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Etude et réalisation de caloducs plats miniatures pour l'intégration en électronique de puissance

Abstract : The increasing thermal losses of power semiconductors components led the LEG to work on the integration of heat sinks in power electronics systems. The use of flat miniature heat pipes in this field provides the thermal extraction of dissipated energies and the reduction of the heat flux density. Firstly, thermal and hydraulic models were made in order to design and construct metal prototypes. Experimental setups were carried out to characterize them. Two types of capillary wick were studied: trapezoidal axial grooves and sintered powder wick. The use of silicon as envelop material was then presented. The whole study shows the contribution of new technologies to design integrated thermal drains and heat spreaders in power substrates.
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Submitted on : Wednesday, April 14, 2010 - 4:51:15 PM
Last modification on : Thursday, November 19, 2020 - 1:00:26 PM
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Yvan Avenas. Etude et réalisation de caloducs plats miniatures pour l'intégration en électronique de puissance. Sciences de l'ingénieur [physics]. Institut National Polytechnique de Grenoble - INPG, 2002. Français. ⟨tel-00473217⟩

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