I. Méthodologie-implémentée-dans, EMC pour comparer mesures et simulation, p.113

.. Sensibilité-de-la-sonde-Électrique, E z ) en fonction de la hauteur, a)h=1 mm, b)h=2 mm, c)h=3 mm, p.133

.. Sensibilité-de-la-sonde-magnétique, H z ) en fonction de la hauteur, a)h=1 mm, b)h=2 mm, c)h=3 mm, p.134

C. C. Du, 17 Circuit imprimé dédié à la mesure d'immunité, p.159

A. Alaeldine, A. Boyer, R. Perdriau, M. Ramdani, and E. Sicard, A near-field injection model for susceptibility prediction in integrated circuits, pp.39-44, 2007.
URL : https://hal.archives-ouvertes.fr/hal-00239426

A. Alaeldine, N. Lacrampe, R. Perdriau, and M. Ramdani, Efficiency of Embedded On-Chip EMI Protections to Continuous Harmonic and Fast Transient Pulses with Respect to Substrate Injection, 2007 IEEE International Symposium on Electromagnetic Compatibility, 2007.
DOI : 10.1109/ISEMC.2007.161
URL : https://hal.archives-ouvertes.fr/hal-00239403

A. Alaeldine, O. Maurice, J. Cordi, R. Perdriau, and M. Ramdani, Emc-oriented alalysis of electric near-field in high frequency, pp.255-260, 2007.

A. Alaeldine, R. Perdriau, M. Ramdani, and M. Drissi, A Direct Power Injection Model for Immunity Prediction in Integrated Circuits, CEM 06, p.15, 2006.
DOI : 10.1109/TEMC.2007.911920
URL : https://hal.archives-ouvertes.fr/hal-00316535

A. Alaeldine, R. Perdriau, M. Ramdani, J. L. Levant, and M. Drissi, A Direct Power Injection Model for Immunity Prediction in Integrated Circuits, IEEE Transactions on Electromagnetic Compatibility, vol.50, issue.1, pp.52-62, 2008.
DOI : 10.1109/TEMC.2007.911920
URL : https://hal.archives-ouvertes.fr/hal-00316535

A. Alaeldine, R. Perdriau, M. Ramdani, and V. Veeragandham, Electrical model for power losses in direct power injection, IET Science, Measurement & Technology, vol.1, issue.5, pp.284-289, 2007.
DOI : 10.1049/iet-smt:20060101
URL : https://hal.archives-ouvertes.fr/hal-00239391

K. Assalaou, L. Bouhouch, E. Sicard, S. Akue-boulingui, A. Boyer et al., Modélisation du rayonnement en champ proche d'une ligne strip-line recouverte ou non de films de permalloy ou de ferrite, CEM 08, 2008.

M. Badaroglu, Modeling and experimental verification of substrate noise generation in a 220-kgates wlan system-on-chip with multiple supplies, Proceeding ESSCIRC, pp.291-294, 2002.
DOI : 10.1109/JSSC.2003.813254

S. Baffreau, Mise en oeuvre de méthodes de mesures cem pour un composant de type micro-contrôleur, 1999.

S. Baffreau, Susceptibilité des micro-contrôleurs aux agressions électromagnétiques, Thèse, INSA de Toulouse, 2003.

H. B. Bakoglu, Circuits, Interconnects and Packaging for VLSI, 1990.

C. A. Balanis, Antenna Theory : Analysis and Design, p.143, 2005.

D. Baudry, Conception, validation et exploitation d'un dispositif de mesure de champs électromagnétiques proches, Thèse en cem, ESIGELEC, 2005.

D. Baudry, F. Bicrel, L. Bouchelouk, A. Louis, B. Mazari et al., Near-field techniques for detecting EMI sources, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), pp.11-13, 2004.
DOI : 10.1109/ISEMC.2004.1349987

S. Bazzoli, B. Demoulin, M. Cauterman, and P. Hoffman, Susceptibility of integrated circuits connected to wiring systems, 2EMC Conference on Electromagnetic Compatibility, 2005.

M. Bäckström, O. Lundén, and P. S. , Reverberation chambers for emc susceptibility and emission analysis. Radio science, pp.429-452, 2002.

A. Boyer, Prédire la susceptibilité des circuits aux agressions électromagnétiques, Electronique, vol.3, issue.189, pp.2-5, 2008.

