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Évolution morphologique par diffusion de surface et application à l'étude du démouillage de films minces solides.

Abstract : This present work is about the morphological evolution of a solid material considering the diffusion
of the atoms at the surface. This issue mainly deals with the dewetting and the agglomeration of thin films. It is encountered in microelectronics, but it is generic as it is also observed in metallurgy and microtechnology.

The first part presents, by experiments and simulations, the agglomeration of non-strained thin silicon films on silicon dioxide. The triple line equilibrium between the film, the substrate and the environmental gas as well as anisotropic effects appear to be governing parameters of the morphological evolution of solid films.

In the second part, on the strained thin films, the agglomeration following the dislocation directions has been experimentally observed, and the dynamic of such surfaces has been numerically studied to show the non-linearity due to elastic stress. A new equilibrium state, where the strained film is nor plan, neither agglomerate, has been evidenced.

The third part opens the issue of surface diffusion on other systems than thin films, such as nanowires and microcavities where particular geometry may be obtained, allowing new processing methods and innovating devices.
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https://tel.archives-ouvertes.fr/tel-00188296
Contributor : Erwan Dornel <>
Submitted on : Friday, November 16, 2007 - 11:40:52 AM
Last modification on : Friday, October 23, 2020 - 4:41:12 PM
Long-term archiving on: : Monday, April 12, 2010 - 2:25:49 AM

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  • HAL Id : tel-00188296, version 1

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Erwan Dornel. Évolution morphologique par diffusion de surface et application à l'étude du démouillage de films minces solides.. Matière Condensée [cond-mat]. Université Joseph-Fourier - Grenoble I, 2007. Français. ⟨tel-00188296⟩

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