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165 5.4.1 Formalisme : facettes primaires et secondaires, p.169 ,
170 5.5.1 Effet de l'aluminium à haute température, p.175 ,
à la partie précédente (croissance 3 étapes, figure 5.2), on identifie aisément les deux segments correspondant aux deux conditions de dépôt grâce à leurs différences d ,
HCl faible flux' (figure 5.5[g]) et l'extrémité proche du catalyseur(figure 5 A la base du segment , la taille des facettes est importante (>5 nm) et leur orientation est similaire à celle observée lors de la croissance en 3 étapes (figure 5.2) Près du catalyseur, les facettes sont très petites (<1 nm) et la mesure de leur orientation est difficile. 1. [accepted] 'The importance of the radial growth in the faceting of siliconSurface recombination velocity measurements of effciently passivated goldcatalyzed silicon nanowires by a new optical method, On remarque cependant que la taille des facettes diminue entre la base du segment, 2010. ,
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sur Silicium et non-guidée par un pore La condition (1) impose de travailler avec des catalyseurs localisés très espacés La condition (4) privilégie l'utilisation de colloïdes. Les conditions (2) et (3) sont réunies lors de l'utilisation de HCl (cf. chapitre 4). En l'absence d'une seule de ces conditions, la mesure est faussée ,
194 B.2.2 Solution du problème : potentiel des 'éléments chimiques' ,
203 B.3.1 Approximation des systèmes sphériques, p.203 ,
Les pressions partielles de ces derniers dans la phase gaz peuvent être importantes à l'équilibre thermodynamique. On utilise ici le programme STAJAN[141] pour obtenir la composition de la phase gaz à l'équilibre thermody- namique ,
SiCl 4 } dans la phase gaz et Si solide (Si(s)) dans la phase solide. La figure B.1 (p.202) présente l'évolution selon la température (450°C-1300°C) de la composition à l'équilibre du système présenté ci-dessus, dans les conditions classiques d'un dépôt dans notre réacteur CVD, SiH 3 Cl, SiH 2 Cl 2 On observe qu'à basse température SiCl 4 domine (?rH 0 le plus faible) mais qu'à haute température SiCl 2 est l'espèce majoritaire. Ces résultats sont similaires à ceux obtenus par Bloem et al ,
une désoxydation chimique (HF) ne change pas l'état de surface et conserve les structures obtenues. On est donc en présence d'une surface de silicium désoxydée ,
4 présente le résultat du même recuit sur un échantillon oxydé (Si[100]+2 nm SiO 2 ) La surface est complètement lisse au SEM et on ne distingue pas de différence avant et après recuit Ce résultat est confirmé par Kumigata et al.[146] qui montrent que l'attaque de SiO 2 n'est possible qu'à des températures supérieures à 1000°C, Il n'est donc pas possible d'attaquer SiO 2 avec H 2 dans nos conditions expérimentales (850°C, 10-20 minutes), ce qui infirme le modèle proposé ci-dessus. b. Désorption de SiO ,
147] étudient l'évolution d'un substrat de silicium présentant un oxyde mince de silicium (? 1 nm) chauffé sous ultra-vide (UHV, 'Ultra High Vacuum, Ils observent alors la désorption de l'oxyde SiO 2 sous la forme de SiO ,
6 propose un mécanisme pour la formation des trous sur nos échantillons de silicium désoxydés ,
une pression partielle faible de SiO et que la surface de silicium soit accessible (diffusion du surface) Elle est donc cohérente avec nos expériences, en particulier l'absence d'attaque d'un échantillon totalement oxydé ,
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