A. Boyer, E. Sicard, S. Bendhia, and E. Lamoureux, Immunité d'inverseurs cmos en champ proche, CEM06, 2006.

A. Boyer, E. Sicard, and G. Peres, Un logiciel dédié à la prédiction du comportement des circuits intégrés en compatibilité électromagnétique de 1mhz à 5ghz, EMC Compo 05 - Munich Allemagne, pp.11-13, 2005.

T. P. Budka, S. D. Waclawick, and G. M. Rebeiz, A coaxial 0.5-18 GHz near electric field measurement system for planar microwave circuits using integrated probes, IEEE Transactions on Microwave Theory and Techniques, vol.44, issue.12, p.44, 1996.
DOI : 10.1109/22.556445

M. Camp, H. Gerth, H. Garbe, and H. Haase, Predicting the Breakdown Behaviorof Microcontrollers Under EMP/UWB Impact Using a Statistical Analysis, IEEE Transactions on Electromagnetic Compatibility, vol.46, issue.3, pp.368-379, 2004.
DOI : 10.1109/TEMC.2004.831816

K. R. Carver and J. W. Mink, Microstrip antenna technology, IEEE Transactions on Antennas and Propagation, vol.29, issue.1, pp.2-24, 1981.
DOI : 10.1109/TAP.1981.1142523

D. Castagnet, A. Meresse, and G. Duchamp, Characterization of a near field probe for ic cartography, EMC Europe, 2006.
URL : https://hal.archives-ouvertes.fr/hal-00180341

D. R. Coulson, Emc techniques for microprocessor software, IEE Colloquium on EMC for Small Business, p.420, 1998.
DOI : 10.1049/ic:19980619

M. Bafleur and D. Tremouilles, Stratégie de protections intégrées contre les décharges électrostatiques . Compraison des stresses de types HBM et CDM, 2003.

S. Dabral and T. J. Maloney, Basic ESD and I/O Design Edition, 2005.

N. Delorme, M. Belleville, and J. Chilo, Inductance and capacitance analytic formulas for VLSI interconnects, Electronics Letters, vol.32, issue.11, pp.996-997, 1996.
DOI : 10.1049/el:19960689

S. Demarty, Contribution à l'étude électromagnétique théorique et expérimentale des cartes de circuit imprimé, Thèse, 2006.

V. Deniau, M. Heddebaut, J. Rioult, and C. Electromagnetisme, La cellule tem tridimensionnelle : un nouveau moyen d'essais pour les tests de cem en basses fréquences, Journées scientifiques du, 2004.

S. B. Dhia, M. Ramdan, and E. Sicard, Electromagnetic Compatibility of Integrated Circuits, 2006.

K. Dobge, J. Baudet, and B. Démoulin, Etude de pérturbations en injection de courant et de tension sur les liaisons entre un microprocesseur et une mémoire externes, 7ème Colloque International de Compatibilité Electromagnétique, 1994.

A. Sciences, Les progrès de la furtivité. Article, Octobre, 2007.

H. Ewald and H. Krueger, Inductive sensors and their application in metal detection, International Conference on Sensing Technology, 2005.

F. Fiori, Ics susceptibility : a critical assessment on the test procedures, EMC2000 International Symposium on Electromagnetic Compatibility, pp.286-289, 2000.

. Futura-sciences, E-bomb : une arme dévastatrice, Article, 2003.

F. Gardiol, traité d'électricité, Presses polytechniques et universitaire Romandes, 1987.

H. Gieser and M. Haunschild, Very fast transmission line pulsing of integrated structures and the charged device model, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, vol.21, issue.4, pp.278-285, 1998.
DOI : 10.1109/3476.739177

P. Groenveld and A. Jong, A simple rf immunity test set-up, Second IEEE International Symposium on Electromagnetic Compatibility, pp.233-239, 1977.

