Mesure de l'adhérence et des propriétés mécaniques de couches minces par des essais dérivés de la nanoindentation : application à la microélectronique et au biomédical

Abstract : Three different tests, developed on a nanoindentation apparatus, are used for the mechanical characterization of various thin films: Cu, SiN and SiCN films for microelectronics (interconnection) and polymer films for biomedicals (drug eluting stent). Basic nanoindentation test is used for the measurement of mechanical properties of 500 nm Cu thin films deposited on Ta/TaN/SiO2/Si substrate. The experimental results and the 2D finite element calculations show the inadequacy of the Oliver and Pharr analysis for this kind of materials, because of the growth of a pile-up around the contact area. A work-hardening effect also induces a huge increase of the hardness values during penetration. This work-hardening effect is influenced by annealing temperature of the Cu films.Mechanical adhesion of Cu films was then measured by Cross Sectional Nanoindentation (CSN). The experimental procedure and the mechanical interpretation of this test were strongly improved. Results show the influence of annealing temperature and substrate patterning on Cu adhesion. A 3D numerical simulation is developed to calculate deformation energy spent during film delamination.A micro-scratch test was employed for adhesion measurement of SiN and SiCN thin films (40 to 120 nm) deposited on Cu/Ta/TaN/SiO2/Si substrate. The influence of the film thickness and the wear of the indenter tip on the critical force are studied. Finite element calculations show that the delamination at critical force is due to high stress in the SiCN film and at SiCN/Cu interface. Micro-scratch test was then applied to polymer films (500 to 1000 nm) deposited on stainless steel. The results show the enhancement of the adhesion when an electro-grafted sub-layer is used to promote steel/polymer interface.
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  • HAL Id : tel-00289845, version 1

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Sébastien Roy. Mesure de l'adhérence et des propriétés mécaniques de couches minces par des essais dérivés de la nanoindentation : application à la microélectronique et au biomédical. Mécanique [physics.med-ph]. École Nationale Supérieure des Mines de Paris, 2008. Français. ⟨NNT : 2008ENMP1535⟩. ⟨tel-00289845⟩

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