C. Gillot, A. Tanaka, M. Mori, and H. Inoue, Etude et réalisation d'une fonction interrupteur en technologie hybride à haute intégration Thèse de doctorat de l'INPG, septembre 3300 High power IGBT modules with high reliability for traction applications, pp.191-199, 1997.

P. Merle, Une politique pour les composants de puissance?celle de Gircep, lettre du club CRIN Electronique de Puissance, 2000.

C. Perret, Réalisation et optimisation de refroidisseurs à microcanaux en technologie silicium, Thèse de doctorat de l'INPG, 2001.

L. Meysenc, Etude des micro-echangeurs intégrés pour le refroidissement des semiconducteurs de puissance, Thèse de doctorat de l'INPG, 1998.

S. Raël, D. B. Tuckerman, and R. F. Pease, Conception de micro-échangeurs dédiés au refroidissement des composants d'électronique de puissance Rapport post-doctorat de LEG High-Performance Heat Sinking for VLSI, IEEE Electron Devices Letters, vol.8, issue.2, pp.126-129, 1981.

J. F. Sacadura, Initiation aux transferts thermiques, 1993.

B. Eyglunent, Manuel de thermique : théorie et pratique, Hermès, 1997.

C. Gillot, Etude et réalisation d'une fonction interrupteur en technologie hybride à haute intégration, Thèse de doctorat de l'INPG, 2000.

R. Hopkins, A. Faghri, and D. Khrustalev, Flat Miniature Heat Pipes With Micro Capillary Grooves, Journal of Heat Transfer, vol.121, issue.1, pp.102-109, 1999.
DOI : 10.1115/1.2825922

Y. Cao, M. Gao, J. E. Beam, and B. Donovan, Experiments and Analyses of Flat Miniature Heat Pipes, Journal of Thermophysics and Heat Transfer, vol.11, issue.2, pp.158-164, 1997.
DOI : 10.2514/2.6247

T. P. Cotter, Principles and Prospects of Micro Heat Pipes, Proc. 5 th International Heat Pipe Conf, pp.328-335, 1984.

A. Faghri and D. Khrustalev, Thermal analysis of Micro Heat Pipe, ASME HTD, vol.236, pp.19-30, 1993.

G. P. Peterson, A. B. Duncan, A. S. Ahmed, A. K. Mallik, and M. H. Weichold, Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers, Micromechanical Sensors, Actuators and Systems, pp.341-348, 1984.
DOI : 10.1115/1.2910747

A. Faghri, Heat Pipe Science and Technology, 1995.

P. D. Dunn and D. A. Reay, The heat pipe, Physics in Technology, vol.4, issue.3, 1994.
DOI : 10.1088/0305-4624/4/3/I01

J. S. Suh, R. Greif, and C. P. Grigoropoulos, Friction in micro-channel flows of a liquid and vapor in trapezoidal and sinusoidal grooves, International Journal of Heat and Mass Transfer, vol.44, issue.16, pp.3103-3109, 2001.
DOI : 10.1016/S0017-9310(00)00331-8

G. E. Schneider and R. Devos, Nondimensional analysis for the heat transport capability of axially-grooved heat pipes including liquid/vapor interaction, AIAA 18 th aerospace sciences meeting, 1980.

V. Sartre, M. C. Zaghdoudi, and M. Lallemand, Effect of interfacial phenomena on evaporative heat transfer in micro heat pipes, International Journal of Thermal Sciences, vol.39, issue.4, pp.498-504, 2000.
DOI : 10.1016/S1290-0729(00)00205-2

R. Hopkins, A. Faghri, and D. Khrustalev, Flat Miniature Heat Pipes With Micro Capillary Grooves, Journal of Heat Transfer, vol.121, issue.1, pp.102-109, 1999.
DOI : 10.1115/1.2825922

J. P. Longtin, B. Badran, and F. M. Gerner, A One-Dimensional Model of a Micro Heat Pipe During Steady-State Operation, Journal of Heat Transfer, vol.116, issue.3, pp.709-715, 1994.
DOI : 10.1115/1.2910926

J. P. Collier, Convective boiling and condensation, 1972.

H. Schneider, M. Yoshida, and M. Groll, Investigation of intercinnected mini heat pipe arrays for micro electronics cooling, 11 th International Heat Pipe Conference, pp.1-6, 1999.

M. Gao, Y. Cao, K. Jones, W. Zampino, and M. A. , Ceramic Miniature Heat Pipes and Liquid Charging Methods, Proceedings of the ASME Heat Transfer Division, pp.429-434, 2000.
DOI : 10.2172/7792

S. Launay, Performances thermqiues de microaloducs usinés dans du silicium

G. P. Peterson, A. B. Duncan, and M. H. Weichold, Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers, Journal of Heat Transfer, vol.115, issue.3, pp.751-756, 1993.
DOI : 10.1115/1.2910747

A. K. Mallik, G. P. Peterson, and M. H. Weichold, Fabrication of vapor-deposited micro heat pipe arrays as an integral part of semiconductor devices, Journal of Microelectromechanical Systems, vol.4, issue.3, 1995.
DOI : 10.1109/84.465123

R. K. Shah and M. S. Bhatti, Laminar convective heat transfer in ducts " , Handbook of single-phase convective heat transfer, 1987.