E. Grund and R. Gauthier, VF-TLP systems using TDT and TDRT for kelvin wafer measurements and package level testing, 2004 Electrical Overstress/Electrostatic Discharge Symposium, 2004.
DOI : 10.1109/EOSESD.2004.5272811

A. Guilhaume, Evaluation de la robutesse de circuits intégrés vis-à-vis des décharges électrostatiques, 2002.

K. Hardin, Decomposition of Radiating Structures to Directly Predict Asymmetric Mode Radiation, 1991.

H. Herrmann, Emc test system for mtu munich od daimler-benz aerospace. News from Rohde & Schwarz, 1998.

Y. Hervé, VHDL-AMS : applications et enjeux industriels, 2002.

C. Icheln, The Construction and Application of a GTEM Cell, 1995.

S. Jahn, C. Schulz-linkholt, and F. Klotz, Investigation of rf immunity tests and methods for integrated circuits, 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pp.107-112, 2005.

J. H. Jang, N. Ishitobi, B. C. Kim, and G. J. Seung, Effects of Microstructural Defects in Multilayer LTCC Stripline, IEEE Transactions on Advanced Packaging, vol.29, issue.2, pp.314-319, 2006.
DOI : 10.1109/TADVP.2005.850501

M. A. Kelly, G. E. Servais, and P. V. Paffenbach, An investigation of human body electrostatic discharge, The 19th International Symposium for Testing and Failure Analysis, 1993.

D. Konigstein and D. Hansen, A new family of tem-cell with enlarged bandwidth and optimized working volume, Proceedings of the 7th International Zurich Symposium on Electromagnetic Compatibility, pp.127-132, 1987.

C. Kopp, Protecting Your Personal Security In the Electronic Age. Thunder's Mouth Press,632 Broadway 7th FL, 1996.

H. Krueger and H. Ewald, Image processing and pattern recognition of metal detector data, ICONIC 2007, pp.285-289, 2007.

N. Lacrampe, A. Alaeldine, R. Perdriau, and M. Ramdani, Investigation on ESD Transient Immunity of Integrated Circuits, 2007 IEEE International Symposium on Electromagnetic Compatibility, 2007.
DOI : 10.1109/ISEMC.2007.162

N. Lacrampe, A. Boyer, and B. Vrignon, Investigation of the indirect effects of vf-tlp esd pulse injected into a printed circuit board, EMC Europe, 2006.

F. Lafon, F. De-daran, and J. Dupois, Near field immunity cartography method to characterize a ic to fields radiated by an esd, EMC Compo05, 2005.

F. Lafon, F. De-daran, and J. Dupois, Near field immunity cartography method to characterize ic to fields radiated by an esd, ICONIC, 2005.

E. Lamoureux, Etude de la Susceptibilité des Circuits Intégrés Numériques aux Agressions Hyper-Fréquences, 2006.

E. Lamoureux, O. Maurice, L. Saissi, and E. Sicard, A new test method for integrated circuit susceptibility to microwave aggressions, 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pp.113-117, 2005.

J. J. Laurin, S. G. Zaky, and K. G. Balmain, EMI-induced failures in crystal oscillators, IEEE Transactions on Electromagnetic Compatibility, vol.33, issue.4, 1991.
DOI : 10.1109/15.99115

K. F. Lee and W. Chen, Advances in Microstrip and Printed Antennas, 1997.

J. L. Levant, M. Ramdani, R. Perdriau, and M. Drissi, EMC Assessment at Chip and PCB Level: Use of the ICEM Model for Jitter Analysis in an Integrated PLL, IEEE Transactions on Electromagnetic Compatibility, vol.49, issue.1, pp.182-191, 2006.
DOI : 10.1109/TEMC.2006.888181
URL : https://hal.archives-ouvertes.fr/hal-00438288

V. H. Macdonald, The cellular concept, Bell Syst. Tech. J, vol.58, pp.15-41, 1979.

T. Maloney and N. Khurana, Transmission line pulsing techniques for circuit modeling of esd phenomena, Proceedings of the EOS/ESD Symposium, pp.49-54, 1985.

O. P. Mandhana, Modeling, Analysis and Design of Resonant Free Power Distribution Network for Modern Microprocessor Systems, IEEE Transactions on Advanced Packaging, vol.27, issue.1, pp.107-120, 2004.
DOI : 10.1109/TADVP.2004.825376

O. Maurice, Introduction à la compatibilité électromagnétique des systèmes embarqués et des télécommunications, 2005.

P. Miller and M. O-'hara, Comparison of automative unit emc test techniques, IEE : colloquia : Electromagnetic Compatibility for Automative Electronics, 1999.

