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Drains thermiques adaptatifs : Cuivre allié / Fibre de Carbone

Abstract : In the field of power electronics, thermal management of silicon chips plays a key role in our ability to increase their performance. Heat generated by the electronic components is dissipated through the heat sink, generally made of Copper that is brazed on to a ceramic substrate. This study focuses on the elaboration of adaptive heat sink material using Copper alloys/Carbon fibers (CF) composite materials which have a good thermal conductivity and a CTE close to the ceramic substrate. In this kind of material, it is necessary to have a strong matrix/reinforcement link in order to optimize transfer properties. Since there is no reaction between Copper and Carbon, a carbide element (Cr or B) is added to the Copper matrix to create this strong chemical bond. A model material has been elaborated by cathode sputtering in order to study the diffusion of the alloying element in the Copper layer and the metallic carbide formation in the interfacial zone. Copper alloy powders, with a given stoichiometry, have also been synthesized by a chemical method. Lastly, composite materials (Cu-B/CF and Cu-Cr/CF) have been elaborated by a powder metallurgy process and their thermal and mechanical properties correlated to the microstructure and the chemistry of the interfacial zones.
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Contributor : Stéphane Toulin <>
Submitted on : Friday, April 9, 2010 - 5:40:42 PM
Last modification on : Monday, October 19, 2020 - 12:04:02 PM
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  • HAL Id : tel-00472214, version 1



Amélie Veillere. Drains thermiques adaptatifs : Cuivre allié / Fibre de Carbone. Matériaux. Université Sciences et Technologies - Bordeaux I, 2009. Français. ⟨tel-00472214⟩



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