Etude et validation de boucles d'asservissement permettant le contrôle avancé des procédés en microélectronique : Application à l'étape d'isolation par tranchées peu profondes en technologie CMOS.

Abstract : This work belongs to the development of Advanced Process Control (APC) applications in the microelectronics industry. The APC component studied here is the implementation of close regulation loops which can adjust the process parameters in real time. This technique is applied on the isolation module of the CMOS circuits. The shallow trench isolation (STI) is the chosen solution for the technologies below 0.25 µm. The impact of the STI morphology on the mechanical stress is confirmed and the influence of the STI on the electrical parameters through different correlation analysis is demonstrated. An electrical indicator for the monitoring of the regulation close loop is defined. This parameter is the punch-through voltage of the parasitic transistors. The step height dispersion affects directly the punch-through voltage of the parasitic transistors. In order to reduce this dispersion, we proposed to achieve three regulation closed loops. The processes to be regulated are: the high density plasma CVD deposition, the chemical mechanical polishing and the wet etching. The process models represent the heart of the regulation close loop and have been established from Design Of Experiments (DOE).
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Submitted on : Friday, March 26, 2010 - 3:27:52 PM
Last modification on : Tuesday, October 23, 2018 - 2:36:10 PM
Long-term archiving on : Monday, June 28, 2010 - 4:47:32 PM

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  • HAL Id : tel-00467446, version 1

Citation

Djaffar Belharet. Etude et validation de boucles d'asservissement permettant le contrôle avancé des procédés en microélectronique : Application à l'étape d'isolation par tranchées peu profondes en technologie CMOS.. Micro et nanotechnologies/Microélectronique. Ecole Nationale Supérieure des Mines de Saint-Etienne, 2009. Français. ⟨tel-00467446⟩

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