G. E. Schneider and R. Devos, Nondimensional analysis for the heat transport capability of axially-grooved heat pipes including liquid/vapor interaction, AIAA 18 th aerospace sciences meeting, 1980.

F. S. Shih, Laminar flow in axisymmetric conduits bya rationnal approach, Canadian Journal of Chemical Engineering, vol.145, pp.285-845, 1967.

G. E. Schneider, M. M. Yovanovich, and V. A. Wehrle, Thermal analysis of trapezoidal grooved heat pipe evaporator walls, 11th Thermophysics Conference, pp.69-83, 1977.
DOI : 10.2514/6.1976-481

R. Hopkins, A. Faghri, and D. Khrustalev, Flat Miniature Heat Pipes With Micro Capillary Grooves, Journal of Heat Transfer, vol.121, issue.1, pp.102-109, 1999.
DOI : 10.1115/1.2825922

M. Gao, Y. Cao, J. E. Beam, and B. Donovan, Structural Optimization of Axially Grooved Flat Miniature Heat Pipes, Journal of Enhanced Heat Transfer, vol.7, issue.6, pp.153-157, 1997.
DOI : 10.1615/JEnhHeatTransf.v7.i6.10

P. Leturk, A new approach to thermal analysis of power devices, IEEE Transactions on Electron Devices, vol.34, issue.5, pp.1147-1156, 1987.
DOI : 10.1109/T-ED.1987.23057

M. Ashegi and K. E. Goodson, Thermal Conductivity Model for Nearly Pure and Doped Thin Silicon Layers at High Temperature, ASME International Mechanical Engineering Congress and R&D Exposition, pp.1-7, 2003.

Y. Avenas, Etude et réalisation de caloducs plats miniatures pour l'intégration en électronique de puissance, Thèse de doctorat de l'INPG, 2002.

D. R. Adkins, D. S. Shen, D. W. Palmer, and M. R. Tuck, Silicon heat pipes for cooling electronics, st Annual Spacecraft Thermal Control Symposium, 1994.

Y. Avenas, M. Ivanova, C. Schaeffer, R. Perret, and J. L. Sanchez, Étude et réalisation de caloducs à réseau capillaire à picots carrés pour le refroidissement en électronique, pp.3-6, 2003.

D. R. Adkins, D. S. Shen, D. W. Palmer, M. R. Tuck, and G. Grafe, Heat pipe with embedded wick structure, Sandia Corporation, pp.947-193, 1999.

D. S. Shen, R. T. Mitchell, D. Dobranich, D. R. Adkins, and M. R. Tuck, Micro heat spreader enhanced heat transfer in MCMs, IEEE MCMC'95 Conference, pp.189-194, 1995.

D. A. Benson, R. T. Mitchell, M. R. Tuck, D. R. Adkins, and D. W. Palmer, Micro-machined heat pipes in silicon MCM substrates, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893), pp.127-129, 1996.
DOI : 10.1109/MCMC.1996.510782

D. A. Benson, R. T. Mitchell, M. R. Tuck, D. W. Palmer, and G. P. Peterson, Ultrahighcapacity micromachined heat spreaders, pp.21-30, 1998.

S. W. Kang, S. H. Tsai, and C. H. , Fabrication and test of radial grooved micro heat pipes, Applied Thermal Engineering, vol.22, issue.14, pp.1559-1568, 2002.
DOI : 10.1016/S1359-4311(02)00085-6

G. Pandraud, V. Sartre, F. Michard, and M. Lallemand, Modelling of heat spreaders micromachined in silicon substrates for electronic cooling, pp.130-135, 2001.

R. Williams and A. M. Goodman, Wetting of thin layers of SiO 2 by water, Applied Physics Letters, vol.25, issue.10, 1974.

M. A. Zampino, K. Jones, and W. , Substrate embedded heat pipe compatible with cofire processing, Proc. Int. Symp. Of Microelectronics, IMAPS

M. A. Zampino, Embedded heat pipes in cofired ceramic substrates for enhanced thermal management of electronics, Dissertation FIU, 2002.

J. W. Kinzy, Y. Liu, and M. Gao, Micro heat pipes in low temperature cofire ceramic (LTCC) substrates, IEEE Transaction on Components and Packaging Technologies, vol.26, issue.1, 2003.

J. W. Kinzy, Y. Liu, and M. Gao, Micro heat pipes in low temperature cofire ceramic (LTCC) substrates, Inter Society Conference on Thermal Phenomena, 2002.

K. Exel and J. Schulz-harder, Water cooled DBC direct bonded copper substrates, IECON '98. Proceedings of the 24th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.98CH36200)
DOI : 10.1109/IECON.1998.724090

J. Schulz-harder, Direct bonded copper substrates for semiconductor power devices

M. Ivanova, . Schaeffer-ch, Y. Avenas, J. B. Dezord, and A. Rogg, Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for the Cooling of Power Electronics Packaging, IEEE PESC, pp.12-16, 2005.

E. Fournier, J. Dezord, F. Michard, A. Laï, M. Ivanova et al., On-ground evaluation and preparation of in-orbit experiments of 3 different miniature heat pipe technologies for space applications, 2005.