L. Musso, V. Berat, F. Canavero, and B. Demoulin, Etude pour l'utilisation d'une chambre réverbérante dans le domaine automobile, 11ème Colloque International de Compatibilité Electromagnétique, pp.93-96, 2002.

H. Onomae, H. Ito, T. Ishaida, T. Eguchi, and Y. Nagasawa, Electromagnetic field characterization of injections probes, IEEE International Symposium on Electromagnetic Compatibility, pp.55-58, 1999.

B. Ottersten and P. Zetterberg, The spectrum efficiency of a base station antenna array system for spatially selective transmission, IEEE Transactions on Vehicular Technology, vol.44, issue.3, pp.651-660, 1995.

J. C. Parker, Via coupling within parallel rectangular planes, IEEE Transactions on Electromagnetic Compatibility, vol.39, issue.1, pp.17-23, 1997.
DOI : 10.1109/15.554691

C. R. Paul, Introduction to Electromagnetic Compatibility, 2006.

R. Clayton, S. A. Paul, and . Nasar, Introduction to Electromagnetic Fields, 1987.

R. Perdriau, Analysis and modeling of electromagnetic interference on chip level, part i : Influence of memory architectures on emc compliance, M2.2 milestone report, MEDEA+ A509 : MESDIE, 2002.

R. Perdriau, Méthodologie de prédiction des niveaux d'émission conduite dans les circuits intégrés, à l'aide de VHDL-AMS, Thèse Mars, 2004.

D. Pommerenke, K. Jayong, and G. Muchadze, Finding the root cause of an esd upset event, 2006.

M. Popovich, E. Friedman, M. Sotman, A. Kolodny, and R. Secareanu, Maximum effective distance of on-chip decoupling capacitors in power distribution grids, Proceedings of the 16th ACM Great Lakes symposium on VLSI , GLSVLSI '06, pp.173-179, 2006.
DOI : 10.1145/1127908.1127951

A. Randazzo, M. A. Abou-khousa, M. Pastorino, and R. Zoughi, High resolution near-field multiple target detection and localization using support vector machines, pp.261-266, 2007.

R. F. Heoberling and M. V. Fazio, Advances in virtual cathode microwave sources, IEEE Transactions on Electromagnetic Compatibility, vol.34, issue.3, p.252, 1992.
DOI : 10.1109/15.155837

R. Rossi, G. Torelli, and V. Liberali, Model and verification of triple-well shielding on substrate noise in mixed-signal CMOS ICs, ESSCIRC 2004, 29th European Solid-State Circuits Conference (IEEE Cat. No.03EX705), pp.643-646, 2003.
DOI : 10.1109/ESSCIRC.2003.1257217

H. W. Shim and T. H. Hubing, A Closed-Form Expression for Estimating Radiated Emissions From the Power Planes in a Populated Printed Circuit Board, IEEE Transactions on Electromagnetic Compatibility, vol.48, issue.1, pp.74-81, 2006.
DOI : 10.1109/TEMC.2005.861377

E. Sicard, Le Couplage Diaphonique dans les Circuits CMOS Submicroniques. Habilitation à diriger des recherches, INSA de Toulouse, 1998.

E. Sicard, A. Boyer, and A. Tankielun, On the prediction of nezr-field microcontroller emission, IEEE International Symposium on Electromagnetic Compatibility, 2005.

K. P. Slattery, J. W. Neal, and W. Cui, Near-field measurements of VLSI devices, IEEE Transactions on Electromagnetic Compatibility, vol.41, issue.4, 1999.
DOI : 10.1109/15.809825

C. Emc and . Cispr12, Véhicules, bateaux et engins entraînés par des moteurs à combustion interne -caractéristiques de perturbation radioélectrique -limites et méthodes de mesure pour la protection des récepteurs à l'exception de ceux installés dans les véhicules/bateaux/engins eux-mêmes ou des véhicules/bateaux/engins proches, 2001.

I. Emc and T. Force, IEC61967-4 : Integrated circuits -measurement of conducted emissions, 1?/150? method, 2000.

I. Emc and T. Force, IEC62014-3 : Models of integrated circuits for emi behavioral simulation, 2000.

I. Emc and T. Force, IEC61000-4-2 : Testing and measurement techniques -electrostatic discharge immunity test, IEC, 2001.

