106 II.4. Influence de l'oxyde d'indium sur la brasure, p.106 ,
114 IV.2 Adaptation des dimensions de la bille d'indium: 114 IV.3. Contribution en capacité calorifique des différents matériaux : 115 IV.4. Partie expérimentale :2. Caractérisation par microscopie à force atomique, 122 IV.5. La réalisation du nouvel UBM (Ti/WN/Au) sur structures libérées :.. 125 IV.8. Conclusion, p.126 ,
137 CHAPITRE 4 : La thermométrie par le silicium implanté 139 II.2. Modèles : 142 II.3. Etude de l'implantation et de la diffusion : 145 II.6.1. La simulation de l'implantation dans nos thermomètres, 146 II.6.4. Résultats des mesures SIMS (Secondary Ion Mass Spectrometry), p.150 ,
165 V.4. Détermination des paramètres T 0 et R 0 : 165 V.5 Mesure de R (T) sur une matrice de 5 x 5 pixels (plaque PO9), p.174 ,
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Il existe d'autres méthodes d'obtention de substrats SOI SOI Technology: Materials to VLSI " 2nd Ed KLUWER 1997 ISBNB 0-7923-8007-X) ,
Epitaxial Layer TRANsfer) consiste à déposer/créer une/deux couche mince de silicium poreux et donc présentant un interface peu résistant par laquelle sera clivée, par la suite ,
on a faite chez SOITEC a concernée 30 plaques simple SOI approvisionnées avec les spécifications dimensionnelles ,
Vue d'ensemble du champ élémentaire de la filière 200 mm Fig, Fig.II.II, vol.13 ,
5 : Observation au MEB des plots Ti/Au après leurs gravure 3000Å ,
Comparaison entre la plaque PO2 et PO9 ,