, A. K. Mcfadden, and . Mulkherjee, Sulfur and superplasticity in electrodeposited ultrafine-grained Ni, Materials Science and Engineering: A, vol.395, issue.1-2, pp.265-268, 2005.
DOI : 10.1016/j.msea.2004.12.025

]. H. Mecking81, U. F. Mecking, and . Kocks, Kinetics of flow and strain-hardening, Acta Metallurgica, vol.29, issue.11, pp.1865-1875, 1981.
DOI : 10.1016/0001-6160(81)90112-7

]. H. Merchant95 and . Merchant, Defect Structure, Morphology and properties of deposits, Defect structure of electrodeposits, The Minerals, Metals and Materials Society, vol.431, pp.1-159, 1995.

M. A. Meyers, A. Mishra, and D. J. Benson, Mechanical properties of nanocrystalline materials, Progress in Materials Science, vol.51, issue.4, pp.427-556, 2006.
DOI : 10.1016/j.pmatsci.2005.08.003

]. R. Mishra04, R. Mishra, and . Balasubramaniam, Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel, Corrosion Science, vol.46, issue.12, pp.3019-3029, 2004.
DOI : 10.1016/j.corsci.2004.04.007

]. H. Miyamoto02, K. Miyamoto, T. Yoshimura, M. Mimaki, and . Yamashita, Behavior of intergranular corrosion of ?????? tilt grain boundaries of pure copper bicrystals, Corrosion Science, vol.44, issue.8, pp.1835-1846, 2002.
DOI : 10.1016/S0010-938X(01)00158-5

]. H. Miyamoto08, K. Miyamoto, T. Harada, A. Mimaki, S. Vinogradov et al., Corrosion of ultra-fine grained copper fabricated by equal-channel angular pressing, Corrosion Science, vol.50, issue.5, pp.50-1215, 2008.
DOI : 10.1016/j.corsci.2008.01.024

]. I. Molchan09 and . Molchan, The concept of plasma cleaning in glow discharge spectrometry, Journal of Analytical Atomic Spectrometry, vol.77, issue.144, pp.734-741, 2009.
DOI : 10.1039/b818343k

]. M. Moncel91 and . Moncel, Méthodes Physiques d'analyse en métallurgie, Ingénieur M, vol.260, pp.1-21, 1991.

N. Natter, M. Schmelzer, and R. Hempelmann, Nanocrystalline nickel and nickel-copper alloys: Synthesis, characterization, and thermal stability, Journal of Materials Research, vol.22, issue.05, pp.1186-1197, 1998.
DOI : 10.1557/JMR.1998.0169

]. H. Natter03, R. Natter, and . Hempelmann, Tailor-made nanomaterials designed by electrochemical methods, Electrochimica Acta, vol.49, issue.1, pp.51-61, 2003.
DOI : 10.1016/j.electacta.2003.04.004

]. H. Natter08, R. Natter, and . Hempelmann, Nanocrystalline Metals Prepared by Electrodeposition, Zeitschrift f??r Physikalische Chemie, vol.222, issue.2-3, pp.319-354, 2008.
DOI : 10.1524/zpch.2008.222.2-3.319

]. B. Nguyen98 and . Nguyen, Electrodéposition par courants pulsés, 1998.

]. R. Nichols95, E. Nichols, H. Bunge, H. Meyer, and . Baumgärtel, Classification of growth behaviour for copper on various substrates with in-situ scanning probe microscopy, Surface Science, vol.335, pp.335-110, 1995.
DOI : 10.1016/0039-6028(95)00578-1

O. Oniciu and L. Muresan, Some fundamental aspects of levelling and brightening in metal electrodeposition, Journal of Applied Electrochemistry, vol.18, issue.7/8, pp.565-574, 1991.
DOI : 10.1007/BF01024843

]. R. Orinakova06, A. Orinakova, D. Turonova, M. Kladekova, R. M. Galova et al., Recent developments in the electrodeposition of nickel and some nickel-based alloys, Journal of Applied Electrochemistry, vol.7, issue.652, pp.957-972, 2006.
DOI : 10.1007/s10800-006-9162-7

]. I. Roy08, H. W. Roy, L. Yang, I. Dinh, J. C. Lund et al., Possible origin of superior corrosion resistance for electrodeposited nanocrystalline Ni, Scripta Materialia, pp.59-305, 2008.

]. S. Ruan08, C. A. Ruan, and . Schuh, Mesoscale structure and segregation in electrodeposited nanocrystalline alloys, Scripta Materialia, vol.59, issue.11, pp.1218-1221, 2008.
DOI : 10.1016/j.scriptamat.2008.08.010

S. Saada and G. Dirras, Dislocations in solids, édité par, pp.199-248, 2009.

]. M. Sahal06 and . Sahal, Influence d'une prédéformation plastique sur la réactivité anodique du Nickel polycristallin dans un milieu acide sulfurique. Thèse, 2006.

]. F. Sansoz08, K. D. Sansoz, R. Stevenson, N. S. Govinthasamy, and . Murthy, Making the surface of nanocrystalline Ni on an Si substrate ultrasmooth by direct electrodeposition, Scripta Materialia, vol.59, issue.1, pp.59-103, 2008.
DOI : 10.1016/j.scriptamat.2008.02.039

]. C. Schuh02, T. G. Schuh, T. Nieh, and . Yamasaki, Hall???Petch breakdown manifested in abrasive wear resistance of nanocrystalline nickel, Scripta Materialia, vol.46, issue.10, pp.735-740, 2002.
DOI : 10.1016/S1359-6462(02)00062-3

]. A. Seyeux05, V. Seyeux, L. H. Maurice, P. Klein, and . Marcus, In situ scanning tunnelling microscopic study of the initial stages of growth and of the structure of the passive film on Ni(111) in 1??mM NaOH(aq), Journal of Solid State Electrochemistry, vol.43, issue.555, pp.337-346, 2005.
DOI : 10.1007/s10008-004-0627-5

]. R. Siegel93 and . Siegel, Nanostructured materials -mind over matter-, Nanostructured Materials, vol.3, issue.1-6, pp.1-18, 1993.
DOI : 10.1016/0965-9773(93)90058-J

T. Therese, Plasmas radiofréquence pour l'analyse des matériaux, pp.28-36, 2005.

]. E. Thiele05, R. Thiele, L. Klemm, C. Hollang, N. Holste et al., An approach to cyclic plasticity and deformation-induced structure changes of electrodeposited nickel, Materials Science and Engineering: A, vol.390, issue.1-2, pp.42-51, 2005.
DOI : 10.1016/j.msea.2004.09.022

]. D. Thiemig07, R. Thiemig, A. Lange, and . Bund, Influence of pulse plating parameters on the electrocodeposition of matrix metal nanocomposites, Electrochimica Acta, vol.52, issue.25, pp.7362-7371, 2007.
DOI : 10.1016/j.electacta.2007.06.009