I. Emc and T. Force, IEC62132-3 : Direct RF power injection to measure the immunity against conducted RF-disturbances of integrated circuits up to 1 GHz, IEC, 2001.

I. Emc and T. Force, IEC62132 : Integrated circuits -measurement of electromagnetic immunity, 10 khz to 400 mhz -bulk current injection (bci) method, IEC, 2001.

I. Emc and T. Force, IEC61967-5 : Integrated circuits -measurement of electromagnetic emissions, 150 khz to 1 ghz -part 5 : Measurement of conducted emissions -workbench faraday cage method, 2003.

I. Emc and T. Force, IEC61000-4-4 : Electrical fast transient/burst immunity test, IEC, 2004.

I. Emc and T. Force, IEC61967-2 : Direct RF integrated circuits -measurement of electromagnetic emissions, 150 khz to 1 ghz -part 2 : Measurement of radiated emissions -tem cell and wideband tem cell method, IEC, 2005.

I. Emc and T. Force, IEC61967-3 : Integrated circuits -measurement of electromagnetic emissions 150 khz to 1 ghz -part 3 : Measurement of radiated emissions, surface scan method?, IEC, 2005.

I. Emc and T. Force, IEC62132-3 : Integrated circuits -measurement of electromagnetic immunity, 150 khz to 1 ghz -bulk current injection (bci) method. Draft technical report, IEC, 2006.

I. Emc and T. Force, IEC62132-4 : Integrated circuits -measurement of electromagnetic immunity 150 khz to 1 ghz -part 4 : Direct rf power injection method, IEC, 2006.

I. Emc and T. Force, IEC62215 : Characterization of integrated circuits transient electromagnetic immunity, IEC, 2006.

I. Emc and T. Force, IEC61967-2 : Integrated circuits -measurement of electromagnetic emissions, 150 khz to 1 ghz -part 2 : Measurement of radiated emissions -tem cell and wideband tem cell method, IEC, 2007.

O. Valorge, Bruit d'alimentation et couplage par le substrat dans les circuits mixtes, 2006.

B. Vrignon, Caractérisation et optimisation de l'émission électromagnetique de système sur puce, 2005.

B. Vrignon, S. B. Dhia, E. Lamoureux, and E. Sicard, Characterization and Modeling of Parasitic Emission in Deep Submicron CMOS, IEEE Transactions on Electromagnetic Compatibility, vol.47, issue.2, pp.382-387, 2005.
DOI : 10.1109/TEMC.2005.847408

B. Vrignon, S. B. Dhia, E. Sicard, and E. Lamoureux, Mesure et prédiction de l'emission electromagnetique d'un circuit intégré, EMC Compo2004, 2004.

A. Z. Wang, On-chip ESD protection for integrated circuits, 2002.

K. Wang, D. Pommerenke, J. M. Zhang, and R. Chundru, The PCB level ESD immunity study by using 3 dimension ESD scan system, 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559), 2004.
DOI : 10.1109/ISEMC.2004.1349812

T. Williams, EMC for product designer, 1999.

M. Xu and T. H. Hubing, Estimating the power bus impedance of printed circuit boards with embedded capacitance, IEEE Transactions on Advanced Packaging, vol.25, issue.5, pp.424-432, 2002.

M. Xu and T. H. Hubing, Application of the cavity model to lossy power-return plane structures in printed circuit boards, IEEE Transactions on Advanced Packaging, vol.26, issue.1, pp.73-80, 2003.

N. *. Un-exemple-du-netlist-du-coeur and . Netlist-eldo-pour-simuler-la-partie-pad_norm, OPTION EPS=1e-8 be .OPTION NOASCII NOTRC NOMOD .OPTION MSGNODE=0 .OPTION NOWARN=240 NOWARN=701 .temp 25 .include CORNERS/spice.lib .include CORNERS/hcmos8d.typ .lib key=diode CORNERS/diode.lib diode_typ .include pad_norm_sans_capteur.spi .include pad_dglob

. Ainsi, le netlist du circuit sous test inclus couplage entre les rails d'alimentations

?. Ali-alaeldine, R. Perdriau, M. Ramdani, E. Sicard, and M. Drissi, Modeling of the substrate coupling path for direct power injection in integrated circuits, 2008 IEEE International Symposium on Electromagnetic Compatibility, pp.18-22, 2008.
DOI : 10.1109/ISEMC.2008.4652068

?. Jérôme-cordi, A. Alaeldine, J. Levant, R. Perdriau, M. Ramdani et al., Automated Extraction of the Passive Distribution Network of an Integrated Circuit for the Assessment of Conducted Electromagnetic Emission, EMC EMC Week in Singapore, pp.19-23, 2008.

