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Etude thermodynamique et élaboration de dépôts métalliques (W-N-C, Ti-N-C) par PEALD (Plasma Enhanced Atomic Layer Deposition) pour la réalisation d'électrodes de capacités Métal/Isolant/Métal dans les circuits intégrés.

Abstract : MIM (Metal Insulator Metal) capacitors are widely integrated for RF and analog applications. The 3D architecture allows a capacitance density gain but require high conformality deposition technique to get conformal layers and high performance. PEALD method was used for the electrode and dielectric thin films deposition. Electrodes must exhibit a low resistivity, present a high work function and exhibit a good chemical compatibility with the dielectric material. To address these issues, Ti-N-C and W-N-C films have been investigated and deposited from organometallic precursors TDMAT et BTBMW. Chemical and electrical properties of the elaborated films and their integration as electrode in MIM capacitors are investigated
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https://tel.archives-ouvertes.fr/tel-00441093
Contributor : Yannick Champion <>
Submitted on : Monday, December 14, 2009 - 4:24:30 PM
Last modification on : Thursday, November 19, 2020 - 3:54:15 PM
Long-term archiving on: : Saturday, November 26, 2016 - 4:23:26 PM

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  • HAL Id : tel-00441093, version 1

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R. Benaboud. Etude thermodynamique et élaboration de dépôts métalliques (W-N-C, Ti-N-C) par PEALD (Plasma Enhanced Atomic Layer Deposition) pour la réalisation d'électrodes de capacités Métal/Isolant/Métal dans les circuits intégrés.. Matériaux. Institut National Polytechnique de Grenoble - INPG, 2009. Français. ⟨tel-00441093⟩

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