?. Ali-alaeldine, N. Lacrampe, F. Caignet, R. Perdriau, M. Bafleur et al., Efficiency of Embedded On-Chip EMI Protections to Continuous Harmonic and Fast Transient Pulses with Respect to Substrate Injection, 2007 IEEE International Symposium on Electromagnetic Compatibility, pp.8-13, 2007.
DOI : 10.1109/ISEMC.2007.161

?. Nicolas-lacrampe, A. Alaeldine, F. Caignet, R. Perdriau, M. Bafleur et al., Investigation on ESD Transient Immunity of Integrated Circuit, IEEE EMC 2007 International Symposium on Electromagnetic Compatibility, pp.8-13, 2007.

?. Ali-alaeldine, O. Maurice, J. Cordi, R. Perdriau, and M. Ramdani, EMC-Oriented Analysis of Electric Near-Field in High-Frequency, ICONIC, vol.2007, pp.27-29, 2007.

?. Ali-alaeldine, A. Boyer, R. Perdriau, M. Ramdani, and E. Sicard, A Near-Field Injection Model for Susceptibility Prediction in Integrated Circuits, ICONIC, vol.2007, pp.27-29, 2007.

?. Ali-alaeldine, A. Boyer, R. Perdriau, M. Ramdani, E. Sicard et al., A Near Field Injection Model Including Power Losses for Susceptibility Prediction in ICs, EMC Europe Workshop, pp.14-15, 2007.

?. Ali-alaeldine, J. Cordi, R. Perdriau, M. Ramdani, and J. Levant, Predicting the immunity of integrated circuits through measurement methods and simulation models, 2007 18th International Zurich Symposium on Electromagnetic Compatibility, pp.25-27, 2007.
DOI : 10.1109/EMCZUR.2007.4388200

?. Ali-alaeldine, R. Perdriau, M. Ramdani, and M. Drissi, A Direct Power Injection Model for Immunity Prediction in Integrated Circuits, IEEE Transactions on Electromagnetic Compatibility, vol.50, issue.1, pp.4-6, 2006.
DOI : 10.1109/TEMC.2007.911920

?. Mohamed-ramdani, R. Perdriau, A. Alaeldine, and E. Sicard, Immunity to RF in Integrated Circuits, 2006.

?. Mohamed-ramdani, A. Alaeldine, and R. Perdriau, Power Modeling for Susceptibility Prediction in ICs, EMC Europe, 2006.

?. Ali-alaeldine, T. Ordas, R. Perdriau, P. Maurine, M. Ramdani et al., Etude de l'effet du boîtier sur l'immunité en champ proche des circuits intégrés, Articles dans des conférences francophones (3), pp.6-2009, 2009.

?. Ali-alaeldine, R. Perdriau, M. Ramdani, and M. Drissi, Modélisation de l'immunité des circuits intégrés en champ proche, 2006.

?. Ali-alaeldine, A. Boyer, R. Perdriau, M. Ramdani, E. Sicard et al., A Near Field Injection Model Including Power Losses for Susceptibility Prediction in Integrated Circuits, pp.14-16, 2007.

?. A. Haidar, N. Elahdab, H. Shirahama, and A. Alaeldine, Multiple-Valued Logic Neuron Clock Transformers, Articles en coopération dans des conférences (3) The 23rd International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC2008), pp.6-9, 2008.

?. A. Haidar, F. Al-rifai, A. Alaeldine, and M. Bernard, A novel neural network half adder, Proceedings. 2004 International Conference on Information and Communication Technologies: From Theory to Applications, 2004., pp.7-11, 2008.
DOI : 10.1109/ICTTA.2004.1307814

?. V. Verma, S. Merhi, M. Tormos, A. Alaeldine, R. Perdriau et al., Towards an EMI immunity analysis for an embedded analog-to-digital converter, 2emc IEEE symposium on embedded EMC, pp.18-19, 2007.
URL : https://hal.archives-ouvertes.fr/hal-00239435